Updated on 2023/10/02

写真a

 
UEDA, Toshitsugu
 
Affiliation
Faculty of Science and Engineering
Job title
Professor Emeritus
Degree
Doctor of Engeneering ( Tokyou Tnstitute of Technology )
Homepage URL
http://www.waseda.jp/sem-uedaweb/

Research Experience

  • 2003
    -
    　

    - Professor, Graduate School of IPS, Waseda

  • 1971
    -
    2003

    General Manager, R&D Department, Tokogawa

  • 2002
    -
    　

    - GHz帯域用イーサネットを目指した600MHz帯水晶VCXOの

  • 1994
    -
    2002

    チューナブルレーザーによる1ppb不純物ガスの高感度計測、

  • 1993
    -
    　

    高次脳機能測定のための多チャンネルSQUIDによるMSI

  • 1991
    -
    1993

    次期支援戦闘機FS-X（F-16の国産化）コックピットの

  • 1990
    -
    1991

    高速光技術と水晶マイクロマシニング技術を応用した

  • 1990
    -
    　

    半導体レーザーの波長安定化・狭帯域化・可変化の研究

  • 1985
    -
    1990

    機械振動子を利用した力センタの開発

  • 1978
    -
    1985

    渦電流、磁歪超音波を利用した精密位置検出器の研究開発

  • 1971
    -
    1978

    アナログ電子回路の研究を中心に行い、ディジタル電圧計、

  • 　
    　
    　

    基盤技術研究

  • 　
    　
    　

    数十nmまでのパーティクル計測の研究開発

  • 　
    　
    　

    シールド等の研究開発

  • 　
    　
    　

    （Magnetic Resonance Imaging）との協調性、超伝導

  • 　
    　
    　

    （Magnetic Source Imaging）の応用と機能MRI

  • 　
    　
    　

    システム開発、企画

  • 　
    　
    　

    （液晶ディスプレイ）化の開発と対応したナビゲーション

  • 　
    　
    　

    計装、特にヘッドダウンディスプレイのグラスコックピット

  • 　
    　
    　

    高速・高周波LSI測定技術の研究開発

  • 　
    　
    　

    データアンプ等の高精度高速増幅器の研究開発

  • 　
    　
    　

    University

  • 　
    　
    　

    Electric Corporation

▼display all

Education Background

  • 　
    -
    1969

    Shinshu University   Faculty of Engineering  

  • 　
    -
    1969

    Shinshu University   Faculty of Engineering   Electrical Engineering  

Committee Memberships

  • 2000
    -
    2004

    The Institute of Electrical Engineers of Japan  Society Officer

Professional Memberships

  • 　
    　
    　

    計測自動制御学会

  • 　
    　
    　

    電気学会

  • 　
    　
    　

    The Society of Insrument and Control

  • 　
    　
    　

    The Institute of Electrical Engineers of Japan

Research Areas

  • Electron device and electronic equipment / Nano/micro-systems / Nanomaterials / Biomaterials / Biomedical engineering

Research Interests

  • 力

  • 変位

  • 圧力

  • 温度

  • LIBS レーザーブレイクダウン

  • 分光

  • チューナブルレーザー

  • パルスレーザー

  • VCXO

  • ナノ加工

  • 水晶

  • 生体情報・計測

  • 医用光・熱工学

  • マイクロファブリケーション

  • マイクロメカニクス

  • 波動利用工学

  • センシング

  • レーザー技術

  • 水晶

  • マイクロ・ナノマシニング

  • センサ

  • Laser Technology

  • Quartz Crystal

  • Micro/Nano-machining

  • sensor

▼display all

Awards

  • 計測自動制御学会論文賞

    1994  

  • Award from Society of Instrument and Control Engineer of Japan

    1994  

  • 計測自動制御学会論文賞

    1987  

  • 発明協会

    1987  

  • Award from Society of Instrument and Control Engineer of Japan

    1987  

  • Japan Institute of Invention and Inovation

    1987  

  • 発明協会

    1985  

  • Japan Institute of Invention and Inovation

    1985  

▼display all

 

Papers

  • Endoscopic System Based on Intraoral Camera and Image Processing.

    Masataka Fujimoto, Masahiro Okuda, Shinji Yoshii, Satoshi Ikezawa, Toshitsugu Ueda, Herve Tassery, Frédéric J. G. Cuisinier, Chiaki Kitamura

    IEEE Trans. Biomed. Engineering   66 ( 4 ) 1026 - 1033  2019  [Refereed]

    DOI PubMed

  • Study of novel dental endoscopic system with intraoral camera and image probe for the observation of root canal

    Masataka Fujimoto, Masahiro Okuda, Shinji Yoshii, Satoshi Ikezawa, Toshitsugu Ueda, Chiaki Kitamura

    IFEA 11th World Endodontic Congress    2018.10  [Refereed]

  • Tooth Caries Detection using Laser-induced Breakdown Spectroscopy

    Satoshi IKEZAWA, Toshitsugu UEDA

    2018 International Workshop on MEMS for Lifescience, Healthcare and Medicine     12 - 13  2018.07

  • 北九州市における医歯工連携の取り組みについて

    藤元 政考, 奥田 正浩, 吉居 慎二, 池沢 聡, 植田 敏嗣, 青木 隆敏, 永原 正章, 北村 知昭

    電子情報通信学会招待講演   A1-3-2  2018.03

  • Sensitivity of improvement of quartz hydrogen sensor with novel designed heater

    Hiroshi Oigawa, Mizuho Shimojima, Tooru Tsuno, Fusao Kohsaka, Toshitsugu Ueda

    Proceedings of the International Conference on Sensing Technology, ICST   2017-   1 - 4  2018.02  [Refereed]

    　View Summary

    Catalytic combustion hydrogen gas sensors using quartz resonators have been developed to detect hydrogen gas leakage. In order to improve stability of its sensitivity, Au thin film was studied as a non-catalysis heater material. Around 50 Ω Au heaters, which is relatively low resistance value, were designed to be driven with single-supply op-amp. As a result of evaluating using the prototype sensor, the heaters with linear TCR same great as a Pt thin film were obtained. By controlling the temperature with the analog circuit, hydrogen sensitivity with high linearity was confirmed. As result, the effectiveness of the Au thin film heater was demonstrated.

    DOI

  • Optimal design of support for planoconvex quartz resonator

    Jing Ji, Meng Zhao, Hiroshi Oigawa, Toshitsugu Ueda

    Sensors and Materials   30 ( 5 ) 1063 - 1071  2018  [Refereed]

    　View Summary

    In this paper, we report the optimal design of a support for a fundamental planoconvex ATcut quartz resonator fabricated using our newly developed etching process. We established a three-dimensional finite element model and carried out eigen-frequency analysis. To describe quantitatively the energy trapping performance of the resonator, we introduced a parameter called the energy trapping rate, which is defined by the ratio of the vibration energy inside to that outside of the electrode region. Two types of our new designs were evaluated in this work, and the optimal one for providing a large energy-trapping rate was determined. On the basis of the calculated results, we fabricated resonators and measured their Q-factors. The calculated and experimental results show an improvement in the efficiency of resonator performance. High Q-factors were also obtained.

    DOI

  • Expansion of hull method to 3-dimensional crystal anisotropic etching simulation

    Meng Zhao, Jing Ji, Toshitsugu Ueda

    Sensors and Materials   30 ( 5 ) 1053 - 1061  2018  [Refereed]

    　View Summary

    We present here a new approach to simulating three-dimensional (3D) vertex etching, which is applicable to quartz crystals and other crystals. In this paper, we describe the theoretical method behind this approach and give details regarding processing the vertex, processing the edges, distinguishing four types of vertexes, and determining the etching depth of each vertex point.

    DOI

  • Stable heating technology for catalytic combustion hydrogen gas sensor using quartz resonators

    Hiroshi Oigawa, Mizuho Shimojima, Tooru Tsuno, Toshitsugu Ueda

    Sensors and Materials   30 ( 5 ) 1103 - 1114  2018  [Refereed]

    　View Summary

    In this paper, we focus on heating technologies for gas sensors. To discuss the requirements of heating accuracy of the sensor quantitatively, the effect of temperature error on the sensitivity of the sensor was evaluated. A Au thin film was used as a catalytically inactive heater for the sensor. The design and fabrication of this novel sensor with a Au thin-film heater is discussed. To stabilize the properties of the heater, the effect of annealing on the resistivity and temperature coefficient of resistance of the heater at 120 ? was verified by experiment. Additionally, a heater control circuit using op-amps was designed. Using the controller, accurate heating with a temperature error within 0.16 ? was obtained. As a result, constant sensitivity in a hydrogen gas concentration range of 0-2 vol.% was provided, and the ability to detect a concentration of 0.01 vol.% was demonstrated.

    DOI

  • Prototype of dental endoscope for root canal and applying the diagnosis

    Masataka Fujimoto, Shinji Yoshii, Tomoaki Kitamura, Satoshi Ikezawa, Toshitsugu Ueda

      25pm4-PS-090  2017.10  [Refereed]

  • Development of microstructure observation system with the combination of root canal endoscopy and commercially available intraoral camera

    FUJIMOTO Masataka, YOSHII Shinji, OKUDA Masahiro, IKEZAWA Satoshi, UEDA Toshitsugu, KITAMURA Chiaki

      147   188  2017.10

  • Development of a Flow Injection Based High Frequency Dual Channel Quartz Crystal Microbalance

    Jinxing Liang, Jing Zhang, Wenxiang Zhou, Toshitsugu Ueda

    SENSORS   17 ( 5 )  2017.05  [Refereed]

    　View Summary

    When the quartz crystal microbalance (QCM) is used in liquid for adsorption or desorption monitoring based bio- or chemical sensing applications, the frequency shift is not only determined by the surface mass change, but also by the change of liquid characteristics, such as density and viscosity, which are greatly affected by the liquid environmental temperature. A monolithic dual-channel QCM is designed and fabricated by arranging two QCM resonators on one single chip for cancelling the fluctuation induced by environmental factors. In actual applications, one QCM works as a specific sensor by modifying with functional membranes and the other acts as a reference, only measuring the liquid property. The dual-channel QCM is designed with an inverted-mesa structure, aiming to realize a high frequency miniaturized chip and suppress the frequency interference between the neighbored QCM resonators. The key problem of dual-channel QCMs is the interference between two channels, which is influenced by the distance of adjacent resonators. The diameter of the reference electrode has been designed into several values in order to find the optimal parameter. Experimental results demonstrated that the two QCMs could vibrate individually and the output frequency stability and drift can be greatly improved with the aid of the reference QCM.

    DOI

  • Development of novel image sensor for root canal observation

    Masataka Fujimoto, Shinji Yoshii, Satoshi Ikezawa, Toshitsugu Ueda, Chiaki Kitamura

    Smart Sensors, Measurement and Instrumentation   22   67 - 85  2017  [Refereed]

    　View Summary

    The development of dental instruments such as dental microscope and cone-beam computed tomography has greatly improved the precision of current dental treatments. However, observation of fractures near the apex collateral of the root canal remains difficult when using these instruments. In this study, we developed two types of probes: an ‘external-irradiation system’ and an ‘internal-irradiation system’. The external-irradiation probe is composed of an image fibre with a diameter of 500 μm and a gradient-index lens (GRIN lens) with the same diameter as the image fibre. The internal-irradiation probe is composed of an image fibre, GRIN lens, and five optical fibres for illumination, with diameters of 300, 250, and 65 μm, respectively. In an observation experiment of the resolution chart using these probes, both probes could observe lines and spaces of 10–100 μm using an external light source. To evaluate resolution, visibility was measured for each image, and higher visibility was observed as the lines and spaces were increased. We attempted to illuminate the observation area with optical fibres inside the probe
    however, it was difficult because of the low intensity of the light. Furthermore, we observed the actual root canal of an extracted tooth. In future, we would like to redesign the GRIN lens and a suitable offset of the optical fibres.

    DOI

  • Photonic Bandgap Fibre Based Gas Sensing: Current Status and Future Possibilities

    J. Pawlat, X. Li, T. Sugiyama, J. Liang, Y. Zimin, L. Zimin, S. Ikezawa, T. Ueda

    Smart Sensors, Measurement and Instrumentation     167 - 183  2017

    DOI

  • Development of an image sensor for dentistry - Fiber connecting technique with the gradient index (GRIN) rod lens

    Masataka Fujimoto, Shinji Yoshii, Satoshi Ikezawa, Toshitsugu Ueda, Chiaki Kitamura

    Solid State Phenomena   260   77 - 84  2017  [Refereed]

    　View Summary

    In dentistry, endodontic treatment becomes necessary when dental caries progresses deep into the tooth and reaches the dental pulp or the periapical tissue. A large part of this treatment is performed without direct observation of the root canals. Previously, we reported a prototype of a dental endoscope. In this study, we attempted to develop a novel image sensor for dental endodontic diagnosis and treatment that allows capturing an image of the fine constructions inside the root canals. Our fabricated probe contains an image fiber, a GRIN lens, and optical fibers as light sources. These materials are encased inside a stainless steel tube to ensure the durability. In previous experiments, we attempted to connect all materials in one step. However, the captured images had deviations along the center axis between the image fiber and GRIN lens. To solve this problem, we considered a new, two-step method for connecting the two materials. In this method, an image fiber and a GRIN lens with the same diameter were placed on stages capable of three-dimensional fine positional adjustments at a resolution of 0.01 mm. The surfaces of the materials were connected under observation through a microscope. An evaluation of the captured images showed that the deviations in the previous images were 22.4 µm along the X-axis and 45.7 µm along the Y-axis. In contrast, the deviations with the new method were 16.7 µm and 8.9 µm along the X-axis and Y-axis, respectively. Therefore, the new method greatly improved precision along each axis. With this method, our fabricated probe could capture and evaluate images more efficiently. We are now trying to fabricate and evaluate a new image sensor.

    DOI

  • Development of the atomic emission spectroscopy system using Helium-Microwave-Induced plasma for fine particles on environmental monitoring

    Satoshi Ikezawa, Jun Yamamoto, Toshitsugu Ueda

    Smart Sensors, Measurement and Instrumentation   23   21 - 37  2017  [Refereed]

    　View Summary

    This chapter describes the elemental analytical technique of the fine particles using atomic emission spectroscopy system for an environmental pollution monitoring. Based on our previous measurement reports, differences of the usage between the laser-induced breakdown spectroscopy (LIBS) system and the helium-microwave-induced plasma-atomic emission spectroscopy (He-MIP-AES) system are explained. Both systems were developed to allow to fulfil the criteria prescribed by the Ministry of Environment, Japan, for measuring the chemical components of particulate matter (PM) by introducing additional original sampling systems. In current environmental monitoring systems, PMs are typically collected on trapping filters placed across Japan and classified as either suspended particulate matter (SPM) or PM2.5 depending on the size. The collected PMs are subsequently analysed with automated measurement instruments such as a piezo balance and with methods such as beta ray attenuation and light scattering. While these measurement methods allow the mass concentration of PMs in the air to be obtained at hourly intervals, the chemical composition of individual particles is analysed with time-intensive laboratory procedures. In contrast, the LIBS and He-MIP-AES measurement system allow the chemical compositions and particle sizes to be measured simultaneously in real time.

    DOI

  • Fabrication of Two Different Probe Architectures for Ultra-Compact Image Sensors for Root Canal Observations

    Masataka Fujimoto, Shinji Yoshii, Satoshi Ikezawa, Toshitsugu Ueda, Chiaki Kitamura

    IEEE SENSORS JOURNAL   16 ( 13 ) 5211 - 5221  2016.07  [Refereed]

    　View Summary

    With the development of dental instruments, such as dental microscopes and cone beam computed tomography, the precision of current dental diagnosis and treatment has greatly improved. However, the observation of deep periodontal pockets, fractures near the root apex, and collaterals of root canals is difficult using these instruments. To solve these problems, we developed two types of micro-image sensors that can be used for the observation of root canals. The first image sensor is an external-irradiation probe that uses an external light source. This probe has high resolution and a wide field of view. The other sensor is an internal-irradiation probe, which can be used to observe an image and transmit the illumination light with a single probe. The external-irradiation probe has an image fiber with a diameter of 600 mu m and a gradient index (GRIN) lens. The internal-irradiation probe has an image fiber with a diameter of 300 mu m, a GRIN lens, and 40 optical fibers with a diameter of 40 mu m each as a light source. Using these probes, we captured the image of a resolution chart; line spaces with the widths of 10-100 mu m were observed using both types of probes. The evaluations of the visibility of the captured image showed higher measurement values than those of commercially available endoscopes. We will apply this ultra-compact image sensor to various fields besides dentistry, such as medical and industrial applications.

    DOI

  • 根幹観察用内視鏡の設計と製作

    藤元 政孝, 吉居 慎二, 池沢 聡, 植田 敏嗣, 北村 知昭

    日本歯科保存学会2016年度春季学術大会(第144回)   B-15-1550  2016.06

  • Application of Industrial Wireless System to Hydrogen Station

    HAYASHI Hisanori, UEDA Toshitsugu

    Transactions of the Society of Instrument and Control Engineers   52 ( 4 ) 234 - 241  2016

    　View Summary

    This paper describes consideration of addition of industrial wireless system to hydrogen gas sensors. Several significant features are proposed and their efficiencies are expressed by finding combination of each unique characteristic. Proposed wireless hydrogen gas sensor system is expected for contribution to increasing safety of hydrogen station and related facilities.

    DOI CiNii

  • Optical-based Diagnostic Technique for Detection of Tooth Caries using Laser-induced Breakdown Spectroscopy

    S. Ikezawa, T. Ueda, M. Fujimoto, S. Yoshii, C. Kitamura

    2016 IEEE SENSORS    2016  [Refereed]

    　View Summary

    A laser-based emission-type diagnostic technique using laser-induced breakdown spectroscopy (LIBS) for the in vivo analysis of tooth enamel is described. The system aims to improve the promptness of laser dental treatment and accuracy of identifying early caries from healthy teeth. Our research group has been developing the LIBS system for various applications. In addition to the research on the LIBS system, a novel microdental endoscope to observe fractures near the root apex has been developed in a recent study. The LIBS system for dentistry presented in this paper is the first attempt to combine the techniques of the microdental endoscope and the spectroscopic measurement from our group. In the LIBS operation, not only the elemental information is obtained, but also the pulse-operated-condensed laser generates microsized plasma on the surface of the materials when it removes trace substances. The combination technique using LIBS with the microdental endoscope allows noncontact dental diagnosis with chemical analysis and dental treatment at the same time.

  • Fabrication and Evaluation of Dental Endoscopic Instruments using Fiber-optic System

    M. Fujimoto, S. Yoshii, C. Kitamura, S. Ikezawa, T. Ueda

    2016 IEEE SENSORS    2016  [Refereed]

    　View Summary

    The entrance of a tooth root canal is very small to the naked eye, and in most cases, dentists operate blindly to perform the treatment using an instrument. Particularly, the observation of fractures near the root apex and collaterals of root canals is difficult even using the latest dental instrument. To solve these problems, we attempted to develop a novel dental endoscope. In this study, we developed micro image sensors that can be used for observation of root canals and evaluation of the image sensor visibility. Previous methods have only single line visibility; however, the new method enables evaluation of the sectional visibility in the screen area. Compared with commercially available image sensors, the new image sensor has more than two times higher sectional visibility. Hence, the most focusing area can be analyzed and the aforementioned problems can be solved to improve image sensors. Moreover, not only the micro image sensors but also other sensors can be evaluated quantitatively using this new method.

  • Design and Evaluation of a dual channel high frequency Quartz Crystal Microbalance

    Jing Zhang, Jinxing Liang, Toshitsugu Ueda

    2016 10TH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY (ICST)    2016  [Refereed]

    　View Summary

    AT-cut Quartz crystal Microbalance (QCM) has been used as a high precision sensor for decades, which could detect the trace mass deposited on the crystal surface. The accuracy of QCM can be achieved ng level. When used as biosensor in liquid, the resonant frequency is not only affected by the mass change, but also by the liquid density and viscosity, which are greatly dependent on the liquid temperature. For minimizing the fluctuation induced by temperature, a novel structure of two QCMs has been fabricated on a single quartz wafer as dual-channel quartz crystal microbalance. One resonator works as biosensor coated with functional membranes and the other works as a reference sensing only on the liquid property.
    The sensitivity of QCM is directly proportional to the square of the fundamental frequency of QCM. With wet etching methods, we can successfully fabricate the dual-channel QCMs with 40MHz, which are merely 5 or 9 MHz for traditional QCM. In the meanwhile, to enhance the mechanical stability an inverted mesa-type structure has been proposed.
    The key problem of dual-channel QCMs is interference between two channels, which is influenced by distance of adjacent resonators. The diameter of reference electrode has been designed into several values to find the optimal parameter. The modification of QCMs structure is proved to be an effective solution to minimize the interference of dual-channel QCM. And the convex design of inverted mesa-type can reduce the coupling between two resonators. Experimental results demonstrated that the two QCMs could vibrate individually and the frequency stability can be greatly improved by using the reference QCM.

  • Optimal Design Work for High-frequency Quartz Resonators

    Jing Ji, Meng Zhao, Toshitsugu Ueda, Satoshi Ikezawa

    2016 10TH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY (ICST)    2016  [Refereed]

    　View Summary

    My research focused on improving the performance of AT-cut high-frequency quartz resonators, which have been used in a wide range of applications including frequency generators, frequency control of telecommunication systems. New research findings about optimal design of AT-cut high-frequency quartz resonators fabricated by newly developed etching process were presented through improving energy trapping and reducing spurious vibration couplings. The simulation and experimental verification were carried out, and the effectiveness of the optimal design was validated. The main optimal design works include five cases.

  • Development of Portable Quartz Crystal Microbalance for Biosensor Applications

    Jinxing Liang, Jing Zhang, Peng Wang, Changchuan Liu, Shi Qiu, Toshitsugu Ueda

    SENSORS AND MATERIALS   28 ( 3 ) 201 - 207  2016  [Refereed]

    　View Summary

    In this work, we report a novel flow-injection-type portable quartz crystal microbalance (QCM) sensor utilizing a high-frequency (higher than 40 MHz) miniaturized QCM chip. The resonator chip is assembled in a novel three-layer flow cell, in which the top and bottom layers are used to fix the spring-pin leading electrodes and the middle layer is used to house the resonator chip. A two-stage operational transconductance-amplifier-(OPA660)-based oscillator circuit is developed to drive the QCM and measure the frequency shift. A low human IgG concentration of 1 ppm has been measured even using the simple physical adsorption antibody immobilization method, which indicates that the developed portable QCM sensor can be used as a biosensor in liquids.

  • Electroplating Technology of Platinum Catalyst for MEMS Hydrogen Gas Sensor

    Hiroshi Oigawa, Satoshi Ikezawa, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   136 ( 12 ) 511 - 514  2016  [Refereed]

    　View Summary

    <p>In this paper, we discuss electroplating method to deposit platinum catalyst called platinum black on the both-side of sensors on a quartz wafer to improve sensitivity of hydrogen sensors using quartz resonators. By increasing current density until the limiting current density, the platinum black films were deposited on the electrodes of sensors in a stable. Under the constant current condition, controllability of film thickness of platinum black by time was confirmed. As a result of comparison to the sputtered platinum thin film catalyst, the platinum black catalyst showed higher catalytic activity.</p>

    DOI CiNii

  • Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer

    Jinxing Liang, Liyuan Zhang, Ling Wang, Yuan Dong, Toshitsugu Ueda

    SENSORS   15 ( 9 ) 22049 - 22059  2015.09  [Refereed]

    　View Summary

    In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz wafers with a thickness of 100 m and 300 m, respectively. The finite element method is used to simulate the vibration mode and optimize the sensing element structure. Taking advantage of self-alignment function of the flip chip bonding process, the two parts were precisely bonded at the desired joint position via AuSn solder. Experimental demonstrations were performed on a maximum scale of 4 x 8 mm(2) chip, and high sensitivity up to 9.55 Hz/g with a DETF resonator and a Q value of 5000 in air was achieved.

    DOI

  • Cesium environmental monitoring system for assaying temporal changes in atomic disintegration products using laser-induced breakdown spectroscopy

    S. Ikezawa, T. Ueda

    Smart Sensors, Measurement and Instrumentation   11   93 - 109  2015  [Refereed]

    　View Summary

    In this work, a new method for real-time in-situ environmental monitoring of measured radioactive elements is presented. Currently, germanium semiconductor detectors are used for the analysis of radioactive materials. Germanium semiconductor detectors exhibit sensitivities much higher than those exhibited by other analytical instrumentation techniques. However, the equipment is lab-based and cannot address the need for on-site monitoring. Moving radioactive samples is strictly legally prohibited for safety reasons. The frequency of use is limited by the facility installation space, workforce supply considerations regarding safety, legal considerations for carrying and storing radioactive samples, and waste disposal methods. The presented method using laser-induced breakdown spectroscopy (LIBS) offers an affordable sensing system that can be applied at point-of-use for environmental analyses to provide an indication of impending problems. The applicable range of conventional LIBS, which has been used only to determine the elemental composition, is expanded to obtain an estimate of the isotope ratio by measuring the variation due to temporal changes in the atomic disintegration products. This method takes full advantage of LIBS, such that no pretreatment of the measured sample is required. In this work, a confirmation test for the LIBS measurement of cesium and barium based on the results of the disintegration of cesium is demonstrated as part of a preliminary survey for developing a monitoring system for actual radioactive materials.

    DOI

  • Development of dental endoscope for root-canal observation Optical design for optimal image acquisition

    M. Fujimoto, S. Yoshii, C. Kitamura, S. Ikezawa, T. Ueda

    2015 9TH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY (ICST)     508 - 513  2015  [Refereed]

    　View Summary

    With the development of dental instruments such as dental microscopes and techniques like cone-beam computed tomography (CBCT), the precision of dental treatment has greatly improved. However, the observation of fractures near the apex collateral of root canals using these instruments remains difficult. In this study, we developed two types of probes that employ external and internal irradiation, respectively. The external-irradiation probe comprises an image fiber and a gradient-index (GRIN) lens, each with a diameter of 500 mu m. The internal-irradiation probe comprises an image fiber 300 mu m in diameter; a GRIN lens 250 mu m in diameter; and five optical fibers for illumination, each 65 mu m in diameter. Both probes observed lines and spaces 10 to 100 mu m in width on a sample when using a light source from the outside. The visibility of the obtained images increased with the width of the lines and spaces. The illumination of the observation area with the optical fibers inside of the probe was difficult because of a lack of light. In this study, we obtained high-resolution pictures of a root canal. In the future, we will re-design the lens to determine a suitable offset for the optical fiber.

  • Development of Helium-microwave-induced Plasma-atomic Emission Spectroscopy System with Two-way Spectroscopic Analysis

    Satoshi Ikezawa, Jun Yamamoto, Toshitsugu Ueda

    2015 9TH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY (ICST)     716 - 721  2015  [Refereed]

    　View Summary

    This paper reports on a helium-microwave-induced plasma-atomic emission spectroscopy (He-MIP-AES) system with two-way spectroscopic analysis that fulfills the criteria prescribed by the Ministry of Environment, Japan, for measuring the chemical components of particulate matter (PM). The He-MIP-AES system is a reconstruction of a commercial particle analyzer system. In current environmental monitoring systems, PMs are typically collected on trapping filters placed across Japan and classified as either suspended particulate matter (SPM) or PM2.5 depending on the size. The collected PMs are subsequently analyzed with automated measurement instruments such as a piezo balance and with methods such as beta ray attenuation and light scattering. While these measurement methods allow the mass concentration of PMs in the air to be obtained at hourly intervals, the chemical composition of individual particles is analyzed with time-intensive laboratory procedures. In contrast, the presented measurement system allows the chemical compositions and particle sizes to be measured simultaneously in real time.

  • Design and Verification of Quartz Resonators with Quasi-convex Structure

    Hiroshi Oigawa, Keisuke Hayama, Jing Ji, Satoshi Ikezawa, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   134 ( 3 ) 47 - 51  2014.03  [Refereed]

    DOI

  • Basic research on elemental and size analytical system for nano-sized suspended particulate matter using contactless optical measurement techniques

    S. Ikezawa, T. Ueda

    Nanotechnology: Concepts, Methodologies, Tools, and Applications   2-3   898 - 907  2014.02  [Refereed]

    　View Summary

    A contactless sensing system for nano-sized carbonaceous particulate matter using laser-induced incandescence (LII) and laser-induced breakdown spectroscopy (LIBS) is presented. The LIBS technique allows detecting elemental composition and density of the SPMs, and LII technique allows to measure particulate size. LII technique is temporal resolved method that enables measurement of soot particulate sizes in a combustion process. In the case of the measured material consisting of a carbonaceous element, it is easy to determine the particulate diameter distribution derived from the time-profile of emission attenuation signals during cooling process, because the cooling behaviour is characteristic of the particulate diameter in LII technique. However, in actuality, the SPMs consist of several different types of elements. By using LIBS technique, the elemental analysis is able to conduct easily.

    DOI

  • Evaluation of Capacitance Edge Effect on the Comb Electrodes of the Quartz MEMS Tilt Sensor

    Zhou Liu, Ikezawa Satoshi, Ueda Toshitsugu

    Record of Joint Conference of Electrical and Electronics Engineers in Kyushu   2014   28 - 28  2014

    DOI CiNii

  • Effectiveness of Argon nanobubbles in realizing enhanced optical sensitization for laser-induced breakdown spectroscopy

    S. Ikezawa, T. Ueda

    Smart Sensors, Measurement and Instrumentation   7   255 - 268  2014  [Refereed]

    　View Summary

    This chapter describes the validity and usefulness of laser-induced breakdown spectroscopy (LIBS) measurements enhanced by argon nanobubbles. The use of argon nanobubbles in the LIBS system revealed higher sensitivity as compared to other conventional methods that are used for LIBS solution measurements. To create the nanobubbles, argon gas was pumped into water, forming bubbles less than 100 nm in diameter. The solution of dissolved argon bubbles was used to measure (1) the atomic spectrum of hydrogen (λ = 656 nm) from the water molecules (H2O) in the solution, and (2) the atomic spectrum of nitrogen (λ = 399.5) from the air bubbles in the solution. These experimental results demonstrated that argon nanobubbles are able to instantaneously retain plasma during the excitation/relaxation period, which is essential for highly sensitive spectral measurements. The intensity of nitrogen spectra (measurement (2)) obtained from the argon-air nanobubbles in water was much higher than that of the spectra obtained from normal LIBS air measurements.

    DOI

  • Development of a 3D Laser Scanning System for Laser-induced Breakdown Spectroscopy

    Satoshi Ikezawa, Yury L'vovich Zimin, Toshitsugu Ueda

    2014 IEEE SENSORS    2014  [Refereed]

    　View Summary

    We report a new laser scanning device to be used in a laser-induced breakdown spectroscopy (LIBS) system. The system consists of a tunable lens, a cold mirror that transmits infrared wavelengths, two galvano mirrors, a condenser lens, and an optical axis adjusting laser. Conventional laser scanning technologies have two main applications: (i) in the industry, for drawing simple dots/lines with high power lasers; and (ii) in laser art projections, where far more complex illustrations and animations using visible lasers have been achieved. These two applications have been developed separately. Our scanning system combines the advantages of both these technologies by employing high-strength galvano mirrors as well as a driving system that meets the international laser display association (ILDA) standard. Moreover, by assembling the electrically controlled tunable lens, any measuring point where the generation of laser-induced plasma is needed, can be reached in a given space.

  • Applied technique of focused ion beam milling based on microstructure of photonic bandgap fiber

    Xuefeng Li, Jinxing Liang, Toshitsugu Ueda

    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY   68 ( 1-4 ) 465 - 471  2013.09  [Refereed]

    　View Summary

    In this paper, a precision micromachining technique for photonic bandgap fiber (PBGF) using focused ion beam (FIB) milling was reported. Types of PBGF have the honeycomb structure with a hollow core surrounded by microstructured cladding, and the widths of the thin silica struts are only 10 similar to 100 nm. The shape of fiber section is the most important prerequisite for maintaining good output coupling efficiency and allowing gas diffusion. Therefore, a proper machining method can avoid microstructure collapse and is crucially important for the experimental investigations. The FIB milling process was discussed and realized to improve performance of PBGF gas cell in this study. The absorption spectra of acetylene (C2H2) gas and methane (CH4) gas have been investigated using the propose measurement system based on PBGF gas cell. The experimental results clearly indicated a high overlap between the propagating light and filled gas inside the PBGF. Therefore, these studies can contribute to highly sensitive gas sensing, higher accurate wavelength references, and other applications.

    DOI

  • An Experimental Study on Fabricating an Inverted Mesa-Type Quartz Crystal Resonator Using a Cheap Wet Etching Process

    Jinxing Liang, Jia Huang, Tian Zhang, Jing Zhang, Xuefeng Li, Toshitsugu Ueda

    SENSORS   13 ( 9 ) 12140 - 12148  2013.09  [Refereed]

    　View Summary

    In this study, a miniaturized high fundamental frequency quartz crystal microbalance (QCM) is fabricated for sensor applications using a wet etching technique. The vibration area is reduced in the fabrication of the high frequency QCM with an inverted mesa structure. To reduce the complexity of the side wall profile that results from anisotropic quartz etching, a rectangular vibration area is used instead of the conventional circular structure. QCMs with high Q values exceeding 25,000 at 47 MHz, 27,000 at 60 MHz, 24,000 at 73 MHz and 25,000 at 84 MHz are fabricated on 4 x 4 mm(2) chips with small vibration areas of 1.2 x 1.4 mm(2). A PMMA-based flow cell is designed and manufactured to characterize the behavior of the fabricated QCM chip in a liquid. Q values as high as 1,006 at 47 MHz, 904 at 62 MHz, 867 at 71 MHz and 747 at 84 MHz are obtained when one side of the chip is exposed to pure water. These results show that fabricated QCM chips can be used for bio- and chemical sensor applications in liquids.

    DOI

  • Dimension Optimization of Supporting Portion for a High-Frequency Quartz Resonator

    Jing Ji, Hiroshi Oigawa, Meng Zhao, Yupeng Zhang, Satoshi Ikezawa, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   133 ( 9 ) 253 - 259  2013.09  [Refereed]

    　View Summary

    In this paper, dimension optimization of supporting portion was carried out for an originally designed high-frequency fundamental AT-cut quartz resonator, which has a firstly applied peripheral electrode and 10-µm-thin vibration portion to generate above 150 MHz fundamental thickness-shear vibration. Using three-dimensional finite element modeling, it is the first time; dimensions of supporting portion were optimized through improving energy trapping and reducing vibration couplings. Based on optimization results, resonators with different dimensions were fabricated and their Q-factors were measured. The experimental results were very consistent with the optimization results. Improvement of the resonator's performance ensured the validation of our method.

    DOI CiNii

  • Electrode Optimization of 100MHz High-Frequency Quartz Resonator Based on Equivalent Mass Method

    Jing Ji, Hiroshi Oigawa, Meng Zhao, Hang Yu, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   52 ( 2 )  2013.02  [Refereed]

    　View Summary

    Electrode optimization based on the equivalent mass method was carried out for a 100 MHz high-frequency fundamental thickness-shear AT-cut (quartz cut with a cutting angle of about 35.25 degrees to the optic axis of the crystal) quartz resonator. Firstly, the electrode dimensions were optimized through three-dimensional finite-element modeling by the equivalent mass method. Secondly, on the basis of simulation results, 100 MHz fundamental frequency resonators were fabricated and quality factors were measured. The experimental and calculated results are highly consistent with the simulation results. The equivalent mass method combined with the finite-element method is confirmed to be applicable in the development of high-frequency quartz resonators. (C) 2013 The Japan Society of Applied Physics

    DOI

  • Non contact signal and power transmission technology development-"Non contact signal transmission technology development"

    Record of Joint Conference of Electrical and Electronics Engineers in Kyushu   2013   188 - 188  2013

    DOI CiNii

  • Non-contact Signal and Power Transmission System Development-Power Transmission Technology Development-

    Record of Joint Conference of Electrical and Electronics Engineers in Kyushu   2013   187 - 187  2013

    DOI CiNii

  • Damping characteristics of quartz tilt sensor with nonparallel comb electrode

    Fusao Kohsaka, Jinxing Liang, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   133 ( 2 ) 37 - 41  2013  [Refereed]

    　View Summary

    The dynamic behavior of microelectromechanical systems (MEMS) sensors is very important to their response performance. In particular, the damping effect of the fluid resistance in a minute gap determines a sensor's response characteristics. Quartz tilt sensors fabricated by anisotropic wet etching have nonparallel comb electrodes. The fluid damping phenomenon in the nonparallel electrode is generally evaluated by numerical analysis (the finite element method). However, many numerical analysis results are required to elucidate the qualitative features of physical phenomena. We evaluated the fluid damping of nonparallel electrodes analytically and experimentally verified the effectiveness of the analytical solution. This paper describes the theoretical damping analysis of nonparallel electrodes and the experimentally investigated damping characteristics of a quartz tilt sensor, and then discusses the analytical and experimental results. © 2013 The Institute of Electrical Engineers of Japan.

    DOI

  • Flow-Injection-Based Miniaturized Quartz Crystal Microbalance

    Jinxing Liang, Jia Huang, Sheng Ding, Toshitsugu Ueda

    SENSORS AND MATERIALS   25 ( 7 ) 519 - 526  2013  [Refereed]

    　View Summary

    In this research, we present the design and realization of a flow-injection-based high-fundamental-frequency (HFF) quartz crystal microbalance (QCM) sensor. A well-known fact is that increasing the fundamental frequency of thickness-shear-mode (TSM) QCM would result in an increase in mass sensitivity when it is used as chemical sensors or biosensors. HFF QCM is designed and fabricated on a small 4 x 4 mm(2) AT-cut quartz crystal chip using an inexpensive wet etching process with an inverted-mesa structure. For actual applications in liquid, a flow-injection-based QCM system is established, which is composed of a syringe pump, a sample injector, and a custom-made microflow cell. HFF QCMs are achieved by decreasing the central area thickness of a quartz wafer, which is inversely proportional to the vibration frequency. The vibration characteristics of fabricated QCM chips, including resonance frequency, quality factor (Q value), and equivalent circuit parameters, are measured using an impedance analyzer 4294A. HFF QCMs with high Q values of up to 29000 for 52 MHz in air were achieved. Even if assembled into the custom-made microflow cell, QCMs show a Q value beyond 23000 as measured using an impedance analyzer. These results demonstrate the successful design and fabrication of the flow cell, which does not degrade the performance of the QCM resonator. A Q value as high as 1000 of HFF QCM was observed even when pure water is flowed through the chip surface, which clearly demonstrated that the fabricated QCM and flow cell system could be used in liquid.

  • Improving bend performance of lead-free plastic ball grid array assemblies with thermal curing epoxy and UV curing acrylic edge-bond adhesives

    Hongbin Shi, Cuihua Tian, Michael Pecht, Toshitsugu Ueda

    2013 IEEE INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS (APM)    2013  [Refereed]

  • Basic Research on an Environmental Monitoring System for Assaying Cesium and Barium Using Laser-Induced Breakdown Spectroscopy

    S. Ikezawa, T. Ueda, A. Mason, O. Korostynska, A. I. Al-Shammaa

    2013 SEVENTH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY (ICST)     708 - 713  2013  [Refereed]

    　View Summary

    This paper reports a new method for real-time in-situ elemental analysis of measured radioactive elements that are strictly legally constrained to move the measuring samples for safety reasons. In this method, the applicable range of conventional laser-induced breakdown spectroscopy (LIBS), which has been used only to determine the elemental composition, is expanded in order to obtain an estimate of the isotope ratio by measuring the variation due to temporal change in the atomic disintegration products in small enclosed spaces. It is noted that this method takes full advantage of LIBS such that any pretreatment of the measured sample is not required. In this study, a confirmatory test for the LIBS measurement of cesium and barium based on the results for the disintegration of cesium is demonstrated as part of a preliminary survey for developing a monitoring system for actual radioactive materials.

  • Optical Analytical Technique for Carbonaceous Particles Using Laser-Induced Electro-Avalanche Fluorescence and Laser-Induced Incandescence

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    SENSORS AND MATERIALS   25 ( 1 ) 57 - 77  2013  [Refereed]

    　View Summary

    This report describes an optical sensing system for fine particle detection using a combination of two techniques: laser-induced breakdown spectroscopy (LIBS) and laser-induced incandescence (LII). We have improved laser measurement systems applied for small-particle analysis. We have determined elemental composition and density of particles using LIBS and have been able to measure particle size using LII. Controlling the power density of the light source of the present system allowed switching from LIBS to LII. LII temporal analysis was conducted using a streak camera, which was also used for LIBS analysis. The LII technique allows in situ measurement of the average primary particle size of nanoscale soot particles.

  • Point Spread Function Filtering for Radially Variant Blur Restoration

    Yupeng Zhang, Lev G. Zimin, Jing Ji, Satoshi Ikezawa, Toshitsugu Ueda

    SENSORS AND MATERIALS   25 ( 7 ) 449 - 469  2013  [Refereed]

    　View Summary

    In this paper, we present a point spread function (PSF) filtering technique for solving the radially variant blur restoration problem. Radially variant blur is generated by a spherical single-element lens imaging systeth (SSLIS) that is embedded in an experimental camera module. The restoration of this category of blur is carried out in a polar coordinate system using polar PSFs at different fields of view (FOVs). However, restoration using large PSFs tends to introduce severe ringing artifacts in the restored image owing to the nonsparse nature of these PSFs. We show in this paper that the PSF filtering technique can effectively minimize ringing artifacts by filtering out some PSF pixels with an intensity lower than the threshold intensity. As a result, a nonsparse PSF becomes a sparse PSF, which is for good restoration results. The effectiveness of the PSF filtering technique was validated by visual comparison using three test images captured by the SSLIS camera module. In addition, a systematic way to determine the optimal filtering coefficient for a PSF at any FOV within the FOV range is also introduced.

  • Basic Research on Elemental and Size Analytical System for Nano-Sized Suspended Particulate Matter Using Contactless Optical Measurement Techniques

    S. Ikezawa, T. Ueda

    International Journal of Measurement Technologies and Instrumentation Engineering   3 ( 1 ) 16 - 27  2013.01  [Refereed]

  • Real scene capturing using spherical single-element lens camera and improved restoration algorithm for radially variant blur

    Yupeng Zhang, Lev G. Zimin, Jing Ji, Satoshi Ikezawa, Toshitsugu Ueda

    OPTICS EXPRESS   20 ( 25 ) 27569 - 27588  2012.12  [Refereed]

    　View Summary

    A camera module employing spherical single-element lens imaging system (SSLIS) is introduced in this study. This type of imaging system can be used in compact digital cameras or mobile phone cameras, and it provides the advantages of simple design, reduced device bulkiness, and reduced manufacturing costs. When compared with conventional camera modules, our system produces radially variant blurred images, which can be satisfactorily restored by means of a polar domain deconvolution algorithm proposed in our previous study. In this study, we demonstrate an improved version of this algorithm that enables full-field-of-view (FOV) image restoration instead of the partial FOV restoration obtained via our previous algorithm. This improvement is realized by interpolating the upper and arc-shaped boundaries of the panoramic polar image such that the ringing artifacts around the center and four boundaries of the restored Cartesian image are greatly suppressed. The effectiveness of the improved algorithm is verified by image restoration of both computer simulated images and real-world scenes captured by the spherical single lens camera module. The quality of the restored image depends on the overall sparsity of all the point spread function (PSF) block Toeplitz with circulant blocks (BTCB) matrices used to restore a radially blurred image. (C) 2012 Optical Society of America

    DOI

  • Micromachining of photonic bandgap fiber using focused ion beam milling technique

    Xuefeng Li, Jinxing Liang, Shuo Lin, Yupeng Zhang, Toshitsugu Ueda

    Advanced Science Letters   12   230 - 234  2012.06  [Refereed]

    　View Summary

    In this paper, a micromachining technique was reported that processing of photonic bandgap fiber (PBGF) was using focused ion beam (FIB) milling. PBGFs can be filled with fluid, allowing light to interact with the fluid while it is guided. Therefore, PBGFs are now widely used in ever-widening areas of science and technology. PBGFs of a honeycomb-structure with a hollow-core surrounded by microstructured cladding, and the widths of the thin silica struts are typically 40 to 50 nm. The FIB milling technique was used for micromachining to improve the sensitivity of PBGF gas sensors in this study. And a measurement system based on the PBGF gas cell has also been developed and implemented. The absorption measurements of acetylene gas and methane gas have been investigated. The experimental results clearly indicated that the high sensitivity of gas detection due to the long interaction path length provided by PBGF. © 2012 American Scientific Publishers All rights reserved.

    DOI

  • Aspheric Single-element Lens using Birefringent Material for Miniaturized Imaging System

    Yupeng Zhang, Toshitsugu Ueda

    2012 IEEE SENSORS PROCEEDINGS     13 - 16  2012  [Refereed]

    　View Summary

    An aspheric single-element lens made of birefringent material is proposed in this paper. This lens is capable of suppressing aliasing artifacts in a captured image, which is caused by inability of the image sensor to detect fine patterns with higher spatial frequency than the Nyquist frequency of the sensor array. At the same time, this lens possesses converging capability like a conventional convex lens and tolerable optical aberrations by employing aspheric surfaces. Compared to conventional imaging systems that use multi-lens structure to tackle optical aberrations and realize aliasing suppression by stacking up more than two optical low pass filters (OLPFs), an imaging system using our lens can greatly reduce the lens stack height and manufacturing cost. Image capturing simulation using the proposed lens indicates that aliasing artifacts are effectively reduced. This lens is expected to be used in miniaturized imaging system such as smartphone cameras and laptop cameras.

  • A Comprehensive Analysis of the Thermal Cycling Reliability of Lead-Free Chip Scale Package Assemblies with Various Reworkable Board-Level Polymeric Reinforcement Strategies

    Hongbin Shi, Cuihua Tian, Daquan Yu, Toshitsugu Ueda

    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012)     958 - 969  2012  [Refereed]

    　View Summary

    The low coefficient of thermal expansion (CTE), high modulus and high glass transition temperature (T-g) underfills with silica filler have been successfully used for extending the thermal fatigue life of flip chip to package substrate interconnection. And along with the explosive growth of portable electronics market in recent years, various polymeric materials are also applied for reinforcing the mechanical strength of board-level solder joint under drop and shock conditions. However, the expected properties of polymeric materials for board-level applications are quite different from those of package-level underfills due to their own specific roles. In addition, the features of good reworkability, high-throughput and low-cost require the board-level polymer materials should be designed with little to no filler loading as well. Therefore, the knowledge and experience with package-level underfills couldn't be directly replicated to array-based package (ABP) assemblies. In this paper, the solder joint reliability of SAC305 chip scale package (CSPs) with various reworkable board-level polymeric reinforcement strategies (PRSs) were comparatively studied using a thermal cycling test. Two full capillary flow underfills (FCFUs), two partial capillary flow underfills (PCFUs), four edge-bond adhesives (EBAs) and two corner-bond adhesives (CBAs) with a great variety of material properties were considered. The test results show that all of the present PRSs shorten the thermal fatigue lives of CSP assemblies owing to the large CTE mismatch between polymers, solder joint, package substrate and PCB, especially for the FCFUs, followed by PCFUs/EBAs, and CBAs. The material with low CTE, moderate modulus and high T-g has the least negative impact on the thermal cycling performance regardless of which polymeric approach for strengthening solder joint was used. Finally, dye-and-pry and cross section techniques were also conducted to further understand the failure locations and mechanisms of CSP assemblies with various PRSs.

  • Systematic Studies of Second Level Interconnection Reliability of Edge and Corner Bonded Lead-Free Array-Based Packages under Mechanical and Thermal Loading

    Hongbin Shi, Daquan Yu, Toshitsugu Ueda

    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)     965 - 976  2012  [Refereed]

    　View Summary

    Lead-free (LF) solder joints of portable devices are frequently subjected to unintentional drop, bend, shear and thermal cycling loading during transportation, handling, and usage. Various underfills are widely used in the electronics industry to deal with these challenges, however, the above approaches have some intrinsic shortcomings such as high material costs, low manufacturing assembly rate, poor reworkability and so on. To reduce the cycle time and cost of conventional underfill process, two promising polymeric reinforcement technologies for the next generation array-based package (ABP) application, the so-called edge and corner bond adhesives, have been developed. In this paper, the second level interconnection (SLI) reliability of edge and corner bonded LF package stackable very thin fine pitch ball grid arrays (PSvfBGAs) was systematic studied using package to board interconnection shear, monotonic 4-point bend, 90 free-drop, and thermal cycling tests. Three materials used in this study were a UV-cured acrylic edge bond adhesive (EBA), and thermal-cured epoxy EBA, and a thermal-cured epoxy corner bond adhesive (CBA). Moreover, the PSvfBGAs without bonding were also tested for comparison. The test results indicate that all the bonding materials increase the mechanical performance of SLIs, especially for drop reliability. On the contrary, the thermal fatigue lives of PSvfBGAs with edge bond acrylic and epoxy are reduced by 38.42% and 8.34%, respectively. In addition to the comparison of maximum shear and bend forces, crosshead displacement, principle strain, drops and thermal cycles to failure between the four test groups, the failure modes and mechanisms of SLIs under various test conditions were analyzed as well.

  • Requirements and Considerations of Energy Harvesting for Industrial Wireless Transmitter

    Hisanori Hayashi, Toshitsugu Ueda

    2012 PROCEEDINGS OF SICE ANNUAL CONFERENCE (SICE)     1414 - +  2012  [Refereed]

    　View Summary

    Energy harvesting technologies are drawing attention as "green power" these days. Conventionally, wireless device works with battery power, but it may not need any batteries when the wireless device combines with an energy harvester.
    Actually, there are a lot of issues to install wireless transmitters into industrial factory or plant. In this paper, requirements to combine industrial wireless transmitters and energy harvesters and issues to solve are listed up, and then expectation to solve them is considered.

  • Effect of Sampling Rate on the Accuracy of Strain Gage Measurement during Printed Circuit Board Functional Test

    Hongbin Shi, Cuihua Tian, Rui Zhang, Daquan Yu, Toshitsugu Ueda

    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012)     902 - 907  2012  [Refereed]

    　View Summary

    Strain gage measurement is widely used in electronic industry as an effective tool for assessing and controlling risk levels. However, the accuracy of strain gage measurement is easily intluenced by many factors, among which sampling rate/scan frequency setting of a measure equipment remains an important one. Some critical strain values may be missed if the sampling rate is too low, on the contrary, if the sampling rate is too high, unnecessary time and cost will be wasted on data analysis. In this paper, the effects of sampling rate on the accuracy of strain gage measurements during printed circuit board (PCB) functional tests (FCT) were investigated by comparing the diagonal strain (epsilon d), principle strain (epsilon p), and strain rate of a laptop PCB ranged from 1 to 1k Hz. The test results showed that all the above indicators reduced with decreasing sampling rate, especially for the sampling rate less than 250 Hz. The acceptable sampling rate for accurate strain measurement was defined as the sampling rate at which less than 1% decrease in the indicators compared to those at a sampling rate of lk Hz. The minimum acceptable sampling rate for the laptop PCB during FCT were 333, 333, and 500 Hz based on epsilon d, epsilon p, or strain rate, respectively. Although the difference between minimum acceptable sampling rates based on two different strain metrics was not significant, the values of principle strain were always higher than the that of diagonal strain around four corners of a array-based package soldered onto the PCB. The minimum acceptable sampling rate based on strain rate was most conservative, followed by based on epsilon p, and epsilon d. The higher strain rate at a sampling rate of lk Hz, the higher minimum acceptable sampling rate was required. However, the dependence of minimum acceptable sampling rate on epsilon p and epsilon d is not significant.

  • Development of Cesium Detection System using Laser-induced Breakdown Spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    2012 IEEE SENSORS PROCEEDINGS     1037 - 1040  2012  [Refereed]

    　View Summary

    This report presents a new cesium sensing method that uses laser-induced breakdown spectroscopy (LIBS). Conventionally, beta rays and germanium semiconductor detectors have been used for Cs-137 analysis. These methods typically require laboratory-scale analytical facilities. On the other hand, LIBS allows for direct elemental composition measurement of samples regardless of their physical state without preprocessing or laboratory facilities. Even if it is nearly impossible to separate isotopic data from the spectrum of an LIBS measurement, measurement of cesium levels is important for investigating the causes of abnormal radiation levels because the abundance of cesium is low under normal conditions. We report on cesium spectra results as measured by LIBS; the measurements were of sufficient resolution to obtain quantitative information for calculating the expected quantity of radioactive cesium from the isotope ratios.

  • Board-Level Shear, Bend, Drop and Thermal Cycling Reliability of Lead-Free Chip Scale Packages with Partial Underfill: A Low-Cost Alternative to Full Underfill

    Hongbin Shi, Cuihua Tian, Michael Pecht, Toshitsugu Ueda

    PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE     774 - 785  2012  [Refereed]

    　View Summary

    Full capillary flow underfill (FCFU) has been proven to be effective in improving the board-level mechanical reliability of lead-free (LF) area array packages (AAPs). However, the FCFU may have negative effects on the thermal cycling reliability of AAPs depending on the material properties of underfills, including coefficients of thermal expansion, glass transition temperature, modulus, and adhesion strength. In addition, the increased cost, time-consuming processes, and poor reworkability caused by the application of FCFU have also hindered the widespread use of the board-level underfills. In order to address these challenges, a partial capillary flow underfill (PCFU) or corner-only underfill approach was developed. However, data are scarce for board-level solder joint reliability of LF AAPs with PCFU, especially for portable electronics applications. In this paper, the overall reliability of LF chip scale packages (CSPs) with FCFU and PCFU was comparatively studied using the AAP-to-board interconnection shear test, monotonic 3-point bending test, vertical free drop test, and thermal cycling test. One set of non-underfilled CSP assemblies was tested as the control. The test results indicated that the mechanical performance of underfilled CSPs was significantly enhanced compared to the CSPs without underfill, especially for drop reliability. However, the characteristic life values of CSPs with FCFU and PCFU during the thermal cycling test were reduced by 15% and 8%, respectively. The improvement in overall board-level solder joint reliability of LF CSPs provided by the PCFU was comparable to that of the FCFU. Hence, partial underfill can be used as a good alternative to full underfill. Failure analysis demonstrated that the dominant failure mode was PCB pad cratering in shear and bending test, and the brittle fracture at the CSP intermetallic compound/solder interface was dominant for all the test groups under drop loading conditions. In contrast, the failure mechanisms of the underfilled and control boards were different during the thermal cycling test: PCB pad cratering and bulk solder fatigue crack were found in the CSPs with and without underfill, respectively.

  • Energy distribution of residual stresses in bi-layer structure

    Yury Zimin, Toshitsugu Ueda, Joanna Pawlat

    PRZEGLAD ELEKTROTECHNICZNY   88 ( 6 ) 111 - 113  2012  [Refereed]

    　View Summary

    The analysis of energy of elastic strain induced by the residual stresses in bonded structure in the framework of Timoshenko's model has been done. The analysis revealed the energy is due to the forces aimed at splitting the structure. The energy as well as the splitting forces strongly depended on the thickness ratio of the bonded layers and the total thickness of the structure. The dependence included the point where splitting forces were equal zero (E(1)h(1)(2) = E(2)h(2)(2)). The latter allows reducing the debonding problem, often appearing in the case of bonded structures of dissimilar materials, which becomes peculiarly important in micro and nanofabrication processes.

  • Reducing the Failure Risk of Portable Electronic Devices under Field Use Conditions through Triaxial Strain Gage Array Technology

    Hongbin Shi, Cuihua Tian, Satoshi Ikezawa, Toshitsugu Ueda

    2012 IEEE SENSORS PROCEEDINGS     1372 - 1375  2012  [Refereed]

    　View Summary

    Increasing functional density of portable electronic devices has led to the explosive growth in the array-based package (ABP) usage, however, the decreasing I/O pitch of ABPs and the consequent smaller pads and solder joints, along with the introduction of brittle lead-free solder alloy, make the interconnect reliability of portable electronic devices more challenging. In this paper, triaxial strain gage array technology was used for monitoring the strain response of laptops under various field use conditions, including rotating a screen, knocking keys, holding a laptop, and so on. The failure analysis results for the ABP assemblies subjected to the above loadings indicated that there was obvious positive correlation between the extents of solder joint damage and strain level around the corresponding areas. In addition to assessing the interconnect reliability risk during different events, the triaxial strain gage array technology can also be applied to compare the impact of mechanical structure design modifications to the solder joint reliability and determine the optimal design.

  • Optical Sensitization for Laser-induced Breakdown Spectroscopy using Argon Nanobubbles

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    2012 SIXTH INTERNATIONAL CONFERENCE ON SENSING TECHNOLOGY (ICST)     315 - 319  2012  [Refereed]

    　View Summary

    This paper demonstrates the validity and usefulness of laser-induced breakdown spectroscopy (LIBS) measurements enhanced by argon nanobubbles. The use of argon nanobubbles in the LIBS system revealed a higher sensitivity than that of conventional methods for LIBS solution measurements. To make the nanobubbles, argon gas was pumped into water, forming bubbles less than 100 nm in diameter. The solution of dissolved argon bubbles was used for the following measurements: (1) the hydrogen atomic spectrum (lambda = 656 nm) from the water molecules (H2O) in the solution and (2) the nitrogen atomic spectrum (lambda = 399.5 nm) from the air bubbles in the solution. These experimental results demonstrated that the argon nanobubbles have the ability of instantaneous plasma retention during the excitation/relaxation period, which is essential for highly sensitive spectral measurements. The intensity of nitrogen spectra (measurement (2)) obtained from the argon-air nanobubbles in water was much higher than that of the spectra obtained from normal LIBS air measurements.

  • Polymeric Reinforcement Approaches and Materials Selection to Improve Board-Level Drop Reliability of SnAgCu Soldered Area Array Packages

    Hongbin Shi, Cuihua Tian, Michael Pecht, Toshitsugu Ueda

    PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE     219 - 230  2012  [Refereed]

    　View Summary

    The board-level drop performance of area array package (AAP) assemblies is becoming increasingly critical due to the shift from desktop to mobile computing. Furthermore, challenges have arisen from the introduction of lead-free solders and miniaturization of solder joint dimensions. Polymeric reinforcement of AAPs offers a solution for drop reliability concerns. However, polymeric reinforcement increases the unit manufacturing cost of materials, capital equipment, cycle time, and rework. All of the polymeric reinforcement approaches, such as full capillary flow underfill (FCFU), partial capillary flow underfill (PCFU), edge bond adhesive (ERA), and corner bond adhesive (CBA), improve the drop reliability of lead-free fine-pitch AAP assemblies. However, the use of a polymeric reinforcement strategy with improper implementation and/or material properties may cause an unnecessary rise in manufacturing costs and/or cause the assemblies to fail to meet the drop performance requirements of a specific application. This study compares the different polymeric reinforcement approaches (FCFU, ERA, and CBA) and material properties for AAPs using a vertical free drop test. One set of AAP assemblies with no polymeric reinforcement was tested as the control. The test results indicated that the drop performance of reinforced CSP assemblies increased with the use of better polymeric reinforcement material volume and modulus and higher adhesive strength of the materials. The components closer to outer edges of the PCB were more prone to failure compared to the components at the center of the PCB. In addition to the failure criteria based on daisy-chain resistance, the drop impact life based on the CSPs that fell of the PCBs can also be used simply to compare the performance of different polymeric reinforcement strategies. Failure analysis demonstrated that the dominant failure mode was brittle fracture at the CSP IMC/solder interface for all the test groups except the underfilled samples. However, the percentage of the PCB pad cratering failure mode significantly increased with the application of polymeric reinforcement materials.

  • Multi-spectral analytical systems using libs and LII techniques

    Satoshi Ikezawa, Muneaki Wakamatsu, Yury L'Vovich Zimin, Joanna Pawlat, Toshitsugu Ueda

    Lecture Notes in Electrical Engineering   83   207 - 232  2011  [Refereed]

    　View Summary

    In this paper, we propose an advanced approach to particle analysis, involving laser-induced breakdown spectroscopy (LIBS) and laser-induced incandescence (LII) temporal analytical techniques. Various technical properties of fine particles are analyzed via LIBS and LII. LIBS is a useful tool for determining the elemental composition and relative concentration of various materials, whereas LII facilitates the measurement of particle size. Both techniques do not require any pre-processing. The combined use of the LIBS and LII techniques enables highly synergistic fine particle measurement. In the LIBS section, we propose spectrometric analysis via a novel ink-jet technique, and we discuss the effectiveness of Ar as a surrounding gas. In the LII section, we compare the calculated particle size prediction with the experimental results. © 2011 Springer-Verlag Berlin Heidelberg.

    DOI

  • A texture dependent interpolation for barrel distorted and longitudinal chromatic aberrated image

    Yupeng Zhang, Ikumi Minema, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   128 ( 11 ) 1 - 430  2008  [Refereed]

    　View Summary

    New approaches of image interpolation are proposed to compensate for the discontinuity after correcting the barrel distortion and longitudinal chromatic aberration derived from the embedded digital camera in cell phone. This method determines the value of a lost pixel by the texture around the pixel, which can be classified into 16 cases and then interpolate the pixel by nearest neighbor, linear interpolation or bilinear interpolation according to the specific case. That is why we named it case analysis interpolation. The proposed method needs interpolation only once. Visual and quantitative comparisons of the interpolation results of five kinds of texture suggest that the proposed algorithm outperforms others in most of the textures, yielding the smoothest interpolated result. © 2008 The Institute of Electrical Engineers of Japan.

    DOI

  • PBG fibers for gas concentration measurement

    Joanna Pawlat, Tadashi Sugiyama, Takahiro Matsuo, Toshitsugu Ueda

    PLASMA PROCESSES AND POLYMERS   4 ( 7-8 ) 743 - 752  2007.10  [Refereed]

    　View Summary

    The idea of a high-sensitivity gas concentration measuring system based on a photonic bandgap fiber (PBG fiber) is studied. Several types of PBG fibers of various parameters have been designed. Core diameters range from 10.9 to 26.25 mu m. The capillary gas flow rate within the fiber has been simulated and measured. The attenuation of newly produced fibers is investigated and the concentration of ammonia gas is measured using a proposed sensing system. A new method for cutting the fiber using an Ar ion beam in a vacuumed chamber is tested to obtain the required angle of the fiber's end, and to avoid the destruction of the cladding structure.

    DOI

  • Possibility of gas concentration measurement using photonic crystal fiber

    Joanna Pawlat, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    PRZEGLAD ELEKTROTECHNICZNY   83 ( 5 ) 31 - 35  2007  [Refereed]

    　View Summary

    Background calculations for new high-sensitivity gas concentration measuring method were performed. Darcy - Weisbach equation for non-compressible flow and quasi - Panhandle equation for compressible gas flow were used for the estimation of gas flow rate and gas velocity inside Photonic Bandgap Fiber (PBG). Several types of PBG fibres of various parameters were designed and used. Core diameters ranged from 10.9 to 19.9 mu m. Microcapillary gas flows and gas concentrations inside fibers were measured.

  • Evaluation of laser-induced breakdown spectroscopy quantitative sensing performance using a micro-droplet ejection system

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawlat, Toshitsugu Ueda

    2007 IEEE SENSORS, VOLS 1-3     407 - 410  2007  [Refereed]

    　View Summary

    A new and reliable evaluating method for a laser induced breakdown spectroscopy (LIBS) quantitative measurement using a micro-droplet sample ejection system is introduced. LIBS has been investigated extensively to establish proper chemical analysis of specimens. There is an indefinable boundary which is ablated or not when laser focusing on the sample. Generating micro-droplets from concentration tuned solution, and leading to the correct beam spot area are important for determining the total amount of media in a droplet. The LIBS measures the sodium chloride concentration of a micro-droplet as a quantitative measurement by recording intensity from the sample plasma. As a result, LIBS with the micro-drop ejection system produced greater intensities than the old technique of bulk-liquid measurement based on data from 100 laser pulse shots.

  • Measurement of NH3 concentration using optic fiber sensor

    Joanna Pawlat, Xuefeng Li, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    OPTOMECHATRONIC SENSORS AND INSTRUMENTATION III   6716  2007  [Refereed]

    　View Summary

    New generation of light fibers: Photonic Bandgap fibers (PBG fiber) were applied as gas cells in the concentration measurement sensor. Several types of PBG fibers of various parameters were designed. Core diameters ranged from 10.9 to 26.25 mu m. The precise cutting method for the PBG fiber was proposed. Capillary gas flow rate within the fiber was simulated and measured. Attenuation of newly produced fibers was investigated and concentration of ammonia gas was measured using the new type sensing system.

    DOI

  • Study on a diode-bridge type capacitance detection circuit for differential capacitive sensor

    Takahiro Matsuo, Joanna Pawlat, Jinxing Liang, Toshitsugu Ueda

    PRZEGLAD ELEKTROTECHNICZNY   83 ( 6 ) 60 - 62  2007  [Refereed]

    　View Summary

    Diode-bridge type capacitance detection circuit was developed in order to detect very small variation of differential capacitances in higher resolution. The circuit was designed for a comb structure tilt sensor, which was made of quartz crystal and had several movable electrodes between fixed electrodes. The circuit's output was almost proportional to the displacement of the movable electrode. Presently, the resolution of 0.0015 degree was obtained using the combination of the sensor and the detection circuit. It corresponded to the resolution of about less than 4.5aF.

  • Measurement of low gas concentration using photonic bandgap fiber

    Joanna Pawlat, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    JOURNAL OF ADVANCED OXIDATION TECHNOLOGIES   9 ( 2 ) 150 - 155  2006.07  [Refereed]

    　View Summary

    A high-sensitivity, compact set-up, enabling the precise measurement of a very low concentration of gas was designed. The micro-capillary gas flow phenomenon and the gas absorption inside fiber were estimated. Darcy - Weisbach equation for non-compressible flow and quasi - Panhandle equation for compressible gas flow were used for the calculation of the gas flow rate and gas velocity inside the photonic bandgap fiber. It was assumed that gas flowed mostly in the core. During the experimental part of work several types of optic fiber of various parameters were used. The core diameters ranged from 10.9 to 19.9 mu m. It was possible to measure the flow rate of the nitrogen gas inside the fiber with various pressure differences on the opposite ends. Average velocity (Delta p = 0.9 atm) ranged 0.17 m/s and was a little bit lower than expected.

  • Strain-balanced InAsP/InP/InGaAs multiple quantum well structures for mid-infrared photodetectors

    M Wada, S Araki, T Kudou, T Umezawa, S Nakajima, T Ueda

    ELECTRONICS LETTERS   38 ( 25 ) 1744 - 1745  2002.12  [Refereed]

    　View Summary

    The strain-balanced InAsP/InP/InGaAs multiple quantum well (MQW) structures for mid-wavelength-infrared photodetectors are presented. The MQW consists of +2% strained InAsP wells, InP barriers and -2% strained InGaAs layers, where the strained InP/InAsP/InP quantum wells provide a light-absorbing layer and the strain is entirely compensated by introducing thin strained InGaAs layers.

    DOI

▼display all

Books and Other Publications

  • Detection of Cesium from Pollucite using Laser-Induced Breakdown Spectroscopy

    Proceedings of 8th International Conference Mechatronic Systems and Materials, pp.198, Bialystok, Poland  2012

  • Development of The Quartz Resonators with Quasi-Convex Structure

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000087  2012

  • A New Solution of Anisotropic 3D Vertex Etching Simulation for Quartz Crystal

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000091  2012

  • Size Optimization for Miniature High Frequency Quartz Resonator using Finite Element Method

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000081  2012

  • Ringing reduction for radially restored images

    Proceedings of Applied Industrial Optics: Spectroscopy, Imaging and Metrology (AIO) Monterey, JTu5A.24.pdf, California  2012

  • Thermomechanical Reliability Analysis and Optimization for MEMS Packages With AuSn Solder

    2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE) pp. 794-797, 15-18  2012

  • Technology and applications using laser-induced electro-avalanche fluorescence and laser induced incandescence technique

    Proceedings of China-Japan Joint Symposium on Sensing Technology, pp.14, Southeast University, Nanjing, China, April 22-25  2012

  • A geometry solution for 3D anisotropic etching simulation

    Proceedings of China-Japan Joint Symposium on Sensing Technology, pp.12, Southeast University, Nanjing, China, April 22-25  2012

  • Real scene capturing and deblurring for spherical single lens camera

    Proceedings of China-Japan Joint Symposium on Sensing Technology, pp.3, Southeast University, Nanjing, China, April 22-25  2012

  • Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods

    Microelectronics Reliability, Vol. 52, No.9-11, pp. 1870-1875  2012

  • Optimization of Electrode Structure for a High-Frequency AT-cut Quartz Resonator Using FEM

    IEEJ Transactions on Sensors and Micromachines, Vol. 132 (2012) No. 9 pp. 275-281  2012

  • Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model

    Microelectronics Reliability, July, (2012) (http://dx.doi.org/10.1016/j.microrel.  2012

  • NIR Spectrum Analysis of Natural Gas Based on Hollow-Core Photonic Bandgap Fiber

    IEEE sensors Journal, Vol. 12, No. 7, pp. 2362-2367  2012

  • High-Sensitivity Fiber-Optic Fabry-Perot Interferometer Temperature Sensor

    Jpn. J. Appl. Phys., Vol. 51, No. 6, pp. 06FL10 1-4  2012

  • Vibration Analysis of Original Shape Quartz Resonator for High Quality Factor Realization

    Jpn. J. Appl. Phys., Vol.51, No.6, pp. 06FL02 1-5  2012

  • Thermomechanical Fatigue Performance of Lead-free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills

    Jpn. J. Appl. Phys., Vol.51, No.5, pp. 05EE04 1-8  2012

  • Board-Level Solder Joint Reliability of Edge- and Corner-Bonded Lead-Free Chip Scale Package Assemblies Subjected to Thermal Cycling

    Jpn. J. Appl. Phys., Vol.51, No.4, pp. 04DB08 1-10  2012

  • Development of Semi-Quantitative Analytical System for Metal Nanoparticle Ink using Laser-induced Breakdown Spectroscopy

    International Journal on Smart Sensing and Intelligent Systems Vol. 5, No. 1, pp215-232  2012

  • Fiber-Optic Temperature Sensor Based on Difference of Thermal Expansion Coefficient between Fused Silica and Metallic Materials

    IEEE Photonics Journal, Vol. 4, No. 1. pp. 155-162  2012

  • 遮光マスクを用いた歯科治療用根管内観察システムの内部反射光の低減

    平成24年第65回電気関係学会九州支部連合大会論文集, p.45  2012

  • 擬似コンベックス形状を有した水晶振動子の凸部の高さとＱ値の関係

    平成24年第65回電気関係学会九州支部連合大会論文集, p. 44  2012

  • 異なる温度におけるATカット水晶振動子の有限要素法による寸法最適化

    平成24年第65回電気関係学会九州支部連合大会論文集, p. 43  2012

  • コンベックス振動子を模擬した新形状の高安定振動子

    平成24年電気学会全国大会, pp. , (3-124),  2012

  • 傾斜角センサの演算表示プログラム開発

    平成24年電気学会全国大会, pp. , (3-122)  2012

  • 二軸容量型傾斜角センサのプロセスの開発と評価

    平成24年電気学会全国大会, pp. , (3-121)  2012

  • MEMSパッケージの気密性評価法の開発

    平成24年電気学会全国大会, pp. , (3-131),  2012

  • Detection of Cesium from Pollucite using Laser-Induced Breakdown Spectroscopy

    Proceedings of 8th International Conference Mechatronic Systems and Materials, pp.198, Bialystok, Poland  2012

  • Development of The Quartz Resonators with Quasi-Convex Structure

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000087  2012

  • A New Solution of Anisotropic 3D Vertex Etching Simulation for Quartz Crystal

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000091  2012

  • Size Optimization for Miniature High Frequency Quartz Resonator using Finite Element Method

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000081  2012

  • Ringing reduction for radially restored images

    Proceedings of Applied Industrial Optics: Spectroscopy, Imaging and Metrology (AIO) Monterey, JTu5A.24.pdf, California  2012

  • Thermomechanical Reliability Analysis and Optimization for MEMS Packages With AuSn Solder

    2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE) pp. 794-797, 15-18  2012

  • Technology and applications using laser-induced electro-avalanche fluorescence and laser induced incandescence technique

    Proceedings of China-Japan Joint Symposium on Sensing Technology, pp.14, Southeast University, Nanjing, China, April 22-25  2012

  • A geometry solution for 3D anisotropic etching simulation

    Proceedings of China-Japan Joint Symposium on Sensing Technology, pp.12, Southeast University, Nanjing, China, April 22-25  2012

  • Real scene capturing and deblurring for spherical single lens camera

    Proceedings of China-Japan Joint Symposium on Sensing Technology, pp.3, Southeast University, Nanjing, China, April 22-25  2012

  • Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods

    Microelectronics Reliability, Vol. 52, No.9-11, pp. 1870-1875  2012

  • Optimization of Electrode Structure for a High-Frequency AT-cut Quartz Resonator Using FEM

    IEEJ Transactions on Sensors and Micromachines, Vol. 132 (2012) No. 9 pp. 275-281  2012

  • Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model

    Microelectronics Reliability, July, (2012) (http://dx.doi.org/10.1016/j.microrel.  2012

  • NIR Spectrum Analysis of Natural Gas Based on Hollow-Core Photonic Bandgap Fiber

    IEEE sensors Journal, Vol. 12, No. 7, pp. 2362-2367  2012

  • High-Sensitivity Fiber-Optic Fabry-Perot Interferometer Temperature Sensor

    Jpn. J. Appl. Phys., Vol. 51, No. 6, pp. 06FL10 1-4  2012

  • Vibration Analysis of Original Shape Quartz Resonator for High Quality Factor Realization

    Jpn. J. Appl. Phys., Vol.51, No.6, pp. 06FL02 1-5  2012

  • Thermomechanical Fatigue Performance of Lead-free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills

    Jpn. J. Appl. Phys., Vol.51, No.5, pp. 05EE04 1-8  2012

  • Board-Level Solder Joint Reliability of Edge- and Corner-Bonded Lead-Free Chip Scale Package Assemblies Subjected to Thermal Cycling

    Jpn. J. Appl. Phys., Vol.51, No.4, pp. 04DB08 1-10  2012

  • Development of Semi-Quantitative Analytical System for Metal Nanoparticle Ink using Laser-induced Breakdown Spectroscopy

    International Journal on Smart Sensing and Intelligent Systems Vol. 5, No. 1, pp215-232  2012

  • Fiber-Optic Temperature Sensor Based on Difference of Thermal Expansion Coefficient between Fused Silica and Metallic Materials

    IEEE Photonics Journal, Vol. 4, No. 1. pp. 155-162  2012

  • Detection of Cesium from Pollucite using Laser-Induced Breakdown Spectroscopy

    Proceedings of 8th International Conference Mechatronic Systems and Materials, pp.198, Bialystok, Poland  2012

  • Development of The Quartz Resonators with Quasi-Convex Structure

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000087  2012

  • A New Solution of Anisotropic 3D Vertex Etching Simulation for Quartz Crystal

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000091  2012

  • Size Optimization for Miniature High Frequency Quartz Resonator using Finite Element Method

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000081  2012

  • Ringing reduction for radially restored images

    Proceedings of Applied Industrial Optics: Spectroscopy, Imaging and Metrology (AIO) Monterey, JTu5A.24.pdf, California  2012

  • Thermomechanical Reliability Analysis and Optimization for MEMS Packages With AuSn Solder

    2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE) pp. 794-797, 15-18  2012

  • Technology and applications using laser-induced electro-avalanche fluorescence and laser induced incandescence technique

    Proceedings of China-Japan Joint Symposium on Sensing Technology, pp.14, Southeast University, Nanjing, China, April 22-25  2012

  • A geometry solution for 3D anisotropic etching simulation

    Proceedings of China-Japan Joint Symposium on Sensing Technology, pp.12, Southeast University, Nanjing, China, April 22-25  2012

  • Real scene capturing and deblurring for spherical single lens camera

    Proceedings of China-Japan Joint Symposium on Sensing Technology, pp.3, Southeast University, Nanjing, China, April 22-25  2012

  • Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods

    Microelectronics Reliability, Vol. 52, No.9-11, pp. 1870-1875  2012

  • Optimization of Electrode Structure for a High-Frequency AT-cut Quartz Resonator Using FEM

    IEEJ Transactions on Sensors and Micromachines, Vol. 132 (2012) No. 9 pp. 275-281  2012

  • Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model

    Microelectronics Reliability, July, (2012) (http://dx.doi.org/10.1016/j.microrel.  2012

  • NIR Spectrum Analysis of Natural Gas Based on Hollow-Core Photonic Bandgap Fiber

    IEEE sensors Journal, Vol. 12, No. 7, pp. 2362-2367  2012

  • High-Sensitivity Fiber-Optic Fabry-Perot Interferometer Temperature Sensor

    Jpn. J. Appl. Phys., Vol. 51, No. 6, pp. 06FL10 1-4  2012

  • Vibration Analysis of Original Shape Quartz Resonator for High Quality Factor Realization

    Jpn. J. Appl. Phys., Vol.51, No.6, pp. 06FL02 1-5  2012

  • Thermomechanical Fatigue Performance of Lead-free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills

    Jpn. J. Appl. Phys., Vol.51, No.5, pp. 05EE04 1-8  2012

  • Board-Level Solder Joint Reliability of Edge- and Corner-Bonded Lead-Free Chip Scale Package Assemblies Subjected to Thermal Cycling

    Jpn. J. Appl. Phys., Vol.51, No.4, pp. 04DB08 1-10  2012

  • Development of Semi-Quantitative Analytical System for Metal Nanoparticle Ink using Laser-induced Breakdown Spectroscopy

    International Journal on Smart Sensing and Intelligent Systems Vol. 5, No. 1, pp215-232  2012

  • Fiber-Optic Temperature Sensor Based on Difference of Thermal Expansion Coefficient between Fused Silica and Metallic Materials

    IEEE Photonics Journal, Vol. 4, No. 1. pp. 155-162  2012

  • Effects of Reworkable Edge and Corner Bond Adhesives on the Thermal Fatigue Performance of Lead-Free Chip Scale Package Assemblies

    Proceedings of 13th International Conference on. Electronics Materials and Packaging, pp. EMAP2011-20 (1-10)  2011

  • Investigation on the Optimum Sampling Rate of Strain Measurement during Printed Circuit Board (PCB) System Assembly

    Proceedings of the 13th Electronics Packaging Technology Conference, pp. 579-584  2011

  • Mitigation of Thermal Fatigue Failure in Fully Underfilled Lead-free Array-based Package Assemblies Using Partial Underfills

    Proceedings of the 13th Electronics Packaging Technology Conference, pp. 542-547  2011

  • Quartz Resonator Hydrogen Sensor Using Platinum Black

    Proceedings of the 2011 Fifth International Conference on Sensing Technology, pp. 587-590  2011

  • Quantitative Analysis of Silver Nanoparticle Ink using Laser-induced Breakdown Spectroscopy

    Proceedings of the 2011 Fifth International Conference on Sensing Technology, pp. 6-10, November 28  2011

  • High Frequency Plano-convex Resonator Fabricated by DRIE

    Technical Meeting on Electronic Circuits, pp. 43-46, Kyoto, Japan  2011

  • A Novel Method for Evaluating Triaxial Strain Gages Used in Printed Circuit Board Assemblies (PCBA) Strain Monitoring (ポスター発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Application of a 2-D Anisotropic Etching Simulator on Perforated Etching of Quartz Wafer (ポスター発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Size Optimization for High Frequency Quartz Resonator Using Finite Element Vibration Analysis (ポスター発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Sensing System for Quantitative Analysis of Metal Particles Using Laser-Induced Breakdown Spectroscopy (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • A Reliability of Silicon-Crystalline Quartz Bonding Through Reducing of the Residual Stresses (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Ultra-Small Imaging System for Cell Phone Camera Using Birefringent Lenses (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Alkanes Near-Infrared Spectrum Analysis Based on Hollow-Core Photonic Bandgap Fiber (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Vibration Analysis of Original Shape Quartz Resonator for High Q Realization (ポスター発表）

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan  2011

  • Optimal Size Determination of Electrodes for High Frequency Fundamental AT-cut Quartz Resonator using 3-D FEM (ポスター発表）

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan  2011

  • High Sensitivity Fiber-optic Fabry-perot Interferometer Temperature Sensor (ポスター発表）

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan  2011

  • Experimental and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending (口頭発表）

    22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France  2011

  • Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test (ポスター発表）

    22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France  2011

  • Board-level Solder Joint Reliability of Edge and Corner Bonded Lead-free Chip Scale Package Assemblies Subjected to Thermal Cycling (ポスター発表）

    2011 International Conference on Solid State Devices and Materials, Nagoya, Japan  2011

  • Thermomechanical Fatigue Performance of Lead-free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills (口頭発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Analysis of Edge and Corner Bonded PoP Bottom Package Reliability under Temperature Cycling Conditions by Experimental and Finite Element Methods (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Heat and Ultraviolet Dual-curable Edge Bonding Materials for Ball Grid Array Packages and the Impact on Solder Joint Reliability (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Drop Impact Reliability Improvement of Lead-free Array-based Package Assemblies with Different Board-level Underfills and Adhesives (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Experimental and Computational Characterization of Board-level Shear Behavior of PSvfBGA Assemblies with Edge and Corner Adhesives (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Halogen-free and Reworkable Corner Bond Adhesive for Array-based Packages and the Impact on Board-level Solder Joint Reliability (口頭発表）

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China  2011

  • Investigation of Various Board-level Underfills and Adhesives for CTBGA Bend Performance Enhancements in Lead-free Portable Electronic Products (口頭発表）

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China  2011

  • Thermal Cycling Reliability of Lead-free Package Stackable Very Thin Fine Pitch Ball Grid Array Assemblies with Reworkable Edge and Corner Bond Adhesives (ポスター発表）

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China  2011

  • USE OF A NEW ANISOTROPIC ETCHING SIMULATOR ON QUARTZ CRYSTAL (ポスター発表）

    The 16th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS' 11), Beijing, China  2011

  • On-Wafer-Packaging of Crystal Quartz Based Devises Using Low-Temperature Anodic Bonding（ (口頭発表＋ポスター発表）

    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2011) Aix-en-Provence, France  2011

  • Effects of Edge and Corner bond Adhesives on Board-level Shear Strength of Lead-free Package-on-Package Devices (口頭発表）

    2011 International Conference on Electronics Packaging, Nara, Japan  2011

  • Studies on the Bend Performance of Package Stackable Very Thin Fine Pitch Ball Grid Array Assemblies with Edge and Corner Bond Adhesives (oral)

    2011 International Conference on Solid-State and Integrated Circuit  2011

  • Effects of Edge and Corner Bond Adhesives on the Drop Reliability of Package-on-Package Bottom Package Assemblies (oral)

    2011 International Conference on Solid-State and Integrated Circuit  2011

  • A Real Double-convex Spherical Single Lens System with Blur Restoration Feature (oral)

    2011 International Conference on Communication and Electronics Information, Haikou, China  2011

  • Saturated Absorption Spectroscopy of Hydrocarbons Based on Photonic Bandgap Fiber (oral)

    2011 International Conference on Communication and Electronics Information, Haikou, China  2011

  • A Novel Method for Evaluating Triaxial Strain Gages Used in Printed Circuit Board Assemblies (PCBA) Strain Monitoring (ポスター発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Application of a 2-D Anisotropic Etching Simulator on Perforated Etching of Quartz Wafer (ポスター発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Size Optimization for High Frequency Quartz Resonator Using Finite Element Vibration Analysis (ポスター発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Sensing System for Quantitative Analysis of Metal Particles Using Laser-Induced Breakdown Spectroscopy (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • A Reliability of Silicon-Crystalline Quartz Bonding Through Reducing of the Residual Stresses (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Ultra-Small Imaging System for Cell Phone Camera Using Birefringent Lenses (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Alkanes Near-Infrared Spectrum Analysis Based on Hollow-Core Photonic Bandgap Fiber (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Vibration Analysis of Original Shape Quartz Resonator for High Q Realization (ポスター発表）

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan  2011

  • Optimal Size Determination of Electrodes for High Frequency Fundamental AT-cut Quartz Resonator using 3-D FEM (ポスター発表）

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan  2011

  • High Sensitivity Fiber-optic Fabry-perot Interferometer Temperature Sensor (ポスター発表）

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan  2011

  • Experimental and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending (口頭発表）

    22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France  2011

  • Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test (ポスター発表）

    22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France  2011

  • Board-level Solder Joint Reliability of Edge and Corner Bonded Lead-free Chip Scale Package Assemblies Subjected to Thermal Cycling (ポスター発表）

    2011 International Conference on Solid State Devices and Materials, Nagoya, Japan  2011

  • Thermomechanical Fatigue Performance of Lead-free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills (口頭発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Analysis of Edge and Corner Bonded PoP Bottom Package Reliability under Temperature Cycling Conditions by Experimental and Finite Element Methods (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Heat and Ultraviolet Dual-curable Edge Bonding Materials for Ball Grid Array Packages and the Impact on Solder Joint Reliability (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Drop Impact Reliability Improvement of Lead-free Array-based Package Assemblies with Different Board-level Underfills and Adhesives (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Experimental and Computational Characterization of Board-level Shear Behavior of PSvfBGA Assemblies with Edge and Corner Adhesives (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Halogen-free and Reworkable Corner Bond Adhesive for Array-based Packages and the Impact on Board-level Solder Joint Reliability (口頭発表）

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China  2011

  • Investigation of Various Board-level Underfills and Adhesives for CTBGA Bend Performance Enhancements in Lead-free Portable Electronic Products (口頭発表）

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China  2011

  • Thermal Cycling Reliability of Lead-free Package Stackable Very Thin Fine Pitch Ball Grid Array Assemblies with Reworkable Edge and Corner Bond Adhesives (ポスター発表）

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China  2011

  • USE OF A NEW ANISOTROPIC ETCHING SIMULATOR ON QUARTZ CRYSTAL (ポスター発表）

    The 16th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS' 11), Beijing, China  2011

  • On-Wafer-Packaging of Crystal Quartz Based Devises Using Low-Temperature Anodic Bonding（ (口頭発表＋ポスター発表）

    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2011) Aix-en-Provence, France  2011

  • Effects of Edge and Corner bond Adhesives on Board-level Shear Strength of Lead-free Package-on-Package Devices (口頭発表）

    2011 International Conference on Electronics Packaging, Nara, Japan  2011

  • Analysis of radially restored images for spherical single lens cellphone camera

    IEEE Sensors Journal, Vol.11, No.11 掲載決定  2011

  • U-Band Wavelength References Based on Photonic Bandgap Fiber Technology

    IEEE/OSA Journal of Lightwave Technology, Vol. 29, No. 19. pp. 2934-2939  2011

  • Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test

    Microelectronics Reliability, Vol.51, No.9-11, pp. 1898-1902  2011

  • Experimental and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending

    Microelectronics Reliability, Vol.51, No.9-11, pp. 1850-1855  2011

  • Bonding of silicon and crystal quartz wafers at the minimized residual stresses

    PRZEGL?D ELEKTROTECHNICZNY  2011

  • Design and Fabrication of Quartz Micro-Electro-Mechanical System-Based Double-Ended Tuning Fork with Variable Sections

    Japanese Journal of Applied Physics 50, 06GM06 1-4  2011

  • Doubled Optical Path Length for Photonic Bandgap Fiber Gas Cell Using Micromirror

    Japanese Journal of Applied Physics 50, 06GM01 1-4  2011

  • Diesel Particulate Analysis Using SEM-EDX and Laser-induced Breakdown Spectroscopy

    International Journal on Smart Sensing and Intelligent Systems Vol. 4, No. 2, pp174-188  2011

  • A Two-dimensional Anisotropic Wet Etching Simulator for Quartz Crystal

    IEEJ Transactions on Sensors and Micromachines Vol.131, No.5, pp.185-188  2011

  • Development of Carbonaceous Particle Size Analyzer Using Laser-induced Incandescence Technology

    IEEJ Transactions on Sensors and Micromachines Vol.131, No.5, pp.171-177  2011

  • Development of Hydrogen Gas Sensor Using Uqartz Resonator

    IEEJ Transactions on Sensors and Micromachines, Vol. 131, No.3, pp. 117-121  2011

  • イメージファイバーを用いた根管内観察システムの開発 (口頭発表）

    第64回 電気関係学会九州支部連合大会, 佐賀大学  2011

  • 二軸傾斜センサシステムの開発-ステップ１ (口頭発表）

    第64回 電気関係学会九州支部連合大会, 佐賀大学  2011

  • 2 軸静電容量型傾斜角センサの開発と評価 (口頭発表）

    第64回 電気関係学会九州支部連合大会, 佐賀大学  2011

  • MEMS 精密実装におけるフラックスレスリフローのプロセスの改善 (口頭発表）

    第64回 電気関係学会九州支部連合大会, 佐賀大学  2011

  • MEMS 技術を利用したPlano-convex 形状水晶振動子の開発 (口頭発表）

    第64回 電気関係学会九州支部連合大会, 佐賀大学  2011

  • High-Q を実現するための新たな形状の水晶振動子の研究 (口頭発表）

    第64回 電気関係学会九州支部連合大会, 佐賀大学  2011

  • LTCCコイルを用いた渦電流変位センサの開発 (口頭発表）

    第64回 電気関係学会九州支部連合大会, 佐賀大学  2011

  • アルゴンガス雰囲気におけるレーザー誘起ブレークダウン分光分析 (口頭発表）

    レーザー学会第148回研究会報告，レーザー応用, Kumamoto, Japan  2011

  • 高感度傾斜角センサ作製プロセスの改善とその評価 (口頭)

    平成23年 電気学会全国大会, 大阪大学  2011

  • リファレンス振動子により安定化したQCM匂いセンサ (口頭)

    平成23年 電気学会全国大会, 大阪大学  2011

  • The 2-D Vibration Analysis of Plano-convex AT-cut Quartz Resonator by FEM (口頭)

    平成23年 電気学会全国大会, 大阪大学  2011

  • Development of Slower Wet Etching Rates Measurement of α-Quartz (口頭)

    平成23年 電気学会全国大会, 大阪大学  2011

  • Low noise design of the 2-axis tilt sensor (口頭)

    平成23年 電気学会全国大会, 大阪大学  2011

  • An Oscillating Circuit development for Hydrogen Gas Sensors using Quartz resonators (口頭)

    平成23年 電気学会全国大会, 大阪大学  2011

  • Effects of Reworkable Edge and Corner Bond Adhesives on the Thermal Fatigue Performance of Lead-Free Chip Scale Package Assemblies

    Proceedings of 13th International Conference on. Electronics Materials and Packaging, pp. EMAP2011-20 (1-10)  2011

  • Investigation on the Optimum Sampling Rate of Strain Measurement during Printed Circuit Board (PCB) System Assembly

    Proceedings of the 13th Electronics Packaging Technology Conference, pp. 579-584  2011

  • Mitigation of Thermal Fatigue Failure in Fully Underfilled Lead-free Array-based Package Assemblies Using Partial Underfills

    Proceedings of the 13th Electronics Packaging Technology Conference, pp. 542-547  2011

  • Quartz Resonator Hydrogen Sensor Using Platinum Black

    Proceedings of the 2011 Fifth International Conference on Sensing Technology, pp. 587-590  2011

  • Quantitative Analysis of Silver Nanoparticle Ink using Laser-induced Breakdown Spectroscopy

    Proceedings of the 2011 Fifth International Conference on Sensing Technology, pp. 6-10, November 28  2011

  • High Frequency Plano-convex Resonator Fabricated by DRIE

    Technical Meeting on Electronic Circuits, pp. 43-46, Kyoto, Japan  2011

  • A Novel Method for Evaluating Triaxial Strain Gages Used in Printed Circuit Board Assemblies (PCBA) Strain Monitoring (ポスター発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Application of a 2-D Anisotropic Etching Simulator on Perforated Etching of Quartz Wafer (ポスター発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Size Optimization for High Frequency Quartz Resonator Using Finite Element Vibration Analysis (ポスター発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Sensing System for Quantitative Analysis of Metal Particles Using Laser-Induced Breakdown Spectroscopy (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • A Reliability of Silicon-Crystalline Quartz Bonding Through Reducing of the Residual Stresses (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Ultra-Small Imaging System for Cell Phone Camera Using Birefringent Lenses (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Alkanes Near-Infrared Spectrum Analysis Based on Hollow-Core Photonic Bandgap Fiber (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Vibration Analysis of Original Shape Quartz Resonator for High Q Realization (ポスター発表）

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan  2011

  • Optimal Size Determination of Electrodes for High Frequency Fundamental AT-cut Quartz Resonator using 3-D FEM (ポスター発表）

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan  2011

  • High Sensitivity Fiber-optic Fabry-perot Interferometer Temperature Sensor (ポスター発表）

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan  2011

  • Experimental and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending (口頭発表）

    22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France  2011

  • Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test (ポスター発表）

    22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France  2011

  • Board-level Solder Joint Reliability of Edge and Corner Bonded Lead-free Chip Scale Package Assemblies Subjected to Thermal Cycling (ポスター発表）

    2011 International Conference on Solid State Devices and Materials, Nagoya, Japan  2011

  • Thermomechanical Fatigue Performance of Lead-free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills (口頭発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Analysis of Edge and Corner Bonded PoP Bottom Package Reliability under Temperature Cycling Conditions by Experimental and Finite Element Methods (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Heat and Ultraviolet Dual-curable Edge Bonding Materials for Ball Grid Array Packages and the Impact on Solder Joint Reliability (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Drop Impact Reliability Improvement of Lead-free Array-based Package Assemblies with Different Board-level Underfills and Adhesives (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Experimental and Computational Characterization of Board-level Shear Behavior of PSvfBGA Assemblies with Edge and Corner Adhesives (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Halogen-free and Reworkable Corner Bond Adhesive for Array-based Packages and the Impact on Board-level Solder Joint Reliability (口頭発表）

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China  2011

  • Investigation of Various Board-level Underfills and Adhesives for CTBGA Bend Performance Enhancements in Lead-free Portable Electronic Products (口頭発表）

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China  2011

  • Thermal Cycling Reliability of Lead-free Package Stackable Very Thin Fine Pitch Ball Grid Array Assemblies with Reworkable Edge and Corner Bond Adhesives (ポスター発表）

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China  2011

  • USE OF A NEW ANISOTROPIC ETCHING SIMULATOR ON QUARTZ CRYSTAL (ポスター発表）

    The 16th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS' 11), Beijing, China  2011

  • On-Wafer-Packaging of Crystal Quartz Based Devises Using Low-Temperature Anodic Bonding（ (口頭発表＋ポスター発表）

    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2011) Aix-en-Provence, France  2011

  • Effects of Edge and Corner bond Adhesives on Board-level Shear Strength of Lead-free Package-on-Package Devices (口頭発表）

    2011 International Conference on Electronics Packaging, Nara, Japan  2011

  • Studies on the Bend Performance of Package Stackable Very Thin Fine Pitch Ball Grid Array Assemblies with Edge and Corner Bond Adhesives (oral)

    2011 International Conference on Solid-State and Integrated Circuit  2011

  • Effects of Edge and Corner Bond Adhesives on the Drop Reliability of Package-on-Package Bottom Package Assemblies (oral)

    2011 International Conference on Solid-State and Integrated Circuit  2011

  • A Real Double-convex Spherical Single Lens System with Blur Restoration Feature (oral)

    2011 International Conference on Communication and Electronics Information, Haikou, China  2011

  • Saturated Absorption Spectroscopy of Hydrocarbons Based on Photonic Bandgap Fiber (oral)

    2011 International Conference on Communication and Electronics Information, Haikou, China  2011

  • Analysis of radially restored images for spherical single lens cellphone camera

    IEEE Sensors Journal, Vol.11, No.11 掲載決定  2011

  • U-Band Wavelength References Based on Photonic Bandgap Fiber Technology

    IEEE/OSA Journal of Lightwave Technology, Vol. 29, No. 19. pp. 2934-2939  2011

  • Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test

    Microelectronics Reliability, Vol.51, No.9-11, pp. 1898-1902  2011

  • Experimental and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending

    Microelectronics Reliability, Vol.51, No.9-11, pp. 1850-1855  2011

  • Bonding of silicon and crystal quartz wafers at the minimized residual stresses

    PRZEGL?D ELEKTROTECHNICZNY  2011

  • Design and Fabrication of Quartz Micro-Electro-Mechanical System-Based Double-Ended Tuning Fork with Variable Sections

    Japanese Journal of Applied Physics 50, 06GM06 1-4  2011

  • Doubled Optical Path Length for Photonic Bandgap Fiber Gas Cell Using Micromirror

    Japanese Journal of Applied Physics 50, 06GM01 1-4  2011

  • Diesel Particulate Analysis Using SEM-EDX and Laser-induced Breakdown Spectroscopy

    International Journal on Smart Sensing and Intelligent Systems Vol. 4, No. 2, pp174-188  2011

  • A Two-dimensional Anisotropic Wet Etching Simulator for Quartz Crystal

    IEEJ Transactions on Sensors and Micromachines Vol.131, No.5, pp.185-188  2011

  • Development of Carbonaceous Particle Size Analyzer Using Laser-induced Incandescence Technology

    IEEJ Transactions on Sensors and Micromachines Vol.131, No.5, pp.171-177  2011

  • Deblur of radially variant blurred image for single lens system

    IEEJ Transactions on Electrical and Electronic Engineering, Special Issue: Special Issue on Electronics, Information and Systems, Volume 6, Issue S1, pages S7?S16, 2011  2011

  • Development of Hydrogen Gas Sensor Using Uqartz Resonator

    IEEJ Transactions on Sensors and Micromachines, Vol. 131, No.3, pp. 117-121  2011

  • Effects of Reworkable Edge and Corner Bond Adhesives on the Thermal Fatigue Performance of Lead-Free Chip Scale Package Assemblies

    Proceedings of 13th International Conference on. Electronics Materials and Packaging, pp. EMAP2011-20 (1-10)  2011

  • Investigation on the Optimum Sampling Rate of Strain Measurement during Printed Circuit Board (PCB) System Assembly

    Proceedings of the 13th Electronics Packaging Technology Conference, pp. 579-584  2011

  • Mitigation of Thermal Fatigue Failure in Fully Underfilled Lead-free Array-based Package Assemblies Using Partial Underfills

    Proceedings of the 13th Electronics Packaging Technology Conference, pp. 542-547  2011

  • Quartz Resonator Hydrogen Sensor Using Platinum Black

    Proceedings of the 2011 Fifth International Conference on Sensing Technology, pp. 587-590  2011

  • Quantitative Analysis of Silver Nanoparticle Ink using Laser-induced Breakdown Spectroscopy

    Proceedings of the 2011 Fifth International Conference on Sensing Technology, pp. 6-10, November 28  2011

  • High Frequency Plano-convex Resonator Fabricated by DRIE

    Technical Meeting on Electronic Circuits, pp. 43-46, Kyoto, Japan  2011

  • A Novel Method for Evaluating Triaxial Strain Gages Used in Printed Circuit Board Assemblies (PCBA) Strain Monitoring (ポスター発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Application of a 2-D Anisotropic Etching Simulator on Perforated Etching of Quartz Wafer (ポスター発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Size Optimization for High Frequency Quartz Resonator Using Finite Element Vibration Analysis (ポスター発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Sensing System for Quantitative Analysis of Metal Particles Using Laser-Induced Breakdown Spectroscopy (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • A Reliability of Silicon-Crystalline Quartz Bonding Through Reducing of the Residual Stresses (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Ultra-Small Imaging System for Cell Phone Camera Using Birefringent Lenses (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Alkanes Near-Infrared Spectrum Analysis Based on Hollow-Core Photonic Bandgap Fiber (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Vibration Analysis of Original Shape Quartz Resonator for High Q Realization (ポスター発表）

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan  2011

  • Optimal Size Determination of Electrodes for High Frequency Fundamental AT-cut Quartz Resonator using 3-D FEM (ポスター発表）

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan  2011

  • High Sensitivity Fiber-optic Fabry-perot Interferometer Temperature Sensor (ポスター発表）

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan  2011

  • Experimental and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending (口頭発表）

    22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France  2011

  • Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test (ポスター発表）

    22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France  2011

  • Board-level Solder Joint Reliability of Edge and Corner Bonded Lead-free Chip Scale Package Assemblies Subjected to Thermal Cycling (ポスター発表）

    2011 International Conference on Solid State Devices and Materials, Nagoya, Japan  2011

  • Thermomechanical Fatigue Performance of Lead-free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills (口頭発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Analysis of Edge and Corner Bonded PoP Bottom Package Reliability under Temperature Cycling Conditions by Experimental and Finite Element Methods (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Heat and Ultraviolet Dual-curable Edge Bonding Materials for Ball Grid Array Packages and the Impact on Solder Joint Reliability (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Drop Impact Reliability Improvement of Lead-free Array-based Package Assemblies with Different Board-level Underfills and Adhesives (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Experimental and Computational Characterization of Board-level Shear Behavior of PSvfBGA Assemblies with Edge and Corner Adhesives (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Halogen-free and Reworkable Corner Bond Adhesive for Array-based Packages and the Impact on Board-level Solder Joint Reliability (口頭発表）

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China  2011

  • Investigation of Various Board-level Underfills and Adhesives for CTBGA Bend Performance Enhancements in Lead-free Portable Electronic Products (口頭発表）

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China  2011

  • Thermal Cycling Reliability of Lead-free Package Stackable Very Thin Fine Pitch Ball Grid Array Assemblies with Reworkable Edge and Corner Bond Adhesives (ポスター発表）

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China  2011

  • USE OF A NEW ANISOTROPIC ETCHING SIMULATOR ON QUARTZ CRYSTAL (ポスター発表）

    The 16th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS' 11), Beijing, China  2011

  • On-Wafer-Packaging of Crystal Quartz Based Devises Using Low-Temperature Anodic Bonding（ (口頭発表＋ポスター発表）

    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2011) Aix-en-Provence, France  2011

  • Effects of Edge and Corner bond Adhesives on Board-level Shear Strength of Lead-free Package-on-Package Devices (口頭発表）

    2011 International Conference on Electronics Packaging, Nara, Japan  2011

  • Studies on the Bend Performance of Package Stackable Very Thin Fine Pitch Ball Grid Array Assemblies with Edge and Corner Bond Adhesives (oral)

    2011 International Conference on Solid-State and Integrated Circuit  2011

  • Effects of Edge and Corner Bond Adhesives on the Drop Reliability of Package-on-Package Bottom Package Assemblies (oral)

    2011 International Conference on Solid-State and Integrated Circuit  2011

  • A Real Double-convex Spherical Single Lens System with Blur Restoration Feature (oral)

    2011 International Conference on Communication and Electronics Information, Haikou, China  2011

  • Saturated Absorption Spectroscopy of Hydrocarbons Based on Photonic Bandgap Fiber (oral)

    2011 International Conference on Communication and Electronics Information, Haikou, China  2011

  • A Novel Method for Evaluating Triaxial Strain Gages Used in Printed Circuit Board Assemblies (PCBA) Strain Monitoring (ポスター発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Application of a 2-D Anisotropic Etching Simulator on Perforated Etching of Quartz Wafer (ポスター発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Size Optimization for High Frequency Quartz Resonator Using Finite Element Vibration Analysis (ポスター発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Sensing System for Quantitative Analysis of Metal Particles Using Laser-Induced Breakdown Spectroscopy (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • A Reliability of Silicon-Crystalline Quartz Bonding Through Reducing of the Residual Stresses (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Ultra-Small Imaging System for Cell Phone Camera Using Birefringent Lenses (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Alkanes Near-Infrared Spectrum Analysis Based on Hollow-Core Photonic Bandgap Fiber (口頭発表）

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND  2011

  • Vibration Analysis of Original Shape Quartz Resonator for High Q Realization (ポスター発表）

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan  2011

  • Optimal Size Determination of Electrodes for High Frequency Fundamental AT-cut Quartz Resonator using 3-D FEM (ポスター発表）

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan  2011

  • High Sensitivity Fiber-optic Fabry-perot Interferometer Temperature Sensor (ポスター発表）

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan  2011

  • Experimental and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending (口頭発表）

    22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France  2011

  • Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test (ポスター発表）

    22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France  2011

  • Board-level Solder Joint Reliability of Edge and Corner Bonded Lead-free Chip Scale Package Assemblies Subjected to Thermal Cycling (ポスター発表）

    2011 International Conference on Solid State Devices and Materials, Nagoya, Japan  2011

  • Thermomechanical Fatigue Performance of Lead-free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills (口頭発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Analysis of Edge and Corner Bonded PoP Bottom Package Reliability under Temperature Cycling Conditions by Experimental and Finite Element Methods (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Heat and Ultraviolet Dual-curable Edge Bonding Materials for Ball Grid Array Packages and the Impact on Solder Joint Reliability (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Drop Impact Reliability Improvement of Lead-free Array-based Package Assemblies with Different Board-level Underfills and Adhesives (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Experimental and Computational Characterization of Board-level Shear Behavior of PSvfBGA Assemblies with Edge and Corner Adhesives (ポスター発表）

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan  2011

  • Halogen-free and Reworkable Corner Bond Adhesive for Array-based Packages and the Impact on Board-level Solder Joint Reliability (口頭発表）

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China  2011

  • Investigation of Various Board-level Underfills and Adhesives for CTBGA Bend Performance Enhancements in Lead-free Portable Electronic Products (口頭発表）

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China  2011

  • Thermal Cycling Reliability of Lead-free Package Stackable Very Thin Fine Pitch Ball Grid Array Assemblies with Reworkable Edge and Corner Bond Adhesives (ポスター発表）

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China  2011

  • USE OF A NEW ANISOTROPIC ETCHING SIMULATOR ON QUARTZ CRYSTAL (ポスター発表）

    The 16th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS' 11), Beijing, China  2011

  • On-Wafer-Packaging of Crystal Quartz Based Devises Using Low-Temperature Anodic Bonding（ (口頭発表＋ポスター発表）

    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2011) Aix-en-Provence, France  2011

  • Effects of Edge and Corner bond Adhesives on Board-level Shear Strength of Lead-free Package-on-Package Devices (口頭発表）

    2011 International Conference on Electronics Packaging, Nara, Japan  2011

  • Analysis of radially restored images for spherical single lens cellphone camera

    IEEE Sensors Journal, Vol.11, No.11 掲載決定  2011

  • U-Band Wavelength References Based on Photonic Bandgap Fiber Technology

    IEEE/OSA Journal of Lightwave Technology, Vol. 29, No. 19. pp. 2934-2939  2011

  • Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test

    Microelectronics Reliability, Vol.51, No.9-11, pp. 1898-1902  2011

  • Experimental and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending

    Microelectronics Reliability, Vol.51, No.9-11, pp. 1850-1855  2011

  • Bonding of silicon and crystal quartz wafers at the minimized residual stresses

    PRZEGL?D ELEKTROTECHNICZNY  2011

  • Design and Fabrication of Quartz Micro-Electro-Mechanical System-Based Double-Ended Tuning Fork with Variable Sections

    Japanese Journal of Applied Physics 50, 06GM06 1-4  2011

  • Doubled Optical Path Length for Photonic Bandgap Fiber Gas Cell Using Micromirror

    Japanese Journal of Applied Physics 50, 06GM01 1-4  2011

  • Diesel Particulate Analysis Using SEM-EDX and Laser-induced Breakdown Spectroscopy

    International Journal on Smart Sensing and Intelligent Systems Vol. 4, No. 2, pp174-188  2011

  • A Two-dimensional Anisotropic Wet Etching Simulator for Quartz Crystal

    IEEJ Transactions on Sensors and Micromachines Vol.131, No.5, pp.185-188  2011

  • Development of Carbonaceous Particle Size Analyzer Using Laser-induced Incandescence Technology

    IEEJ Transactions on Sensors and Micromachines Vol.131, No.5, pp.171-177  2011

  • Development of Hydrogen Gas Sensor Using Uqartz Resonator

    IEEJ Transactions on Sensors and Micromachines, Vol. 131, No.3, pp. 117-121  2011

  • Doubled Optical Path Length for Photonic Bandgap Fiber Gas Cell using Micromirror (poster)

    23st International Microprocesses and Nanotechnology Conference, Kitakyushu, Japan  2010

  • Quartz MEMS based Double-Ended Tuning Fork with Variable sections (poster)

    23st International Microprocesses and Nanotechnology Conference, Kitakyushu, Japan  2010

  • Restoration of Radially Blurred Image Created by Spherical Single Lens System of Cell Phone Camer (poster)

    IEEE Sensors 2010 Conference, Hawaii, USA  2010

  • Development of Sensing System for Carbonaceous Particles Using LIBS Combined with LII Temporal Analytical Technique (oral)

    IEEE Sensors 2010 Conference, Hawaii, USA  2010

  • Low-Temperature Anodic Bonding of Silicon and Crystal Quartz Wafers for MEMS Application (poster)

    IEEE Sensors 2010 Conference, Hawaii, USA  2010

  • Anisotropic Etching Simulator for Quartz Crystal and Its Application to Design Micro-mechanical Device (oral)

    2010 China International Symposium on Inertial Technology and Navigation, Nanjing, China  2010

  • Fabrication Process Improvement for High Sensitivity Tilt Sensor (poster)

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan  2010

  • Hydrogen Gas Sensors using Quartz Resonator (poster)

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan  2010

  • Development of a sensing system for carbonaceous particles using laser-induced incandescence technology (poster)

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan  2010

  • A Two-dimensional Anisotropic Wet Etching Simulator for Quartz Crystal (poster)

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan  2010

  • Process Development of Silver Conductor wiring on packages using Inkjet Printer (口頭)

    The 63rd Joint Conference of Electrical and Electronics Engineers in Kyushu, Kyushu Sangyo University  2010

  • Basic Research on Diesel Particulate Matter for Establishing Laser-induced Breakdown Spectroscopy Analysis Method (Presentation Award; oral)

    4th International Conference on Sensing Technology (ICST 2010), Lecce, Italy  2010

  • Deblur of radially variant blurred image for single lens system

    IEEJ Transactions on Electrical and Electronic Engineering, Special Issue: Special Issue on Electronics, Information and Systems, Volume 6, Issue S1, pages S7?S16, 2011  2010

  • Design of a Singlet Lens and the Corresponding Aberration Correction Approaches for Cell Phone Camera

    IEEJ Transactions on electrical and electronic engineering, Vol. 5, pp. 474-485  2010

  • Sensing of Carbon Dioxide and Hydrocarbons Using Photonic Bandgap Fiber

    Solid State Phenomena (Vol. 165), Mechatronic Systems and Materials: Materials Production Technologies, pp. 316-320  2010

  • Measurement of Low gas concentrations Using Photonic Bandgap Fiber Cell

    IEEE sensors Journal, Vol. 10, No. 6, pp. 1156-1161, (6/2010)  2010

  • Field-Dependent Distortion Coefficient and Backward Mapping for Distortion Correction of Singlet Lens Cameras

    IEEJ Transactions on electrical and electronic engineering, published by John Wiley and Sons, Inc, Vol.5, No.2, pp203-210  2010

  • Differential Platinum Thin Film Hydrogen Gas Sensor Fabricated by MEMS Techniques

    IEEJ Transactions on Sensors and Micromachines, Vol.130, No.3, pp65-68  2010

  • 白金黒を応用した水晶振動子型水素センサの研究 (口頭)

    第63回 電気関係学会九州支部連合大会, 九州産業大学  2010

  • 高感度傾斜角センサダンピング特性と音叉振動子を用いたパッケージのリークレート測定 (口頭)

    第63回 電気関係学会九州支部連合大会, 九州産業大学  2010

  • 高感度傾斜角センサ作製における金属薄膜形成プロセスの改善 (口頭)

    第63回 電気関係学会九州支部連合大会, 九州産業大学  2010

  • Doubled Optical Path Length for Photonic Bandgap Fiber Gas Cell using Micromirror (poster)

    23st International Microprocesses and Nanotechnology Conference, Kitakyushu, Japan  2010

  • Quartz MEMS based Double-Ended Tuning Fork with Variable sections (poster)

    23st International Microprocesses and Nanotechnology Conference, Kitakyushu, Japan  2010

  • Restoration of Radially Blurred Image Created by Spherical Single Lens System of Cell Phone Camer (poster)

    IEEE Sensors 2010 Conference, Hawaii, USA  2010

  • Development of Sensing System for Carbonaceous Particles Using LIBS Combined with LII Temporal Analytical Technique (oral)

    IEEE Sensors 2010 Conference, Hawaii, USA  2010

  • Low-Temperature Anodic Bonding of Silicon and Crystal Quartz Wafers for MEMS Application (poster)

    IEEE Sensors 2010 Conference, Hawaii, USA  2010

  • Anisotropic Etching Simulator for Quartz Crystal and Its Application to Design Micro-mechanical Device (oral)

    2010 China International Symposium on Inertial Technology and Navigation, Nanjing, China  2010

  • Fabrication Process Improvement for High Sensitivity Tilt Sensor (poster)

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan  2010

  • Hydrogen Gas Sensors using Quartz Resonator (poster)

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan  2010

  • Development of a sensing system for carbonaceous particles using laser-induced incandescence technology (poster)

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan  2010

  • A Two-dimensional Anisotropic Wet Etching Simulator for Quartz Crystal (poster)

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan  2010

  • Process Development of Silver Conductor wiring on packages using Inkjet Printer (口頭)

    The 63rd Joint Conference of Electrical and Electronics Engineers in Kyushu, Kyushu Sangyo University  2010

  • Basic Research on Diesel Particulate Matter for Establishing Laser-induced Breakdown Spectroscopy Analysis Method (Presentation Award; oral)

    4th International Conference on Sensing Technology (ICST 2010), Lecce, Italy  2010

  • Design of a Singlet Lens and the Corresponding Aberration Correction Approaches for Cell Phone Camera

    IEEJ Transactions on electrical and electronic engineering, Vol. 5, pp. 474-485  2010

  • Sensing of Carbon Dioxide and Hydrocarbons Using Photonic Bandgap Fiber

    Solid State Phenomena (Vol. 165), Mechatronic Systems and Materials: Materials Production Technologies, pp. 316-320  2010

  • Measurement of Low gas concentrations Using Photonic Bandgap Fiber Cell

    IEEE sensors Journal, Vol. 10, No. 6, pp. 1156-1161, (6/2010)  2010

  • Field-Dependent Distortion Coefficient and Backward Mapping for Distortion Correction of Singlet Lens Cameras

    IEEJ Transactions on electrical and electronic engineering, published by John Wiley and Sons, Inc, Vol.5, No.2, pp203-210  2010

  • Differential Platinum Thin Film Hydrogen Gas Sensor Fabricated by MEMS Techniques

    IEEJ Transactions on Sensors and Micromachines, Vol.130, No.3, pp65-68  2010

  • Doubled Optical Path Length for Photonic Bandgap Fiber Gas Cell using Micromirror (poster)

    23st International Microprocesses and Nanotechnology Conference, Kitakyushu, Japan  2010

  • Quartz MEMS based Double-Ended Tuning Fork with Variable sections (poster)

    23st International Microprocesses and Nanotechnology Conference, Kitakyushu, Japan  2010

  • Restoration of Radially Blurred Image Created by Spherical Single Lens System of Cell Phone Camer (poster)

    IEEE Sensors 2010 Conference, Hawaii, USA  2010

  • Development of Sensing System for Carbonaceous Particles Using LIBS Combined with LII Temporal Analytical Technique (oral)

    IEEE Sensors 2010 Conference, Hawaii, USA  2010

  • Low-Temperature Anodic Bonding of Silicon and Crystal Quartz Wafers for MEMS Application (poster)

    IEEE Sensors 2010 Conference, Hawaii, USA  2010

  • Anisotropic Etching Simulator for Quartz Crystal and Its Application to Design Micro-mechanical Device (oral)

    2010 China International Symposium on Inertial Technology and Navigation, Nanjing, China  2010

  • Fabrication Process Improvement for High Sensitivity Tilt Sensor (poster)

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan  2010

  • Hydrogen Gas Sensors using Quartz Resonator (poster)

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan  2010

  • Development of a sensing system for carbonaceous particles using laser-induced incandescence technology (poster)

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan  2010

  • A Two-dimensional Anisotropic Wet Etching Simulator for Quartz Crystal (poster)

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan  2010

  • Process Development of Silver Conductor wiring on packages using Inkjet Printer (口頭)

    The 63rd Joint Conference of Electrical and Electronics Engineers in Kyushu, Kyushu Sangyo University  2010

  • Basic Research on Diesel Particulate Matter for Establishing Laser-induced Breakdown Spectroscopy Analysis Method (Presentation Award; oral)

    4th International Conference on Sensing Technology (ICST 2010), Lecce, Italy  2010

  • Deblur of radially variant blurred image for single lens system

    IEEJ Transactions on Electrical and Electronic Engineering, Special Issue: Special Issue on Electronics, Information and Systems, Volume 6, Issue S1, pages S7?S16, 2011  2010

  • Design of a Singlet Lens and the Corresponding Aberration Correction Approaches for Cell Phone Camera

    IEEJ Transactions on electrical and electronic engineering, Vol. 5, pp. 474-485  2010

  • Sensing of Carbon Dioxide and Hydrocarbons Using Photonic Bandgap Fiber

    Solid State Phenomena (Vol. 165), Mechatronic Systems and Materials: Materials Production Technologies, pp. 316-320  2010

  • Measurement of Low gas concentrations Using Photonic Bandgap Fiber Cell

    IEEE sensors Journal, Vol. 10, No. 6, pp. 1156-1161, (6/2010)  2010

  • Field-Dependent Distortion Coefficient and Backward Mapping for Distortion Correction of Singlet Lens Cameras

    IEEJ Transactions on electrical and electronic engineering, published by John Wiley and Sons, Inc, Vol.5, No.2, pp203-210  2010

  • Differential Platinum Thin Film Hydrogen Gas Sensor Fabricated by MEMS Techniques

    IEEJ Transactions on Sensors and Micromachines, Vol.130, No.3, pp65-68  2010

  • Hydrogen gas sensor using quartz resonator

    The 8th IEEE Conference on Sensors, Proceedings, (B4P-005)pp., Christchurch, NewZealand, October 25-28, 2009  2009

  • Sensing of carbon dioxide and hydrocarbons using photonic bandgap fiber

    The 5th International Conference Mechatronic Systems and Materials (MSM 2009) 22-25 October 2009, Vilnius, Lithuania  2009

  • Sensing of Ammonia and Hydrocarbons Using Photonic Bandgap Fiber Cell

    (P-5-8) pp., Proceedings of the 26th Sensor Symposium on Sensors, Micromachines and Applied System, October 15-16, 2009, Tokyo, Japan  2009

  • Development of the Miniaturized Eddy Current Displacement Sensor Using MEMS Coil

    pp.,4-14, Proceedings of the 26th Sensor Symposium on Sensors, Micromachines and Applied System, October 15-16, 2009, Tokyo, Japan  2009

  • Sensor for measurement of hydrocarbons concentration based on optic fiber

    Optical Measurement Systems for Industrial Inspection VI, Munich, Germany  2009

  • CHARACTERIZATION OF A QUARTZ MEMS TILT SENSOR WITH 0.001° PRECISION

    he 15th International Conference on Solid-State Sensors, Actuators & Microsystems (Transducers 2009)  2009

  • Control of a Micro-Droplet for Laser-induced Breakdown Spectroscopy Solution Measurement

    Solid State Phenomena Vols. 147-149 , pp 639-644  2009

  • High- Precision Gas Sensor Based on Photonic Bandgap Fiber Cell

    Solid State Phenomena Vols. 147-149, pp 131-136  2009

  • PBG Fiber Low Concentration Gas Sensor

    Solid State Phenomena Vol. 144 ,pp 163-168  2009

  • Fabrication of Photonic Bandgap Fiber Gas Cell Using Focused Ion Beam Cutting

    Japanese Journal of Applied Physics 48 , 06FK05-1 - 06FK05-5  2009

  • Development of Highly Integrated Quartz Micro-Electro-Mechanical System Tilt Sensor

    Japanese Journal of Applied Physics 48, pp. 06FK10-1 - 06FK10-4  2009

  • Gas sensor based on microstructured optic fiber

    PRZEGLAD ELEKTROTECHNICZNY, pp.115-117  2009

  • フォトニックバンドギャップファイバーを用いた微量気体のレーザー分光",

    IEEJ Transactions on Sensors and Micromachines, Vol.129, No.6, June 2009, pp189-193  2009

  • Improved MEMS structure for stress-free flip-chip packaging

    J. Micro/Nanolith. MEMS MOEMS, Vol. 8, pp. 021118-1 - 021118-5  2009

  • Sensing System for Multiple Measurements of Trace Elements Using Laser-Induced Breakdown Spectroscopy

    IEEJ Transactions on Sensors and Micromachines, Vol.129, No.4, April 2009, pp115-119  2009

  • Control of a Micro-Droplet for Laser-Induced Breakdown Spectroscopy Solution Measurement

    Solid State Phenomena  2009

  • PBG Fiber Low Concentration Gas Sensor

    Solid State Phenomena, Vol.144, pp.163-168  2009

  • Hydrogen gas sensor using quartz resonator

    The 8th IEEE Conference on Sensors, Proceedings, (B4P-005)pp., Christchurch, NewZealand, October 25-28, 2009  2009

  • Sensing of carbon dioxide and hydrocarbons using photonic bandgap fiber

    The 5th International Conference Mechatronic Systems and Materials (MSM 2009) 22-25 October 2009, Vilnius, Lithuania  2009

  • Sensing of Ammonia and Hydrocarbons Using Photonic Bandgap Fiber Cell

    (P-5-8) pp., Proceedings of the 26th Sensor Symposium on Sensors, Micromachines and Applied System, October 15-16, 2009, Tokyo, Japan  2009

  • Development of the Miniaturized Eddy Current Displacement Sensor Using MEMS Coil

    pp.,4-14, Proceedings of the 26th Sensor Symposium on Sensors, Micromachines and Applied System, October 15-16, 2009, Tokyo, Japan  2009

  • Sensor for measurement of hydrocarbons concentration based on optic fiber

    Optical Measurement Systems for Industrial Inspection VI, Munich, Germany  2009

  • CHARACTERIZATION OF A QUARTZ MEMS TILT SENSOR WITH 0.001° PRECISION

    he 15th International Conference on Solid-State Sensors, Actuators & Microsystems (Transducers 2009)  2009

  • Control of a Micro-Droplet for Laser-induced Breakdown Spectroscopy Solution Measurement

    Solid State Phenomena Vols. 147-149 , pp 639-644  2009

  • High- Precision Gas Sensor Based on Photonic Bandgap Fiber Cell

    Solid State Phenomena Vols. 147-149, pp 131-136  2009

  • PBG Fiber Low Concentration Gas Sensor

    Solid State Phenomena Vol. 144 ,pp 163-168  2009

  • Fabrication of Photonic Bandgap Fiber Gas Cell Using Focused Ion Beam Cutting

    Japanese Journal of Applied Physics 48 , 06FK05-1 - 06FK05-5  2009

  • Development of Highly Integrated Quartz Micro-Electro-Mechanical System Tilt Sensor

    Japanese Journal of Applied Physics 48, pp. 06FK10-1 - 06FK10-4  2009

  • Gas sensor based on microstructured optic fiber

    PRZEGLAD ELEKTROTECHNICZNY, pp.115-117  2009

  • フォトニックバンドギャップファイバーを用いた微量気体のレーザー分光",

    IEEJ Transactions on Sensors and Micromachines, Vol.129, No.6, June 2009, pp189-193  2009

  • Improved MEMS structure for stress-free flip-chip packaging

    J. Micro/Nanolith. MEMS MOEMS, Vol. 8, pp. 021118-1 - 021118-5  2009

  • Sensing System for Multiple Measurements of Trace Elements Using Laser-Induced Breakdown Spectroscopy

    IEEJ Transactions on Sensors and Micromachines, Vol.129, No.4, April 2009, pp115-119  2009

  • Control of a Micro-Droplet for Laser-Induced Breakdown Spectroscopy Solution Measurement

    Solid State Phenomena  2009

  • PBG Fiber Low Concentration Gas Sensor

    Solid State Phenomena, Vol.144, pp.163-168  2009

  • Hydrogen gas sensor using quartz resonator

    The 8th IEEE Conference on Sensors, Proceedings, (B4P-005)pp., Christchurch, NewZealand, October 25-28, 2009  2009

  • Sensing of carbon dioxide and hydrocarbons using photonic bandgap fiber

    The 5th International Conference Mechatronic Systems and Materials (MSM 2009) 22-25 October 2009, Vilnius, Lithuania  2009

  • Sensing of Ammonia and Hydrocarbons Using Photonic Bandgap Fiber Cell

    (P-5-8) pp., Proceedings of the 26th Sensor Symposium on Sensors, Micromachines and Applied System, October 15-16, 2009, Tokyo, Japan  2009

  • Development of the Miniaturized Eddy Current Displacement Sensor Using MEMS Coil

    pp.,4-14, Proceedings of the 26th Sensor Symposium on Sensors, Micromachines and Applied System, October 15-16, 2009, Tokyo, Japan  2009

  • Sensor for measurement of hydrocarbons concentration based on optic fiber

    Optical Measurement Systems for Industrial Inspection VI, Munich, Germany  2009

  • CHARACTERIZATION OF A QUARTZ MEMS TILT SENSOR WITH 0.001° PRECISION

    he 15th International Conference on Solid-State Sensors, Actuators & Microsystems (Transducers 2009)  2009

  • Control of a Micro-Droplet for Laser-induced Breakdown Spectroscopy Solution Measurement

    Solid State Phenomena Vols. 147-149 , pp 639-644  2009

  • High- Precision Gas Sensor Based on Photonic Bandgap Fiber Cell

    Solid State Phenomena Vols. 147-149, pp 131-136  2009

  • PBG Fiber Low Concentration Gas Sensor

    Solid State Phenomena Vol. 144 ,pp 163-168  2009

  • Fabrication of Photonic Bandgap Fiber Gas Cell Using Focused Ion Beam Cutting

    Japanese Journal of Applied Physics 48 , 06FK05-1 - 06FK05-5  2009

  • Development of Highly Integrated Quartz Micro-Electro-Mechanical System Tilt Sensor

    Japanese Journal of Applied Physics 48, pp. 06FK10-1 - 06FK10-4  2009

  • Gas sensor based on microstructured optic fiber

    PRZEGLAD ELEKTROTECHNICZNY, pp.115-117  2009

  • フォトニックバンドギャップファイバーを用いた微量気体のレーザー分光",

    IEEJ Transactions on Sensors and Micromachines, Vol.129, No.6, June 2009, pp189-193  2009

  • Improved MEMS structure for stress-free flip-chip packaging

    J. Micro/Nanolith. MEMS MOEMS, Vol. 8, pp. 021118-1 - 021118-5  2009

  • Sensing System for Multiple Measurements of Trace Elements Using Laser-Induced Breakdown Spectroscopy

    IEEJ Transactions on Sensors and Micromachines, Vol.129, No.4, April 2009, pp115-119  2009

  • Control of a Micro-Droplet for Laser-Induced Breakdown Spectroscopy Solution Measurement

    Solid State Phenomena  2009

  • PBG Fiber Low Concentration Gas Sensor

    Solid State Phenomena, Vol.144, pp.163-168  2009

  • Fabrication of Photonic Bandgap Fiber Gas Cell using Focused Ion Beam Cutting Technique

    The 21st International Microprocesses and Nanotechnology Conference, JAL Resort Sea Hawk Hotel Fukuoka, Japan, pp.(29D-9-156)  2008

  • Distortion Correction and Local Deblurring for Distorted and Blurred Images Projected from Two-dimensional Object

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa, Japan, pp (p-3-4),  2008

  • A Novel Low-loss Splice For Photonic Bandgap Fiber Gas Sensor

    The 7th IEEE Conference on Sensors, Lecce, Italy, pp.1289-1292  2008

  • Ultratrace Measurement Using Micro-droplet With Gas-flow Assistance in Laser-induced Breakdown Spectroscopy

    The 7th IEEE Conference on Sensors, Lecce, Italy, pp.977-980  2008

  • Microstructured Optic Fiber Cell Sensor For Low Concentration Gas Measurement

    The 7th IEEE Conference on Sensors, Lecce, Italy, pp.922-925  2008

  • Application on Monte Carlo Method to X-ray Fluorescence Meter

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa, Japan, pp.451-454,  2008

  • Photonic Bandgap Fiber Cell Sensor for Ammonia Gas Measurement

    pp.357-360, Proceedings of the 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa,  2008

  • Sensing System for LIBS Multiple Measurements of Trace Elements

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa Japan, pp.307-311  2008

  • GEOMETRICALLY DISTORTED IMAGE CORRECTION FOR SINGLE LENS USING DECIMAL NUMBER MAPPING

    The 10th IASTED International Conference SIGNAL AND IMAGE PROCESSING (SIP 2008), Kailua-Kona, HI, USA, pp.26-31,  2008

  • Control of a Micro-Droplet for Laser-Induced Breakdown Spectroscopy Solution Measurement

    The 4th International Conference Mechatronic Systems and Materials, Bialystok, Poland, pp.210-211  2008

  • High-Precision Gas Sensor Based on Photonic Bandgap Fiber Cell

    The 4th International Conference Mechatronic Systems and Materials, Bialystok, Poland, pp.54-55,  2008

  • DESIGN OF PHOTONIC BANDGAP FIBER CELL GAS SENSOR

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University, (pp. (Poster Session(1)261-264)) 22-25  2008

  • "STRESS FREE FLIP CHIP PACKAGED QUARTZ MEMS CAPACITIVE TILT SENSOR",

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University, (pp.(Poster Session(1)166-169)), 22-25  2008

  • DIFFERENTIAL PLATINUM THIN FILM HYDROGEN GAS SENSOR FABRICATED BY MEMS TECHNIQUES

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University, pp.(Oral Session(3)132-135), 22-25  2008

  • Case Analysis Oriented Interpolation and a Two-Step Interpolation after Correction of Barrel Distortion and Lateral Chromatic Aberration

    , IEEJ Transactions on Sensors and Micromachines, Vol.128, No.11,  2008

  • Thermo-Resistive Platinum Thin Film Hydrogen Gas Sensor Fabricated by MEMS Techniques,

    IEEJ Transactions on Sensors and Micromachines, Vol.128, No.9, pp.347-351,  2008

  • Improvement of a Micro-Droplet Guiding Technique for Laser-Induced Breakdown Spectroscopy

    IEEJ Transactions on Sensors and Micromachines, Vol.128, No.7, pp.297-301  2008

  • Low Concentration Gas Measurement Using Photonic Bandgap Fiber Cell Sensor

    IEEJ Transactions on Sensors and Micromachines, Vol.128, No.5, pp.198-202,  2008

  • Improved bi-layer lift-off process for MEMS applications

    Microelectronic Engineering Volume 85, Issue 5-6, Elsevier Science Ltd. Oxford, UK, pp.1000-1003,  2008

  • Sensing Technique Using Laser-induced Breakdown Spectroscopy Integrated with Micro-droplet Ejection System

    Sensors and Transducers Journal, Volume.90, Special Issue on Modern Sensing Technologies,  2008

  • Fabrication of Photonic Bandgap Fiber Gas Cell using Focused Ion Beam Cutting Technique

    The 21st International Microprocesses and Nanotechnology Conference, JAL Resort Sea Hawk Hotel Fukuoka, Japan, pp.(29D-9-156)  2008

  • Distortion Correction and Local Deblurring for Distorted and Blurred Images Projected from Two-dimensional Object

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa, Japan, pp (p-3-4),  2008

  • A Novel Low-loss Splice For Photonic Bandgap Fiber Gas Sensor

    The 7th IEEE Conference on Sensors, Lecce, Italy, pp.1289-1292  2008

  • Ultratrace Measurement Using Micro-droplet With Gas-flow Assistance in Laser-induced Breakdown Spectroscopy

    The 7th IEEE Conference on Sensors, Lecce, Italy, pp.977-980  2008

  • Microstructured Optic Fiber Cell Sensor For Low Concentration Gas Measurement

    The 7th IEEE Conference on Sensors, Lecce, Italy, pp.922-925  2008

  • Application on Monte Carlo Method to X-ray Fluorescence Meter

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa, Japan, pp.451-454,  2008

  • Photonic Bandgap Fiber Cell Sensor for Ammonia Gas Measurement

    pp.357-360, Proceedings of the 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa,  2008

  • Sensing System for LIBS Multiple Measurements of Trace Elements

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa Japan, pp.307-311  2008

  • GEOMETRICALLY DISTORTED IMAGE CORRECTION FOR SINGLE LENS USING DECIMAL NUMBER MAPPING

    The 10th IASTED International Conference SIGNAL AND IMAGE PROCESSING (SIP 2008), Kailua-Kona, HI, USA, pp.26-31,  2008

  • Control of a Micro-Droplet for Laser-Induced Breakdown Spectroscopy Solution Measurement

    The 4th International Conference Mechatronic Systems and Materials, Bialystok, Poland, pp.210-211  2008

  • High-Precision Gas Sensor Based on Photonic Bandgap Fiber Cell

    The 4th International Conference Mechatronic Systems and Materials, Bialystok, Poland, pp.54-55,  2008

  • DESIGN OF PHOTONIC BANDGAP FIBER CELL GAS SENSOR

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University, (pp. (Poster Session(1)261-264)) 22-25  2008

  • "STRESS FREE FLIP CHIP PACKAGED QUARTZ MEMS CAPACITIVE TILT SENSOR",

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University, (pp.(Poster Session(1)166-169)), 22-25  2008

  • DIFFERENTIAL PLATINUM THIN FILM HYDROGEN GAS SENSOR FABRICATED BY MEMS TECHNIQUES

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University, pp.(Oral Session(3)132-135), 22-25  2008

  • Gas sensor based on PBG fiber: possibilities and limitations

    ,Proceedings of SPIE -- Volume 7004, International Conference on Optical Fiber Sensors (14th-18th April 2008 in Perth, Western Australia), David D. Sampson, Editor, 70044R  2008

  • Case Analysis Oriented Interpolation and a Two-Step Interpolation after Correction of Barrel Distortion and Lateral Chromatic Aberration

    , IEEJ Transactions on Sensors and Micromachines, Vol.128, No.11,  2008

  • Thermo-Resistive Platinum Thin Film Hydrogen Gas Sensor Fabricated by MEMS Techniques,

    IEEJ Transactions on Sensors and Micromachines, Vol.128, No.9, pp.347-351,  2008

  • Improvement of a Micro-Droplet Guiding Technique for Laser-Induced Breakdown Spectroscopy

    IEEJ Transactions on Sensors and Micromachines, Vol.128, No.7, pp.297-301  2008

  • Low Concentration Gas Measurement Using Photonic Bandgap Fiber Cell Sensor

    IEEJ Transactions on Sensors and Micromachines, Vol.128, No.5, pp.198-202,  2008

  • Improved bi-layer lift-off process for MEMS applications

    Microelectronic Engineering Volume 85, Issue 5-6, Elsevier Science Ltd. Oxford, UK, pp.1000-1003,  2008

  • Sensing Technique Using Laser-induced Breakdown Spectroscopy Integrated with Micro-droplet Ejection System

    Sensors and Transducers Journal, Volume.90, Special Issue on Modern Sensing Technologies,  2008

  • Fabrication of Photonic Bandgap Fiber Gas Cell using Focused Ion Beam Cutting Technique

    The 21st International Microprocesses and Nanotechnology Conference, JAL Resort Sea Hawk Hotel Fukuoka, Japan, pp.(29D-9-156)  2008

  • Distortion Correction and Local Deblurring for Distorted and Blurred Images Projected from Two-dimensional Object

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa, Japan, pp (p-3-4),  2008

  • A Novel Low-loss Splice For Photonic Bandgap Fiber Gas Sensor

    The 7th IEEE Conference on Sensors, Lecce, Italy, pp.1289-1292  2008

  • Ultratrace Measurement Using Micro-droplet With Gas-flow Assistance in Laser-induced Breakdown Spectroscopy

    The 7th IEEE Conference on Sensors, Lecce, Italy, pp.977-980  2008

  • Microstructured Optic Fiber Cell Sensor For Low Concentration Gas Measurement

    The 7th IEEE Conference on Sensors, Lecce, Italy, pp.922-925  2008

  • Application on Monte Carlo Method to X-ray Fluorescence Meter

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa, Japan, pp.451-454,  2008

  • Photonic Bandgap Fiber Cell Sensor for Ammonia Gas Measurement

    pp.357-360, Proceedings of the 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa,  2008

  • Sensing System for LIBS Multiple Measurements of Trace Elements

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa Japan, pp.307-311  2008

  • GEOMETRICALLY DISTORTED IMAGE CORRECTION FOR SINGLE LENS USING DECIMAL NUMBER MAPPING

    The 10th IASTED International Conference SIGNAL AND IMAGE PROCESSING (SIP 2008), Kailua-Kona, HI, USA, pp.26-31,  2008

  • Control of a Micro-Droplet for Laser-Induced Breakdown Spectroscopy Solution Measurement

    The 4th International Conference Mechatronic Systems and Materials, Bialystok, Poland, pp.210-211  2008

  • High-Precision Gas Sensor Based on Photonic Bandgap Fiber Cell

    The 4th International Conference Mechatronic Systems and Materials, Bialystok, Poland, pp.54-55,  2008

  • DESIGN OF PHOTONIC BANDGAP FIBER CELL GAS SENSOR

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University, (pp. (Poster Session(1)261-264)) 22-25  2008

  • "STRESS FREE FLIP CHIP PACKAGED QUARTZ MEMS CAPACITIVE TILT SENSOR",

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University, (pp.(Poster Session(1)166-169)), 22-25  2008

  • DIFFERENTIAL PLATINUM THIN FILM HYDROGEN GAS SENSOR FABRICATED BY MEMS TECHNIQUES

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University, pp.(Oral Session(3)132-135), 22-25  2008

  • Case Analysis Oriented Interpolation and a Two-Step Interpolation after Correction of Barrel Distortion and Lateral Chromatic Aberration

    , IEEJ Transactions on Sensors and Micromachines, Vol.128, No.11,  2008

  • Thermo-Resistive Platinum Thin Film Hydrogen Gas Sensor Fabricated by MEMS Techniques,

    IEEJ Transactions on Sensors and Micromachines, Vol.128, No.9, pp.347-351,  2008

  • Improvement of a Micro-Droplet Guiding Technique for Laser-Induced Breakdown Spectroscopy

    IEEJ Transactions on Sensors and Micromachines, Vol.128, No.7, pp.297-301  2008

  • Low Concentration Gas Measurement Using Photonic Bandgap Fiber Cell Sensor

    IEEJ Transactions on Sensors and Micromachines, Vol.128, No.5, pp.198-202,  2008

  • Improved bi-layer lift-off process for MEMS applications

    Microelectronic Engineering Volume 85, Issue 5-6, Elsevier Science Ltd. Oxford, UK, pp.1000-1003,  2008

  • Sensing Technique Using Laser-induced Breakdown Spectroscopy Integrated with Micro-droplet Ejection System

    Sensors and Transducers Journal, Volume.90, Special Issue on Modern Sensing Technologies,  2008

  • Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Paw?at and Toshitsugu Ueda

    IEEE SENSORS 2007 Conference  2007

  • Application on Monte Carlo Method to X-ray Fluorescence Analysis

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Case Analysis Oriented Interpolation and a Two-step Interpolation after Correction of Barrel Distortion and Lateral Chromatic Aberration

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Thermo-resistive Platinum Thin Film Hydrogen Gas Sensor Fabricated by MEMS Techniques

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Fabrication of Two-axis Quartz MEMS-based Capacitive Tilt Sensor

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Tilt Sensor System Using MEMS Device and CMOS Technology

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Low Concentration Gas Measurement Using Photonic Bandgap Fiber Cell Sensor

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Improvement of a Micro-Droplet Guiding Technique for Laser-Induced Breakdown Spectroscopy

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Particle Element and Size Stimutaneous Measurement Using LIBS

    IEEJ Trana. SM  2007

  • Development of a source-drain electrode coated with an insulation layer for detecting concenttation changes in a nitrate ion solution

    Sensors and Actuators B Chemical  2007

  • Development of Solution Measurement Using Laser-Induced Breakdown Spectroscopy Integrated with Micro-Droplet Ejection System

    IEEJ Trana. SM  2007

  • Wet Etched High Aspect Ratio Microstructures on Quartz for MEMS Application

    IEEJ Trana. SM  2007

  • Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Paw?at and Toshitsugu Ueda

    IEEE SENSORS 2007 Conference  2007

  • Application on Monte Carlo Method to X-ray Fluorescence Analysis

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Case Analysis Oriented Interpolation and a Two-step Interpolation after Correction of Barrel Distortion and Lateral Chromatic Aberration

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Thermo-resistive Platinum Thin Film Hydrogen Gas Sensor Fabricated by MEMS Techniques

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Fabrication of Two-axis Quartz MEMS-based Capacitive Tilt Sensor

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Tilt Sensor System Using MEMS Device and CMOS Technology

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Low Concentration Gas Measurement Using Photonic Bandgap Fiber Cell Sensor

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Improvement of a Micro-Droplet Guiding Technique for Laser-Induced Breakdown Spectroscopy

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • 水晶マイクロ加工による高感度傾斜センサ

    電気学会論文誌E  2007

  • Particle Element and Size Stimutaneous Measurement Using LIBS

    電気学会論文誌E  2007

  • Development of a source-drain electrode coated with an insulation layer for detecting concenttation changes in a nitrate ion solution

    Sensors and Actuators B Chemical  2007

  • Development of Solution Measurement Using Laser-Induced Breakdown Spectroscopy Integrated with Micro-Droplet Ejection System

    電気学会論文誌E  2007

  • Wet Etched High Aspect Ratio Microstructures on Quartz for MEMS Application

    電気学会論文誌E  2007

  • Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Paw?at and Toshitsugu Ueda

    IEEE SENSORS 2007 Conference  2007

  • Application on Monte Carlo Method to X-ray Fluorescence Analysis

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Case Analysis Oriented Interpolation and a Two-step Interpolation after Correction of Barrel Distortion and Lateral Chromatic Aberration

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Thermo-resistive Platinum Thin Film Hydrogen Gas Sensor Fabricated by MEMS Techniques

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Fabrication of Two-axis Quartz MEMS-based Capacitive Tilt Sensor

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Tilt Sensor System Using MEMS Device and CMOS Technology

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Low Concentration Gas Measurement Using Photonic Bandgap Fiber Cell Sensor

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Improvement of a Micro-Droplet Guiding Technique for Laser-Induced Breakdown Spectroscopy

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM  2007

  • Particle Element and Size Stimutaneous Measurement Using LIBS

    IEEJ Trana. SM  2007

  • Development of a source-drain electrode coated with an insulation layer for detecting concenttation changes in a nitrate ion solution

    Sensors and Actuators B Chemical  2007

  • Development of Solution Measurement Using Laser-Induced Breakdown Spectroscopy Integrated with Micro-Droplet Ejection System

    IEEJ Trana. SM  2007

  • Wet Etched High Aspect Ratio Microstructures on Quartz for MEMS Application

    IEEJ Trana. SM  2007

  • Deep wet etching of Z cut quartz wafer for MEMS applications

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM  2006

  • High Frequency Drive of a Diode-bridge Type Differential Capacitance Detection Circuit

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM  2006

  • PHOTONIC BANDGAP FIBER IN LOW CONCETRATION MEASUREMENT

    10th International Symposium on High Pressure Low Temperature Plasma Chemistry , eptember 4-8  2006

  • Photonic bandgap fiber for a sensing device

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM  2006

  • Absolute Calibration Technique using Micro-Droplet Ejection System for Enhancement of LIBS Quantitative Analysis

    ”, PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM  2006

  • Particle Element and Size Measurement Using LIBS(2006)

    , PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM,  2006

  • PHTONIC BANDGAP FIBER IN LOW CONCENTRATION GAS MEASUREMENT

    The First European Symposium on Plasma Chemist, May 28-30, (Poland)  2006

  • A novel lift off process and its application for capacitive tilt sensor

    IEEE SENSORS 2006, EXCO Daegu, Korea/October 22-25  2006

  • A Study on a Diode-bridge Type Capacitance Detection Circuit for Differential Capacitive Sensor

    IEEE SENSORS 2006, EXCO Daegu, Korea/October 22-25  2006

  • Study of Laser Induced breakdown spectroscopy from micro-droplet of NaCL Solution

    IEEE SENSORS 2006, EXCO Daegu, Korea/October 22-25  2006

  • Sensing of Gas Concentration Using Photonic Bandgap Fiber”

    IEEE SENSORS 2006, EXCO Daegu, Korea/October 22-25  2006

  • Application of Photonic Bandgap Fiber in Gas Concentration Measurement.”

    , The 32nd Annual Conference of the IEEE Industrial Electronics Society(Paris),  2006

  • Simulation of particle size measurement with LIBS

    ”, The 32nd Annual Conference of the IEEE Industrial Electronics Society(Paris)  2006

  • EXAMINATION OF 3D CAD SYSTEM ON ANISOTROPIC ETCHING OF ALPHA- QUARTZ

    Asia-Pacific Conference of Transducers and Micro-Nano Technology?APCOT 2006  2006

  • A Study on a Diode-bridge Type Differential Capacitance Detection Circuit

    J. Adv. Qxid. Technol.  2006

  • Correction of barrel distortion for simple digital camera systems

    成18 年度 電気関係学会九州支部連合大会  2006

  • MEMS技術を用いた白金薄膜熱抵抗変化型水素ガスセンサの研究

    成18 年度 電気関係学会九州支部連合大会  2006

  • 有限要素法を用いたAT 振動子のスプリアス解析

    平成18 年度 電気関係学会九州支部連合大会  2006

  • LIBSを用いたNaCl水溶液濃度の検出

    センサ・マイクロマシン準部門総合研究会  2006

  • 水晶MEMS技術による水素センサの開発

    福岡水素エネルギー社会近未来展(2006)  2006

  • Deep wet etching of Z cut quartz wafer for MEMS applications

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM  2006

  • High Frequency Drive of a Diode-bridge Type Differential Capacitance Detection Circuit

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM  2006

  • PHOTONIC BANDGAP FIBER IN LOW CONCETRATION MEASUREMENT

    10th International Symposium on High Pressure Low Temperature Plasma Chemistry , eptember 4-8  2006

  • Photonic bandgap fiber for a sensing device

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM  2006

  • Absolute Calibration Technique using Micro-Droplet Ejection System for Enhancement of LIBS Quantitative Analysis

    ”, PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM  2006

  • Particle Element and Size Measurement Using LIBS(2006)

    , PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM,  2006

  • PHTONIC BANDGAP FIBER IN LOW CONCENTRATION GAS MEASUREMENT

    The First European Symposium on Plasma Chemist, May 28-30, (Poland)  2006

  • A novel lift off process and its application for capacitive tilt sensor

    IEEE SENSORS 2006, EXCO Daegu, Korea/October 22-25  2006

  • A Study on a Diode-bridge Type Capacitance Detection Circuit for Differential Capacitive Sensor

    IEEE SENSORS 2006, EXCO Daegu, Korea/October 22-25  2006

  • Study of Laser Induced breakdown spectroscopy from micro-droplet of NaCL Solution

    IEEE SENSORS 2006, EXCO Daegu, Korea/October 22-25  2006

  • Sensing of Gas Concentration Using Photonic Bandgap Fiber”

    IEEE SENSORS 2006, EXCO Daegu, Korea/October 22-25  2006

  • Application of Photonic Bandgap Fiber in Gas Concentration Measurement.”

    , The 32nd Annual Conference of the IEEE Industrial Electronics Society(Paris),  2006

  • Simulation of particle size measurement with LIBS

    ”, The 32nd Annual Conference of the IEEE Industrial Electronics Society(Paris)  2006

  • EXAMINATION OF 3D CAD SYSTEM ON ANISOTROPIC ETCHING OF ALPHA- QUARTZ

    Asia-Pacific Conference of Transducers and Micro-Nano Technology?APCOT 2006  2006

  • A Study on a Diode-bridge Type Differential Capacitance Detection Circuit

    J. Adv. Qxid. Technol.  2006

  • Deep wet etching of Z cut quartz wafer for MEMS applications

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM  2006

  • High Frequency Drive of a Diode-bridge Type Differential Capacitance Detection Circuit

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM  2006

  • PHOTONIC BANDGAP FIBER IN LOW CONCETRATION MEASUREMENT

    10th International Symposium on High Pressure Low Temperature Plasma Chemistry , eptember 4-8  2006

  • Photonic bandgap fiber for a sensing device

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM  2006

  • Absolute Calibration Technique using Micro-Droplet Ejection System for Enhancement of LIBS Quantitative Analysis

    ”, PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM  2006

  • Particle Element and Size Measurement Using LIBS(2006)

    , PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM,  2006

  • PHTONIC BANDGAP FIBER IN LOW CONCENTRATION GAS MEASUREMENT

    The First European Symposium on Plasma Chemist, May 28-30, (Poland)  2006

  • A novel lift off process and its application for capacitive tilt sensor

    IEEE SENSORS 2006, EXCO Daegu, Korea/October 22-25  2006

  • A Study on a Diode-bridge Type Capacitance Detection Circuit for Differential Capacitive Sensor

    IEEE SENSORS 2006, EXCO Daegu, Korea/October 22-25  2006

  • Study of Laser Induced breakdown spectroscopy from micro-droplet of NaCL Solution

    IEEE SENSORS 2006, EXCO Daegu, Korea/October 22-25  2006

  • Sensing of Gas Concentration Using Photonic Bandgap Fiber”

    IEEE SENSORS 2006, EXCO Daegu, Korea/October 22-25  2006

  • Application of Photonic Bandgap Fiber in Gas Concentration Measurement.”

    , The 32nd Annual Conference of the IEEE Industrial Electronics Society(Paris),  2006

  • Simulation of particle size measurement with LIBS

    ”, The 32nd Annual Conference of the IEEE Industrial Electronics Society(Paris)  2006

  • EXAMINATION OF 3D CAD SYSTEM ON ANISOTROPIC ETCHING OF ALPHA- QUARTZ

    Asia-Pacific Conference of Transducers and Micro-Nano Technology?APCOT 2006  2006

  • A Study on a Diode-bridge Type Differential Capacitance Detection Circuit

    J. Adv. Qxid. Technol.  2006

  • TILT SENSOR USING QUARTZ MEMS TECHNOLOGY

    2005 International Symposium on Nano Science and Technology November 10-11, Taiwan, Tainan  2005

  • High Sensitive Tilt Sensor for Quartz Micromachining

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)  2005

  • Performance Analysis of a Diode-bridge Type Differential Capacitance Detection Circuit and It’s Evaluation

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)  2005

  • In-situ Measurement of ppb Concentration of Gas

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)  2005

  • A Study on a Diode-bridge Type Differential Capacitance Detection Circuit

    ELMECO-5, Naleczow (Poland)  2005

  • The measurement of ppb gas concentration using photonic crystal fiber

    ELMECO-5, Naleczow (Poland)  2005

  • Simulation of Anisotropic Etching of Alpha-Quartz for 3D CAD System

    Sensors and Materials,  2005

  • 蛍光X線膜厚計で使用するCr標準膜の開発(3)

    平成17年度電気関係学会支部連合体会  2005

  • MEMS技術を用いた白金薄膜水素ガスセンサの研究

    平成17年度電気関係学会支部連合体会  2005

  • α水晶の三次元加工のためのエッチング異方性の検討

    平成17年度電気関係学会支部連合体会  2005

  • スプレー法によるレジストコーティングの検討

    平成17年度電気関係学会支部連合体会  2005

  • LIBSによる食塩濃度の測定

    平成17年度電気関係学会支部連合体会  2005

  • 蛍光X線膜厚計で使用するCr標準膜の開発

    センサ・マイクロマシン準部門総合研究会  2005

  • 蛍光X線膜厚計で使用するCr標準膜の開発

    第48回自動制御連合講演会  2005

  • 水晶を用いた高感度傾斜角センサの検討

    平成17年度電気学会全国大会講演論文集 ３  2005

  • 水晶ＭＥＭＳ技術による超高感度・超小型次世代センサの開発

    福岡水素エネルギー戦略会議総会記念講演会、福岡ナノテク推進会議  2005

  • 研究室便り、早稲田大学大学院情報生産システム研究科 植田研究室

    電気学会論文誌E  2005

  • TILT SENSOR USING QUARTZ MEMS TECHNOLOGY

    2005 International Symposium on Nano Science and Technology November 10-11, Taiwan, Tainan  2005

  • High Sensitive Tilt Sensor for Quartz Micromachining

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)  2005

  • Performance Analysis of a Diode-bridge Type Differential Capacitance Detection Circuit and It’s Evaluation

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)  2005

  • In-situ Measurement of ppb Concentration of Gas

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)  2005

  • A Study on a Diode-bridge Type Differential Capacitance Detection Circuit

    ELMECO-5, Naleczow (Poland)  2005

  • The measurement of ppb gas concentration using photonic crystal fiber

    ELMECO-5, Naleczow (Poland)  2005

  • In-situ Measurement for Gas Concentrations using Tunable Lasers,

    電気学会論文誌E(IEEJ, Trans. SM)  2005

  • Simulation of Anisotropic Etching of Alpha-Quartz for 3D CAD System

    Sensors and Materials,  2005

  • TILT SENSOR USING QUARTZ MEMS TECHNOLOGY

    2005 International Symposium on Nano Science and Technology November 10-11, Taiwan, Tainan  2005

  • High Sensitive Tilt Sensor for Quartz Micromachining

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)  2005

  • Performance Analysis of a Diode-bridge Type Differential Capacitance Detection Circuit and It’s Evaluation

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)  2005

  • In-situ Measurement of ppb Concentration of Gas

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)  2005

  • A Study on a Diode-bridge Type Differential Capacitance Detection Circuit

    ELMECO-5, Naleczow (Poland)  2005

  • The measurement of ppb gas concentration using photonic crystal fiber

    ELMECO-5, Naleczow (Poland)  2005

  • Simulation of Anisotropic Etching of Alpha-Quartz for 3D CAD System

    Sensors and Materials,  2005

  • Theory to Predict Etching Shapes in Quartz Crystal and Its Application to Design Micro-mechanical Devices(invited speech)

    2004 International Symposium on Nano Science and Technology Novenver 20-21, Taiwan, Tainan  2004

  • Mechanical Strength of Quartz Micromechanical Devices

    Proceedings of The 21st Sensor Symposium  2004

  • Simulation of Anisotropic Etching of Alpha-Quartz for 3D CAD System

    4th Workshop Physical Chemistry of Wet Etching of Silicon, PCWES 2004 May 26-28, Montreal, Canada  2004

  • Particle Element and Size Measurement Using LIBS

    ICEE 2004 (Joint Conference with Asia-Pasific of Transducers and Micro-Nano Technology 2004) July 4-8 2004 in Sapporo  2004

  • Particle size measurement and material characterization with plasma atomic emission analysi

    Trans.of Airosll Research  2004

  • 蛍光X線膜厚計で使用するCr標準薄膜の開発

    平成16年度電気関係学会連合大会  2004

  • 高周波水晶発振器（VCXO）の加工技術に関する基礎的研究

    平成16年度電気関係学会連合大会  2004

  • α水晶のエッチング異方性に関する基礎研究

    平成16年度電気関係学会連合大会  2004

  • 水晶マイクロ・ナノ加工とデバイス応用(招待講演)、、pp1-2(2004)

    ナノテク研究・ビジネス最前線 H16/12/24・MEMSの最新技術と九州における展望  2004

  • Theory to Predict Etching Shapes in Quartz Crystal and Its Application to Design Micro-mechanical Devices(invited speech)

    2004 International Symposium on Nano Science and Technology Novenver 20-21, Taiwan, Tainan  2004

  • Mechanical Strength of Quartz Micromechanical Devices

    Proceedings of The 21st Sensor Symposium  2004

  • Simulation of Anisotropic Etching of Alpha-Quartz for 3D CAD System

    4th Workshop Physical Chemistry of Wet Etching of Silicon, PCWES 2004 May 26-28, Montreal, Canada  2004

  • Particle Element and Size Measurement Using LIBS

    ICEE 2004 (Joint Conference with Asia-Pasific of Transducers and Micro-Nano Technology 2004) July 4-8 2004 in Sapporo  2004

  • プラズマ原子発光分析による微粒子の粒径・組成同時計測

    エアロゾル研究  2004

  • Theory to Predict Etching Shapes in Quartz Crystal and Its Application to Design Micro-mechanical Devices(invited speech)

    2004 International Symposium on Nano Science and Technology Novenver 20-21, Taiwan, Tainan  2004

  • Mechanical Strength of Quartz Micromechanical Devices

    Proceedings of The 21st Sensor Symposium  2004

  • Simulation of Anisotropic Etching of Alpha-Quartz for 3D CAD System

    4th Workshop Physical Chemistry of Wet Etching of Silicon, PCWES 2004 May 26-28, Montreal, Canada  2004

  • Particle Element and Size Measurement Using LIBS

    ICEE 2004 (Joint Conference with Asia-Pasific of Transducers and Micro-Nano Technology 2004) July 4-8 2004 in Sapporo  2004

  • Particle size measurement and material characterization with plasma atomic emission analysi

    Trans.of Airosll Research  2004

  • Particle Element and Size Measurement Using LIBS

    SICE Annual Conference in Fukui, August 4-6  2003

  • In-situ Measurement for Gas Concentrations using Tunable Lasers"

    Proceedings of the 20th Sensor Symposium, B1-5, July  2003

  • レーザーブレイクダウン(LIBS)による微粒子計測

    、SICE第4回制御部門大会 予稿集  2003

  • 水晶振動子ナノ加工技術の研究開発” 高感度ガスセンサへの応用”

    ASTE Annual Report of RISE, Waseda Univ  2003

  • LD ビームデリバリ技術の研究開発

    ASTE Annual Report of RISE, Waseda Univ.  2003

  • 波長可変レーザーを用いた近赤外域での気体の分光計測

    第一回赤外放射の応用関連学会等年会  2003

  • 波長可変レーザーを用いた気体の高感度分光

    電気学会ケミカルセンサ研究会, CHS-03-56  2003

  • 紫外光光ファイバの試作と特性評価

    第22回レーザセンシングシンポジウム  2003

  • Particle Element and Size Measurement Using LIBS

    SICE Annual Conference in Fukui, August 4-6  2003

  • In-situ Measurement for Gas Concentrations using Tunable Lasers"

    Proceedings of the 20th Sensor Symposium, B1-5, July  2003

  • 精密加工と計測技術

    エヌ・ティー・エス  2003

  • Particle Element and Size Measurement Using LIBS

    SICE Annual Conference in Fukui, August 4-6  2003

  • In-situ Measurement for Gas Concentrations using Tunable Lasers"

    Proceedings of the 20th Sensor Symposium, B1-5, July  2003

  • Development of Technology for Measuring Part-per-billion Gas concentrations and Nano-particles

    Final report of The "Advanced Photon Proccesing Measurement Technology"  2002

  • Simulation of laser plasma emission characteristics of small solid particles in different gas atmospheres at various pressures

    Proc. SPIE , Photon Processing in Microelectronics and Photonics  2002

  • Growth of strain-blanced InAsp/InP/InGaAs multiple quantum well for infrared photodetectors

    20th Sensor Symposium  2002

  • Laser with SBS Pulse Compression for LIBS

    Trns. IEE of Japan  2002

  • Development of InGaAs photodiodes for near-infrared spectroscopy

    Trns. IEE of Japan  2002

  • 水晶振動子ナノ加工技術の研究開発

    ASTE Annual Report of RISE, Waseda Univ.  2002

  • ppbガス濃度とナノ粒子計測技術の研究開発

    フォトン計測・加工技術」プロジェクト成果報告会講演集  2002

  • Development of Technology for Measuring Part-per-billion Gas concentrations and Nano-particles

    Final report of The "Advanced Photon Proccesing Measurement Technology"  2002

  • Simulation of laser plasma emission characteristics of small solid particles in different gas atmospheres at various pressures

    Proc. SPIE , Photon Processing in Microelectronics and Photonics  2002

  • Growth of strain-blanced InAsp/InP/InGaAs multiple quantum well for infrared photodetectors

    20th Sensor Symposium  2002

  • Laser with SBS Pulse Compression for LIBS

    電気学会論文誌E  2002

  • Development of InGaAs photodiodes for near-infrared spectroscopy

    電気学会論文誌E, Vol.122, No.1  2002

  • Development of Technology for Measuring Part-per-billion Gas concentrations and Nano-particles

    Final report of The "Advanced Photon Proccesing Measurement Technology"  2002

  • Simulation of laser plasma emission characteristics of small solid particles in different gas atmospheres at various pressures

    Proc. SPIE , Photon Processing in Microelectronics and Photonics  2002

  • Growth of strain-blanced InAsp/InP/InGaAs multiple quantum well for infrared photodetectors

    20th Sensor Symposium  2002

  • Laser with SBS Pulse Compression for LIBS

    Trns. IEE of Japan  2002

  • Development of InGaAs photodiodes for near-infrared spectroscopy

    Trns. IEE of Japan  2002

  • High-Sensitive Mesurement Technology for IR Spectroscopy

    Proceedings of The 5th Symposium Advanced Photon Processing and Mesurement Technology  2001

  • Development of In-situ Nono-Particle Measurement

    Proceedings of the 5th Symposium Advanced Photon Processing and Measurement Technology  2001

  • Detection of Carbon and Cluster Parameter by Laser-Induced Plasms Line Radiation

    IWFAC'2001'Fulluence and Atomic Clusters'in Saint-Petersburg  2001

  • Growth of strain-balanced InAsP-InP-InGaAs multiple quantum well structures for mid-infrared photo detectors CLEO/Pacific Rim

    CLEO/Pacific Rim/Ⅰ  2001

  • Particle Elements and Size Measurement Using LIB

    18th Sensor Symposium, May, 30  2001

  • Development of InGaAs photodiodes for near-infrared spectroscopy

    18th Sensor Symposium, May, 29  2001

  • In-situ Spectroscopic Measurement of Gas Using Tunable Lasers and InGaAs Photodiodes

    18th Sensor Symposium, May, 29  2001

  • Simulation of laser plasma emission characteristics of small solid particles in different gas atmospheres at various pressures

    18th Sensor Symposium, May, 30  2001

  • Laser with SBS Pulse Compression for LIBS

    18th Sensor Symposium, May, 29  2001

  • Optical lithium targets for laser plasma lithography, SPIE 2001/.3/1

    Proc. SPIE , Emerging Lithographic Technologies V  2001

  • Laser Detection of the Parameters of Small Solid Particle Located in Air, Laser Optics Conference LO2000

    Proc. SPIE ,Laser Optics  2001

  • Spectroscopic detection of ammonia using diode-pumped difference-frequency generation

    SPIE-photonic 2001, Proceedings of SPIE, Jan.24  2001

  • High Sensitive Quartz Crystal Microphone Using Micro-Machining Technology

    Trns. IEE of Japan  2001

  • Simulation of laser plasma emission characteristics of small solid particles in different gas atmospheres at various pressures

    Trns. IEE of Japan  2001

  • MOVPE成長法による大面積2.5μm InGaAsフォトダイオードの製作

    2001年秋季応用物理学会学術講演会  2001

  • レーザーブレークダウン分光による微粒子成分・粒径計測

    SICE学術講演会  2001

  • 可変波長レーザーを用いた気体のIn-situ計測

    SICE学術講演会  2001

  • LIBSによる微粒子計測の可能性

    レーザーアブレーション調査専門委員会  2001

  • 中赤外QWIP用InAsP/Inp/InGaAs歪バランス多重量子井戸構造のMOVPE成長

    第48回応用物理学関係連合講演会  2001

  • 波長可変レーザーと高感度InGaAs光検出器によるin-situガス濃度計測

    レーザー学会第290回研究会  2001

  • LIBSによるナノ粒子計測

    第4回「フォトン計測・加工技術」ワークショップ  2001

  • 気体の超高感度in-situ計測

    第4回「フォトン計測・加工技術」ワークショップ  2001

  • High-Sensitive Mesurement Technology for IR Spectroscopy

    Proceedings of The 5th Symposium Advanced Photon Processing and Mesurement Technology  2001

  • Development of In-situ Nono-Particle Measurement

    Proceedings of the 5th Symposium Advanced Photon Processing and Measurement Technology  2001

  • Detection of Carbon and Cluster Parameter by Laser-Induced Plasms Line Radiation

    IWFAC'2001'Fulluence and Atomic Clusters'in Saint-Petersburg  2001

  • Growth of strain-balanced InAsP-InP-InGaAs multiple quantum well structures for mid-infrared photo detectors CLEO/Pacific Rim

    CLEO/Pacific Rim/Ⅰ  2001

  • Particle Elements and Size Measurement Using LIB

    18th Sensor Symposium, May, 30  2001

  • Development of InGaAs photodiodes for near-infrared spectroscopy

    18th Sensor Symposium, May, 29  2001

  • In-situ Spectroscopic Measurement of Gas Using Tunable Lasers and InGaAs Photodiodes

    18th Sensor Symposium, May, 29  2001

  • Simulation of laser plasma emission characteristics of small solid particles in different gas atmospheres at various pressures

    18th Sensor Symposium, May, 30  2001

  • Laser with SBS Pulse Compression for LIBS

    18th Sensor Symposium, May, 29  2001

  • Optical lithium targets for laser plasma lithography, SPIE 2001/.3/1

    Proc. SPIE , Emerging Lithographic Technologies V  2001

  • Laser Detection of the Parameters of Small Solid Particle Located in Air, Laser Optics Conference LO2000

    Proc. SPIE ,Laser Optics  2001

  • Spectroscopic detection of ammonia using diode-pumped difference-frequency generation

    SPIE-photonic 2001, Proceedings of SPIE, Jan.24  2001

  • 水晶マイクロマシニングを利用した高感度マイクロフォン

    電気学会論文誌 E  2001

  • Simulation of laser plasma emission characteristics of small solid particles in different gas atmospheres at various pressures

    電気学会論文誌E  2001

  • High-Sensitive Mesurement Technology for IR Spectroscopy

    Proceedings of The 5th Symposium Advanced Photon Processing and Mesurement Technology  2001

  • Development of In-situ Nono-Particle Measurement

    Proceedings of the 5th Symposium Advanced Photon Processing and Measurement Technology  2001

  • Detection of Carbon and Cluster Parameter by Laser-Induced Plasms Line Radiation

    IWFAC'2001'Fulluence and Atomic Clusters'in Saint-Petersburg  2001

  • Growth of strain-balanced InAsP-InP-InGaAs multiple quantum well structures for mid-infrared photo detectors CLEO/Pacific Rim

    CLEO/Pacific Rim/Ⅰ  2001

  • Particle Elements and Size Measurement Using LIB

    18th Sensor Symposium, May, 30  2001

  • Development of InGaAs photodiodes for near-infrared spectroscopy

    18th Sensor Symposium, May, 29  2001

  • In-situ Spectroscopic Measurement of Gas Using Tunable Lasers and InGaAs Photodiodes

    18th Sensor Symposium, May, 29  2001

  • Simulation of laser plasma emission characteristics of small solid particles in different gas atmospheres at various pressures

    18th Sensor Symposium, May, 30  2001

  • Laser with SBS Pulse Compression for LIBS

    18th Sensor Symposium, May, 29  2001

  • Optical lithium targets for laser plasma lithography, SPIE 2001/.3/1

    Proc. SPIE , Emerging Lithographic Technologies V  2001

  • Laser Detection of the Parameters of Small Solid Particle Located in Air, Laser Optics Conference LO2000

    Proc. SPIE ,Laser Optics  2001

  • Spectroscopic detection of ammonia using diode-pumped difference-frequency generation

    SPIE-photonic 2001, Proceedings of SPIE, Jan.24  2001

  • High Sensitive Quartz Crystal Microphone Using Micro-Machining Technology

    Trns. IEE of Japan  2001

  • Simulation of laser plasma emission characteristics of small solid particles in different gas atmospheres at various pressures

    Trns. IEE of Japan  2001

  • Development of Pulse Laser for Laser Induced Breakdown

    The 4th Symposium on Advanced Photon Processing and Measurement Technologies, Nov., 22  2000

  • High-Sensitive Measurement Technology for IR Spectoroscopy

    The 4th Symposium on Advanced Photon Processing and Measurement Technologies, Nov., 22  2000

  • Laser Detection of the Parameters of Small Solid Particle in Gas Atmosphere

    Proc. SPIE , Laser Plasma Generation and Diagnostics  2000

  • Interaction of Laser Radiation with Small Solid Particle in Air

    ECLM.  2000

  • Laser Plasma Radiation from Small Solid Particle in Gas Atmosphere

    Proc. SPIE , Laser Plasma  2000

  • Higt Peak Power Pulse Laser for Laser Induced Breakdown,

    Proc. SPIE , Advanced High-Power Lasers  2000

  • Diffusion in Zinc in InP, InAsP and InGaAs by the Metal-organic Vapor-phase Diffusion Technique

    Defects and Diffusion in Semiconductors  2000

  • Temperature Dependence of the Energy Gap in InAsyP1-y

    Applie Physics Leters  2000

  • High Frequency and High Speed IC Inspection Probe Using Quartz Crystal Micri-Blance

    Trns. IEE of Japan  2000

  • レーザーブレークダウンによる微粒子計測

    SICE学術講演会  2000

  • PPLNを用いた気体の吸収分光用可変レーザー

    SICE学術講演会  2000

  • レーザーブレイクダウン用高ピークパワーパルスレーザー

    レーザー学会277回研究会  2000

  • 微粒子成分・粒径計測の研究開発

    第3回「フォトン計測・加工技術」ワークショップ  2000

  • ガスの濃度成分計測技術の研究開発

    第3回「フォトン計測・加工技術」ワークショップ  2000

  • Development of Pulse Laser for Laser Induced Breakdown

    The 4th Symposium on Advanced Photon Processing and Measurement Technologies, Nov., 22  2000

  • High-Sensitive Measurement Technology for IR Spectoroscopy

    The 4th Symposium on Advanced Photon Processing and Measurement Technologies, Nov., 22  2000

  • Laser Detection of the Parameters of Small Solid Particle in Gas Atmosphere

    Proc. SPIE , Laser Plasma Generation and Diagnostics  2000

  • Interaction of Laser Radiation with Small Solid Particle in Air

    ECLM.  2000

  • Laser Plasma Radiation from Small Solid Particle in Gas Atmosphere

    Proc. SPIE , Laser Plasma  2000

  • Higt Peak Power Pulse Laser for Laser Induced Breakdown,

    Proc. SPIE , Advanced High-Power Lasers  2000

  • Diffusion in Zinc in InP, InAsP and InGaAs by the Metal-organic Vapor-phase Diffusion Technique

    Defects and Diffusion in Semiconductors  2000

  • Temperature Dependence of the Energy Gap in InAsyP1-y

    Applie Physics Leters  2000

  • 水晶マイクロ天秤を使用した高速・高周波IC検査プローブ

    電気学会論文誌 E  2000

  • Development of Pulse Laser for Laser Induced Breakdown

    The 4th Symposium on Advanced Photon Processing and Measurement Technologies, Nov., 22  2000

  • High-Sensitive Measurement Technology for IR Spectoroscopy

    The 4th Symposium on Advanced Photon Processing and Measurement Technologies, Nov., 22  2000

  • Laser Detection of the Parameters of Small Solid Particle in Gas Atmosphere

    Proc. SPIE , Laser Plasma Generation and Diagnostics  2000

  • Interaction of Laser Radiation with Small Solid Particle in Air

    ECLM.  2000

  • Laser Plasma Radiation from Small Solid Particle in Gas Atmosphere

    Proc. SPIE , Laser Plasma  2000

  • Higt Peak Power Pulse Laser for Laser Induced Breakdown,

    Proc. SPIE , Advanced High-Power Lasers  2000

  • Diffusion in Zinc in InP, InAsP and InGaAs by the Metal-organic Vapor-phase Diffusion Technique

    Defects and Diffusion in Semiconductors  2000

  • Temperature Dependence of the Energy Gap in InAsyP1-y

    Applie Physics Leters  2000

  • High Frequency and High Speed IC Inspection Probe Using Quartz Crystal Micri-Blance

    Trns. IEE of Japan  2000

  • Particle elements and Diameter Measurement Technologies

    The 3rd Symposium on Advanced Photon Processing and Measurement Technologies, Dec., 8  1999

  • Higt-Sensitive Measurement Technology for IR Spectroscopy

    The 3rd Symposium on Advanced Photon Processing and Measurement Technologies, Dec., 8  1999

  • In-situ Status measurment

    The 2st Symposium on Advanced Photon Processing and Measurement Technologies  1999

  • Optical MEMES

    Spie-The International Society for Optical Engineeing  1999

  • MOVPE成長法による低暗電流・高感度2.5μm InGaAsフォトダイオードの製作

    1999年秋季第60回応用物理学会学術講演会、講演予稿集  1999

  • n-InpへのZnアクセプタ拡散のキャリァ濃度依存症

    第46回応用物理学会学術講演会、講演予稿集  1999

  • レーザーブレークダウン(Ｌ BD）による微粒子計測

    Sice'99, July28-30  1999

  • 1-2.6μm 高感度InGaAs近赤外検出素子

    第46回応用物理学会春期講演会  1999

  • レーザーブレークダウン用パルスレーザー

    第46回応用物理学会春期講演会  1999

  • In-situ状態計測－レーザーブレークダウン用マイクロチップレーザー

    レーザー熱加工研究会誌  1999

  • 半導体製造工程におけるIn-situ状態計測、

    レーザー学会誌  1999

  • レーザーブレークダウン校正装置の試作

    第2回「フォトン計測・加工技術」ワークショップ  1999

  • ガス濃度計測用赤外光検出器

    第2回「フォトン計測・加工」ワークショップ  1999

  • Particle elements and Diameter Measurement Technologies

    The 3rd Symposium on Advanced Photon Processing and Measurement Technologies, Dec., 8  1999

  • Higt-Sensitive Measurement Technology for IR Spectroscopy

    The 3rd Symposium on Advanced Photon Processing and Measurement Technologies, Dec., 8  1999

  • In-situ Status measurment

    The 2st Symposium on Advanced Photon Processing and Measurement Technologies  1999

  • Optical MEMES

    Spie-The International Society for Optical Engineeing  1999

  • 超音波便覧

    丸善  1999

  • Particle elements and Diameter Measurement Technologies

    The 3rd Symposium on Advanced Photon Processing and Measurement Technologies, Dec., 8  1999

  • Higt-Sensitive Measurement Technology for IR Spectroscopy

    The 3rd Symposium on Advanced Photon Processing and Measurement Technologies, Dec., 8  1999

  • In-situ Status measurment

    The 2st Symposium on Advanced Photon Processing and Measurement Technologies  1999

  • Optical MEMES

    Spie-The International Society for Optical Engineeing  1999

  • In-situ Status measurment Technology

    The 1st Symposium on Advanced Photon Processing and Measurement Technologies  1998

  • 水晶のマイクロ加工とその応用

    第27回EMシンポジウム  1998

  • ガス濃度計測用赤外光検出器

    第1回「フォトン計測・加工」ワークショップ  1998

  • レーザーブレークダウンによる微粒子計測

    第1回「フォトン計測・加工技術」ワークショップ  1998

  • In-situ Status measurment Technology

    The 1st Symposium on Advanced Photon Processing and Measurement Technologies  1998

  • In-situ Status measurment Technology

    The 1st Symposium on Advanced Photon Processing and Measurement Technologies  1998

  • マイクロ天秤を用いたEOプローバの基本特性

    第25回EMシンポジウム  1996

  • マイクロ天秤を用いたEOプローバ

    横河技報  1996

  • A Piezoelectric & Electrostatic Actuator to Generate Pseudo-Static Displacement from Resonant Oscillation

    4th Japan Int., SAMPE Symposium & Exhaibition, JISSE-4, Sep.25-28  1995

  • A Piezoelectric Pseudo-Static Actuator for Large Displacement under AC Voltage Operation

    The 8th International Conference on Solid-State Sensors and Actuators Transducer'95, Stockholm, Sweden, Jun.25-29  1995

  • An Electro statically Operated Torsion Mirror for Optical Switching Device"

    The 8th International Conference on Solid-State Sensors and Actuators(TRANSDUCERS'95), Stockholm, Sweden, Jun.  1995

  • A Piezoelectrically Openrated Optical Chopper by Quartz Micromachining

    IEEE/ASME Journal of Micromechanical Systems  1995

  • A Quartz Crystal Microbalance-Type Odor Sensor Using PVC-Blended Lipid Membrane

    IEEE Transactions on Instrumentation and Measurement, Vol.44, No.3  1995

  • マイクロ天秤を用いたEOプローバ

    第24回EMシンポジウム  1995

  • A Piezoelectric & Electrostatic Actuator to Generate Pseudo-Static Displacement from Resonant Oscillation

    4th Japan Int., SAMPE Symposium & Exhaibition, JISSE-4, Sep.25-28  1995

  • A Piezoelectric Pseudo-Static Actuator for Large Displacement under AC Voltage Operation

    The 8th International Conference on Solid-State Sensors and Actuators Transducer'95, Stockholm, Sweden, Jun.25-29  1995

  • An Electro statically Operated Torsion Mirror for Optical Switching Device"

    The 8th International Conference on Solid-State Sensors and Actuators(TRANSDUCERS'95), Stockholm, Sweden, Jun.  1995

  • A Piezoelectrically Openrated Optical Chopper by Quartz Micromachining

    IEEE/ASME Journal of Micromechanical Systems  1995

  • A Quartz Crystal Microbalance-Type Odor Sensor Using PVC-Blended Lipid Membrane

    IEEE Transactions on Instrumentation and Measurement, Vol.44, No.3  1995

  • 計測自動制御学会編：計測制御技術事典

    丸善  1995

  • A Piezoelectric & Electrostatic Actuator to Generate Pseudo-Static Displacement from Resonant Oscillation

    4th Japan Int., SAMPE Symposium & Exhaibition, JISSE-4, Sep.25-28  1995

  • A Piezoelectric Pseudo-Static Actuator for Large Displacement under AC Voltage Operation

    The 8th International Conference on Solid-State Sensors and Actuators Transducer'95, Stockholm, Sweden, Jun.25-29  1995

  • An Electro statically Operated Torsion Mirror for Optical Switching Device"

    The 8th International Conference on Solid-State Sensors and Actuators(TRANSDUCERS'95), Stockholm, Sweden, Jun.  1995

  • A Piezoelectrically Openrated Optical Chopper by Quartz Micromachining

    IEEE/ASME Journal of Micromechanical Systems  1995

  • A Quartz Crystal Microbalance-Type Odor Sensor Using PVC-Blended Lipid Membrane

    IEEE Transactions on Instrumentation and Measurement, Vol.44, No.3  1995

  • A Self-excited Chopper made by Quartz Micromachining and its Application to an Optical Sensor

    Proc.7th IEEE Workshop on Micro Electro Mechanical Systems, MEMS'94, Jan.25-28  1994

  • A Quartz Crystal Microbalance-type Oder Sensor Using PVC-blended Lipid Membrane

    IMTC'94 Hamamatsu  1994

  • A Piezoelectric Quartz Micro actuator for a Large Static Displacement

    Jpn.J.Appl.Phys Vol.33  1994

  • 非線型振動を利用した擬スタティック変位アクチュエータ

    マイクロ理工学研究会、早稲田大学  1994

  • 水晶基板による圧電駆動型アクチュエータ

    電気学会第23回EMシンポジウム  1994

  • 水晶のマイクロマシニングによるセンサ

    超音波TECHNO4月号  1994

  • 非線形振動を利用した擬スタティック変位アクチュエータ

    マイクロ理工学研究会・マイクロマシーニング研究会 合同研究会  1994

  • A Self-excited Chopper made by Quartz Micromachining and its Application to an Optical Sensor

    Proc.7th IEEE Workshop on Micro Electro Mechanical Systems, MEMS'94, Jan.25-28  1994

  • A Quartz Crystal Microbalance-type Oder Sensor Using PVC-blended Lipid Membrane

    IMTC'94 Hamamatsu  1994

  • A Piezoelectric Quartz Micro actuator for a Large Static Displacement

    Jpn.J.Appl.Phys Vol.33  1994

  • A Self-excited Chopper made by Quartz Micromachining and its Application to an Optical Sensor

    Proc.7th IEEE Workshop on Micro Electro Mechanical Systems, MEMS'94, Jan.25-28  1994

  • A Quartz Crystal Microbalance-type Oder Sensor Using PVC-blended Lipid Membrane

    IMTC'94 Hamamatsu  1994

  • A Piezoelectric Quartz Micro actuator for a Large Static Displacement

    Jpn.J.Appl.Phys Vol.33  1994

  • A Pezoelectrically Opearated Chopper by Quartz Micromachining

    The 7th International Conference on Solid-State Sensors and Actuators, Transducer'93, Yokohama Japan, Jun.7-10  1993

  • Pezoelectrically Opearated Actuators by Quartz Micromachining for Optical Application

    Proceedings IEEE Micro Electro-Mechanical Systems, Fort Lauderdale, Florida  1993

  • A Galvanometer Using Qurtz Micromachining

    Transaction of Instrument and Control Engineers  1993

  • 圧電駆動型水晶マイクロアクチュエータ

    1993年秋季第54回応用物理学会学術講演会  1993

  • A Pezoelectrically Opearated Chopper by Quartz Micromachining

    The 7th International Conference on Solid-State Sensors and Actuators, Transducer'93, Yokohama Japan, Jun.7-10  1993

  • Pezoelectrically Opearated Actuators by Quartz Micromachining for Optical Application

    Proceedings IEEE Micro Electro-Mechanical Systems, Fort Lauderdale, Florida  1993

  • 水晶のマイクロマシニングによるガルバノメータ

    計測自動制御学会論文集  1993

  • 計測用語

    日本規格協会  1993

  • A Pezoelectrically Opearated Chopper by Quartz Micromachining

    The 7th International Conference on Solid-State Sensors and Actuators, Transducer'93, Yokohama Japan, Jun.7-10  1993

  • Pezoelectrically Opearated Actuators by Quartz Micromachining for Optical Application

    Proceedings IEEE Micro Electro-Mechanical Systems, Fort Lauderdale, Florida  1993

  • A Galvanometer Using Qurtz Micromachining

    Transaction of Instrument and Control Engineers  1993

  • A New two-color pyrometer using optical fibers, Temperature

    American Institute of Physics  1992

  • Temperature Sensor Using Quartz Tuning-Fork Resonator, Temperature

    American Institute of Physics, Vol.6  1992

  • Measurement of Absolute Distance Employing Tunable CW Dye Laser

    IEEE Transactions on Instrumentation and Measurement  1992

  • 収束イオンビームの資料吸収電流画像

    1992年秋期応用物理学会学術講演会  1992

  • 水晶のマイクロマシニングによる光シャッタ

    電気学会 産業計測制御研究会、資料ⅡC-92-16  1992

  • Volt Image Measurement for LSI Analysis

    SICE92  1992

  • 水晶振動子式PVCブレンド脂質膜においセンサ

    第22回EMシンポジウム  1992

  • アブソリュート則長器

    横河技報  1992

  • 水晶振動子式PVCブレンド脂質膜においセンサ

    電子回路研究会資料ETC-92-39  1992

  • 水晶のマイクロマシニングによる光シャッタ

    電気学会 産業計測制御研究会 資料 IIC-92-16  1992

  • マイクロマシニングによる水晶光スキャナ

    OPTONICS  1992

  • 水晶のマイクロ加工技術を利用した高安定水晶発振器

    機能EM回路デバイス調査専門委員会資料  1992

  • A New two-color pyrometer using optical fibers, Temperature

    American Institute of Physics  1992

  • Temperature Sensor Using Quartz Tuning-Fork Resonator, Temperature

    American Institute of Physics, Vol.6  1992

  • Measurement of Absolute Distance Employing Tunable CW Dye Laser

    IEEE Transactions on Instrumentation and Measurement  1992

  • Siマイクロマシニング先端技術

    サイエンスフォーラム  1992

  • A New two-color pyrometer using optical fibers, Temperature

    American Institute of Physics  1992

  • Temperature Sensor Using Quartz Tuning-Fork Resonator, Temperature

    American Institute of Physics, Vol.6  1992

  • Measurement of Absolute Distance Employing Tunable CW Dye Laser

    IEEE Transactions on Instrumentation and Measurement  1992

  • A Quartz Galvanometer For Optical Scanning in a Laser Printer Application

    TRANSDUCER'91 Proceedings of the 8th International Conference on Solid-State Sensors and Actuators  1991

  • Development of a Wavelength-Stabilized Light Source with a Laser Diode

    Trns. IEE of Japan  1991

  • 波長レーザーを用いたアブソリュート測長

    SICE 91  1991

  • 共焦点光学系における深さ方向分解能の検討

    SICE 91  1991

  • 音叉振動子を用いた水晶温度センサ

    計測自動制御学会創立30周年講演会  1991

  • A Quartz Galvanometer For Optical Scanning in a Laser Printer Application

    TRANSDUCER'91 Proceedings of the 8th International Conference on Solid-State Sensors and Actuators  1991

  • 波長安定化半導体レーザ光源の開発

    電気学会論文誌C  1991

  • 1991年薄膜電子デバイス年鑑

    プレスジャーナル  1991

  • A Quartz Galvanometer For Optical Scanning in a Laser Printer Application

    TRANSDUCER'91 Proceedings of the 8th International Conference on Solid-State Sensors and Actuators  1991

  • Development of a Wavelength-Stabilized Light Source with a Laser Diode

    Trns. IEE of Japan  1991

  • Development of a wavelength-Stabilized Light Source with a Laser Diode

    YOKOGAWA Technical Report English Edition  1990

  • Revolution Counter Using Magnetic Bubble Device for Multi-turn Absolute Encoder

    Sensors and Actuators,A21-A23  1990

  • Multi-turn Absolute Encoder Using Special Filter

    JSME International Journal, SeriesⅢ  1990

  • レーザプリンタ用水晶光スキャナ(2)体外部振動特性の改善

    SICE 90  1990

  • 水晶のマイクロ加工とその応用

    精密工学会自動組立専門委員会、研究例会講演前刷集  1990

  • マイクロマシニング技術による水晶デバイス

    月刊 Semiconductor World  1990

  • レーザプリンタ用水晶光スキャナ

    第19回EMシンポジウム  1990

  • Development of a wavelength-Stabilized Light Source with a Laser Diode

    YOKOGAWA Technical Report English Edition  1990

  • Revolution Counter Using Magnetic Bubble Device for Multi-turn Absolute Encoder

    Sensors and Actuators,A21-A23  1990

  • Multi-turn Absolute Encoder Using Special Filter

    JSME International Journal, SeriesⅢ  1990

  • Development of a wavelength-Stabilized Light Source with a Laser Diode

    YOKOGAWA Technical Report English Edition  1990

  • Revolution Counter Using Magnetic Bubble Device for Multi-turn Absolute Encoder

    Sensors and Actuators,A21-A23  1990

  • Multi-turn Absolute Encoder Using Special Filter

    JSME International Journal, SeriesⅢ  1990

  • Development of a Stabillized Optical Source with a Laser Diode,

    SPIE, Laser Interferometory  1989

  • Revolution Counter Using Magnetic Babble Device for Multi-Turn Absolute Encoder

    TRANSDUCER'89, Proceedings of the 5th International Conference on Solid-State Sensors and Actuators  1989

  • レーザプリンタ用水晶光スキャナ(2)体外部振動特性の改善

    SICE 89  1989

  • 波長安定化半導体レーザ光源の開発

    第18回EMシンポジウム  1989

  • 波長安定化半導体レーザ光源の開発

    横河技報  1989

  • Development of a Stabillized Optical Source with a Laser Diode,

    SPIE, Laser Interferometory  1989

  • Revolution Counter Using Magnetic Babble Device for Multi-Turn Absolute Encoder

    TRANSDUCER'89, Proceedings of the 5th International Conference on Solid-State Sensors and Actuators  1989

  • Development of a Stabillized Optical Source with a Laser Diode,

    SPIE, Laser Interferometory  1989

  • Revolution Counter Using Magnetic Babble Device for Multi-Turn Absolute Encoder

    TRANSDUCER'89, Proceedings of the 5th International Conference on Solid-State Sensors and Actuators  1989

  • A Stabilized Optical Source With Laser Diode For Distance Measurement

    CPEM '88 DIGEST  1988

  • Multi-Turn Absolute Encoder Using Spatial Filter

    The International Conference on ADVANCED MECHATRONICS  1988

  • Prcision Pressure Transducer Using Double-Ended Tuning Fork Resonstor

    Trns. IEE of Japan  1988

  • 電子ビーム直接描画によるエンコーダのコード板の製作

    SICE 87  1988

  • 水晶振動子を用いたセンサ

    センサ技術  1988

  • 測長器用波長安定化半導体レーザー光源

    第5回 センシングフォーラム  1988

  • A Stabilized Optical Source With Laser Diode For Distance Measurement

    CPEM '88 DIGEST  1988

  • Multi-Turn Absolute Encoder Using Spatial Filter

    The International Conference on ADVANCED MECHATRONICS  1988

  • 複合音叉振動子を用いた高精度圧力計

    電気学会論文誌C  1988

  • A Stabilized Optical Source With Laser Diode For Distance Measurement

    CPEM '88 DIGEST  1988

  • Multi-Turn Absolute Encoder Using Spatial Filter

    The International Conference on ADVANCED MECHATRONICS  1988

  • Prcision Pressure Transducer Using Double-Ended Tuning Fork Resonstor

    Trns. IEE of Japan  1988

  • Optical Absolute Encoder Using Spatial Filter

    Proceeding of SPIE-The International Society for Optical Engineering, Photomechanics and Speckle Metrology  1987

  • Theory to Predict Etching Shapes of Quartz Crystal and It's Application to Design Devices

    Transaction of Instrument and Control Engineers  1987

  • Temperature Sensor Using Tuning Fork Resonator

    Transaction of Instrument and Control Engineers  1987

  • レーザ振動変位計算

    SICE 87  1987

  • 半導体レーザを用いた測長器用2波長安定化光源

    SICE 87  1987

  • 水晶温度計(4)－温度校正式の検討

    SICE 87  1987

  • ロータリィアブソリュートエンコーダ

    SICE 87  1987

  • 空間フィルタ検出器を用いた光ファイバ干渉計の温度計

    第34回応用物理学関係連合講演会  1987

  • 多モードファイバ干渉計の温度計測への応用

    第34回応用物理学関係連合講演会  1987

  • 水晶のエッチング異方性とそれを応用したデバイス

    電気学会全国大会  1987

  • 複合音叉振動子を用いた圧力計

    第16回EMシンポジウム  1987

  • Optical Absolute Encoder Using Spatial Filter

    Proceeding of SPIE-The International Society for Optical Engineering, Photomechanics and Speckle Metrology  1987

  • 水晶のエッチング形状の予測法とそのデバイス設計への応用

    計測自動制御学会論文集  1987

  • 音叉振動子を用いた水晶温度センサ

    計測自動制御学会論文集  1987

  • Optical Absolute Encoder Using Spatial Filter

    Proceeding of SPIE-The International Society for Optical Engineering, Photomechanics and Speckle Metrology  1987

  • Theory to Predict Etching Shapes of Quartz Crystal and It's Application to Design Devices

    Transaction of Instrument and Control Engineers  1987

  • Temperature Sensor Using Tuning Fork Resonator

    Transaction of Instrument and Control Engineers  1987

  • Temperature Sensor Using Quartz Tuning Fork Resonator

    Proceedings of The 40th Annual Frequency Control Symposium  1986

  • ファイバ放射温度計

    SICE 86  1986

  • 水晶温度計(3)－広範囲温度計プローブ

    SICE 86  1986

  • 走査型空間フィルタを用いたアブソリュートエンコーダ

    SICE 86  1986

  • レーザ・スペックル歪計の進展

    第18回ひずみ測定シンポジウム  1986

  • Temperature Sensor Using Quartz Tuning Fork Resonator

    Proceedings of The 40th Annual Frequency Control Symposium  1986

  • レーザースペックルひずみ計の高速化

    非破壊検査  1986

  • リニアモータ応用ハンドブック

    工業調査会  1986

  • センサ用語辞典編集委員会編：センサ用語辞典

    情報調査会  1986

  • Temperature Sensor Using Quartz Tuning Fork Resonator

    Proceedings of The 40th Annual Frequency Control Symposium  1986

  • Accelerated Laser Speckle Strain Gauge, Proceedings of SPIE-

    The International Society for Optical Engineering, Vol.556  1985

  • Three-Dimensional Displacement Meter

    Proceedings of SPIE-The International Society for Optical Engineering,  1985

  • Quartz Crystal Micromechanical Devices

    Proceeding of the International Conference on Solid-State Sensors-Transducer'85  1985

  • Precision Transducers Using Mechanical Resonators

    The Jounal of the Society of Instrument and Control Engineers  1985

  • Accelerated Laser Speckle Strain Gauge

    Optical Engineering  1985

  • Precision Force Transducer Using Mechanical Resonators

    Mesurement  1985

  • Precision Transducers Using Mechanical Resonators

    Transaction of Instrument and Control Engineers  1985

  • スペックル振動センサ

    第46回応用物理学会学術講演会  1985

  • 電子走査型空間フィルタ検出器によるスペックル歪計の高速化

    第23回応用物理学関係連合講演会  1985

  • 横振動梁を使用した小型高精度圧力計のマルチレンジ化

    第24回 SICE 学術講演会  1985

  • 水晶温度計(2)－水晶温度センサの低温での特性

    第24回 SICE 学術講演会  1985

  • 水晶温度計(1)－水晶振動子の基本特性

    第24回 SICE 学術講演会  1985

  • 水晶を利用したマイクロメカニカルデバイス

    横河技報  1985

  • 水晶を利用したマイクロメカニカルセンサ

    電子通信学会委員会報告  1985

  • 高温下における計測技術

    塑性と加工  1985

  • Accelerated Laser Speckle Strain Gauge, Proceedings of SPIE-

    The International Society for Optical Engineering, Vol.556  1985

  • Three-Dimensional Displacement Meter

    Proceedings of SPIE-The International Society for Optical Engineering,  1985

  • Quartz Crystal Micromechanical Devices

    Proceeding of the International Conference on Solid-State Sensors-Transducer'85  1985

  • 機械振動子を利用した高精度センサ

    計測と制御  1985

  • Accelerated Laser Speckle Strain Gauge

    Optical Engineering  1985

  • Precision Force Transducer Using Mechanical Resonators

    Mesurement  1985

  • 機械振動子を利用した高精度センサ

    計測と制御  1985

  • Accelerated Laser Speckle Strain Gauge, Proceedings of SPIE-

    The International Society for Optical Engineering, Vol.556  1985

  • Three-Dimensional Displacement Meter

    Proceedings of SPIE-The International Society for Optical Engineering,  1985

  • Quartz Crystal Micromechanical Devices

    Proceeding of the International Conference on Solid-State Sensors-Transducer'85  1985

  • Precision Transducers Using Mechanical Resonators

    The Jounal of the Society of Instrument and Control Engineers  1985

  • Accelerated Laser Speckle Strain Gauge

    Optical Engineering  1985

  • Precision Force Transducer Using Mechanical Resonators

    Mesurement  1985

  • Precision Transducers Using Mechanical Resonators

    Transaction of Instrument and Control Engineers  1985

  • Precision Transducer Using Mechanical Resonator

    Yokogawa Technical Report English Edition  1984

  • Precision Force Tra sducer Using Mechanical Resonators

    Proceedings of IMEKO TC-3 on Measurement of Force and Mass  1984

  • Precion Transducer Using Mecanical Resonators

    Deshi Tokyo  1984

  • 赤外線ガス分析用水晶マイクロホン

    第23回 SICE 学術講演会  1984

  • 回転型超音波ポテンショメータ

    第23回 SICE 学術講演会  1984

  • 横振動梁を使用した小型高精度圧力計

    第23回 SICE 学術講演会  1984

  • Precision Transducer Using Mechanical Resonator

    Yokogawa Technical Report English Edition  1984

  • Precision Force Tra sducer Using Mechanical Resonators

    Proceedings of IMEKO TC-3 on Measurement of Force and Mass  1984

  • Precion Transducer Using Mecanical Resonators

    Deshi Tokyo  1984

  • Precision Transducer Using Mechanical Resonator

    Yokogawa Technical Report English Edition  1984

  • Precision Force Tra sducer Using Mechanical Resonators

    Proceedings of IMEKO TC-3 on Measurement of Force and Mass  1984

  • Precion Transducer Using Mecanical Resonators

    Deshi Tokyo  1984

  • レーザースペックルを用いた三次元変位測定器

    第22回 SICE 学術講演会  1983

  • Displacement Transducer Using Magnetostrictive Delay Line

    Transaction of Instrument and Control Engineers  1981

  • 水晶歪ゲージ

    第20回 SICE 学術講演会  1981

  • 水晶偏光器

    第20回 SICE 学術講演会  1981

  • 横振動梁を使用した圧力計

    第20回 SICE 学術講演会  1981

  • 横振動梁を使用した電子はかり

    第20回 SICE 学術講演会  1981

  • 磁歪遅延線を使用した変位変換器

    計測自動制御学会論文集  1981

  • Displacement Transducer Using Magnetostrictive Delay Line

    Transaction of Instrument and Control Engineers  1981

  • 横振動梁を使用した検出器

    第19回 SICE 学術講演会  1980

  • 磁歪遅延式超音波ポテンショメータ

    第18回 SICE 学術講演会  1979

  • ディジタルマノメータ

    横河技報  1976

  • Micro actuators Based on Newly Developed Pseudo static Displacement Mechanism

    1995 Int.Mechanical Eng.Congress & Exposition, ASME'95, Nov.12-17, (1995), San Francisco Hilton, San Fran Cisco, California 

  • Micro actuators Based on Newly Developed Pseudo static Displacement Mechanism

    1995 Int.Mechanical Eng.Congress & Exposition, ASME'95, Nov.12-17, (1995), San Francisco Hilton, San Fran Cisco, California 

  • MEMSデバイス総論

    サイエンス&テクノロジー 

  • Micro actuators Based on Newly Developed Pseudo static Displacement Mechanism

    1995 Int.Mechanical Eng.Congress & Exposition, ASME'95, Nov.12-17, (1995), San Francisco Hilton, San Fran Cisco, California 

▼display all

Research Projects

  • MEMSデバイスシステム化のための研究開発

    受託研究

    Project Year :

    2007
    -
    2009
     

  • 水晶傾斜センサの製造技術に関する研究

    共同研究

    Project Year :

    2006
    -
    2009
     

  • 水晶傾斜センサの開発

    受託研究

    Project Year :

    2004
    -
    2009
     

  • Development Quartz Tilte Sensor

    Funded Research

    Project Year :

    2004
    -
    2009
     

  • 水晶傾斜センサの加工技術に関する研究

    Project Year :

    2006
    -
    2008
     

  • R&D of Quartz Tilt Sensor Manufcturing Technology

    Project Year :

    2006
    -
    2008
     

  • MEMS技術を使用した高感度センサの研究開発

    共同研究

    Project Year :

    2005
    -
    2008
     

  • High Sensitive Sensor Development Using MEMS Technilogy

    Cooperative Research

    Project Year :

    2005
    -
    2008
     

  • フオトニックファイバによる高感度ガス濃度計測

    共同研究

    Project Year :

    2004
    -
    2008
     

  • PPB Gas Concentration Measurement Using BGPF

    Cooperative Research

    Project Year :

    2004
    -
    2008
     

  • MEMSセンサ・デバイスの高感度化とシステム化技術の研究開発

    受託研究

    Project Year :

    2007
    -
    　
     

  • 水晶MEMS技術を利用した高感センサの開発

    Project Year :

    2005
    -
    2006
     

  • High Sensitive Sensors Development Using Quarz MEMS Technology

    Project Year :

    2005
    -
    2006
     

  • LDビームデリバリ技術の研究開発

    Project Year :

    2003
    -
    2006
     

  • R&D of LD Beam Derivery Technology

    Project Year :

    2003
    -
    2006
     

  • 水晶振動子+1加工技術

    Project Year :

    2002
    -
    2006
     

  • Quartz Resonators

    Project Year :

    2002
    -
    2006
     

  • 水晶のマイクロマシニングを利用した傾斜センサの開発

    Project Year :

    2004
    -
    2005
     

  • フオトニックファイバを利用した高感度ガス分析技術の研究開発

    Project Year :

    2004
    -
    2005
     

  • Quartz Tilt Sensor Development Using MEMS Technology

    Project Year :

    2004
    -
    2005
     

  • PPB Gas Concetration Measurement Using PHotonoc-Fiber

    Project Year :

    2004
    -
    2005
     

  • フォトン計測・加工

    共同研究

    Project Year :

    1997
    -
    2002
     

  • Advanded Photon Processing and Measurement Technology

    Cooperative Research

    Project Year :

    1997
    -
    2002
     

▼display all

Misc

  • 高解像度イメージファイバと内部照明光伝播機構を備えた歯科用内視鏡プローブの試作

    藤元 政孝, 吉居 慎二, 奥田 正浩, 池沢 聡, 植田 敏嗣, 西野 宇信, 永吉 雅人, 北村 知昭

    特定非営利活動法人日本歯科保存学会学術大会プログラムおよび講演抄録集   150回   154 - 154  2019.05

  • Robust Principle Component Analysisを用いたノイズ除去とコントラスト強調による歯科用内視鏡取得画像の視認性向上

    藤元政考, 吉居慎二, 奥田正浩, 池沢聡, 植田敏嗣, 西野宇信, 北村知昭

    日本歯科保存学会学術大会プログラムおよび講演抄録集(Web)   148th   75 (WEB ONLY)  2018.05

    J-GLOBAL

  • Optimization of Electroplated Platinum Catalyst for Quartz Hydrogen Sensors

      34   1 - 4  2017.10

    CiNii

  • 文献と臨床の橋わたし 治療法開発につながるトランスレーショナル・リサーチ(第3回) 歯・歯周組織の診断治療用マイクロ内視鏡システムの開発

    吉居 慎二, 藤元 政孝, 植田 敏嗣, 北村 知昭

    日本歯科評論   77 ( 3 ) 153 - 156  2017.03

    CiNii

  • 根管観察用内視鏡の設計と製作

    藤元 政孝, 吉居 慎二, 池沢 聡, 植田 敏嗣, 北村 知昭

    特定非営利活動法人日本歯科保存学会学術大会プログラムおよび講演抄録集   144回   51 - 51  2016.06

  • 歯内・歯周病変の高精度診断用イメージファイバ観察システム

    藤元 政孝, 吉居 慎二, 池沢 聡, 植田 敏嗣, 北村 知昭

    九州歯科学会雑誌   70 ( 補冊 ) 21 - 21  2016.04

  • 歯科用内視鏡による根管観察法の検討及び取得画像の三次元化

    藤元 政孝, 吉居 慎二, 池沢 聡, 植田 敏嗣, 北村 知昭

    特定非営利活動法人日本歯科保存学会学術大会プログラムおよび講演抄録集   142回   145 - 145  2015.06

  • 歯・歯周組織の微細構造を見るマイクロ・イメージファイバーシステム． 特別企画 歯の保存におけるNext Step －研究から臨床へ－

    吉居慎二, 植田敏嗣, 池沢聡, 北村知昭

    歯界展望   128 ( 4 ) 643 - 649  2015  [Invited]

    Article, review, commentary, editorial, etc. (trade magazine, newspaper, online media)  

  • 3D Single Concave Vertex Anisotropic Etching Simulation for AT-cut Quartz Wafer

    ZHANG Yu, OIGAWA Hiroshi, ZHAO Meng, IKEZAWA Satoshi, UEDA Toshitsugu

    電気学会全国大会講演論文集(CD-ROM)   2014  2014

    J-GLOBAL

  • 根管・歯周組織への応用を目指した新規内視鏡の開発

    吉居 慎二, 張 宇鵬, 北村 知昭, 寺下 正道, 西原 達次, 植田 敏嗣

    特定非営利活動法人日本歯科保存学会学術大会プログラムおよび講演抄録集   138回   87 - 87  2013.05

  • Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods

    Hongbin Shi, F. X. Che, Cuihua Tian, Rui Zhang, Jong Tae Park, Toshitsugu Ueda

    MICROELECTRONICS RELIABILITY   52 ( 9-10 ) 1870 - 1875  2012.09

    　View Summary

    In this paper, we present the thermal cycling test results for edge and corner bonded lead-free PSvfBGAs on a high-T-g test board. The test results show that the characteristic lives of PSvfBGAs with edge bond acrylic, edge bond epoxy and corner bond epoxy are respectively about 0.6, 0.9 and 1.3 times of the PSvfBGAs without bonding. The epoxy with lowest CTE, highest storage modulus and smallest adhesive volume yielded best performance. The 3D quarter finite element model was also built to further study the failure mechanism. (C) 2012 Elsevier Ltd. All rights reserved.

    DOI

  • Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model

    Rui Zhang, Hongbin Shi, Yuehong Dai, Jong Tae Park, Toshitsugu Ueda

    MICROELECTRONICS RELIABILITY   52 ( 9-10 ) 2331 - 2335  2012.09

    　View Summary

    This paper presents the investigation of the thermal mechanical reliability of a hydrogen gas sensor using MEMS-based quartz resonator by finite element analysis (FEA). The hydrogen gas senor has an internal heat source when in operating, the quartz resonator may subjected to thermal stress due to the thermal expansion coefficients (CTE) mismatch between the resonator and the LTCC package. This could cause cracks on the resonator and finally lead to failure of the sensor. Both thermal and thermo-mechanical simulations of a 3D model of the sensor were built using ANSYS software. Higher thermal mechanical stress level was found in the resonator based on the FEA, which is consistent with the results of verified experiments. Some optimal design was also carried out to improve the thermal reliability of the resonator based on validated finite element model. Crown Copyright (C) 2012 Published by Elsevier Ltd. All rights reserved.

    DOI

  • Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods

    Hongbin Shi, F. X. Che, Cuihua Tian, Rui Zhang, Jong Tae Park, Toshitsugu Ueda

    MICROELECTRONICS RELIABILITY   52 ( 9-10 ) 1870 - 1875  2012.09

    　View Summary

    In this paper, we present the thermal cycling test results for edge and corner bonded lead-free PSvfBGAs on a high-T-g test board. The test results show that the characteristic lives of PSvfBGAs with edge bond acrylic, edge bond epoxy and corner bond epoxy are respectively about 0.6, 0.9 and 1.3 times of the PSvfBGAs without bonding. The epoxy with lowest CTE, highest storage modulus and smallest adhesive volume yielded best performance. The 3D quarter finite element model was also built to further study the failure mechanism. (C) 2012 Elsevier Ltd. All rights reserved.

    DOI

  • Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model

    Rui Zhang, Hongbin Shi, Yuehong Dai, Jong Tae Park, Toshitsugu Ueda

    MICROELECTRONICS RELIABILITY   52 ( 9-10 ) 2331 - 2335  2012.09

    　View Summary

    This paper presents the investigation of the thermal mechanical reliability of a hydrogen gas sensor using MEMS-based quartz resonator by finite element analysis (FEA). The hydrogen gas senor has an internal heat source when in operating, the quartz resonator may subjected to thermal stress due to the thermal expansion coefficients (CTE) mismatch between the resonator and the LTCC package. This could cause cracks on the resonator and finally lead to failure of the sensor. Both thermal and thermo-mechanical simulations of a 3D model of the sensor were built using ANSYS software. Higher thermal mechanical stress level was found in the resonator based on the FEA, which is consistent with the results of verified experiments. Some optimal design was also carried out to improve the thermal reliability of the resonator based on validated finite element model. Crown Copyright (C) 2012 Published by Elsevier Ltd. All rights reserved.

    DOI

  • Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods

    Hongbin Shi, F. X. Che, Cuihua Tian, Rui Zhang, Jong Tae Park, Toshitsugu Ueda

    MICROELECTRONICS RELIABILITY   52 ( 9-10 ) 1870 - 1875  2012.09

    　View Summary

    In this paper, we present the thermal cycling test results for edge and corner bonded lead-free PSvfBGAs on a high-T-g test board. The test results show that the characteristic lives of PSvfBGAs with edge bond acrylic, edge bond epoxy and corner bond epoxy are respectively about 0.6, 0.9 and 1.3 times of the PSvfBGAs without bonding. The epoxy with lowest CTE, highest storage modulus and smallest adhesive volume yielded best performance. The 3D quarter finite element model was also built to further study the failure mechanism. (C) 2012 Elsevier Ltd. All rights reserved.

    DOI

  • Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model

    Rui Zhang, Hongbin Shi, Yuehong Dai, Jong Tae Park, Toshitsugu Ueda

    MICROELECTRONICS RELIABILITY   52 ( 9-10 ) 2331 - 2335  2012.09

    　View Summary

    This paper presents the investigation of the thermal mechanical reliability of a hydrogen gas sensor using MEMS-based quartz resonator by finite element analysis (FEA). The hydrogen gas senor has an internal heat source when in operating, the quartz resonator may subjected to thermal stress due to the thermal expansion coefficients (CTE) mismatch between the resonator and the LTCC package. This could cause cracks on the resonator and finally lead to failure of the sensor. Both thermal and thermo-mechanical simulations of a 3D model of the sensor were built using ANSYS software. Higher thermal mechanical stress level was found in the resonator based on the FEA, which is consistent with the results of verified experiments. Some optimal design was also carried out to improve the thermal reliability of the resonator based on validated finite element model. Crown Copyright (C) 2012 Published by Elsevier Ltd. All rights reserved.

    DOI

  • NIR Spectrum Analysis of Natural Gas Based on Hollow-Core Photonic Bandgap Fiber

    Xuefeng Li, Jinxing Liang, Shuo Lin, Yury Zimin, Yupeng Zhang, Toshitsugu Ueda

    IEEE SENSORS JOURNAL   12 ( 7 ) 2362 - 2367  2012.07

    　View Summary

    In this paper, we present a quantitative near-infrared spectroscopy measurement of the chemical compositions of gas mixtures, such as natural gas, based on a photonic bandgap fiber gas cell. The absorption spectra of the methane and ethane gases were investigated in the near-infrared region. The absorption lines of the ethane gas were observed in the 1600-1616-nm region, and were totally different from those of the methane gas. To our knowledge, this is the first study to measure the individual absorption lines of ethane in this range of wavelengths, and our finding has a great potential for sensing highly sensitive gases.

    DOI

  • NIR Spectrum Analysis of Natural Gas Based on Hollow-Core Photonic Bandgap Fiber

    Xuefeng Li, Jinxing Liang, Shuo Lin, Yury Zimin, Yupeng Zhang, Toshitsugu Ueda

    IEEE SENSORS JOURNAL   12 ( 7 ) 2362 - 2367  2012.07

    　View Summary

    In this paper, we present a quantitative near-infrared spectroscopy measurement of the chemical compositions of gas mixtures, such as natural gas, based on a photonic bandgap fiber gas cell. The absorption spectra of the methane and ethane gases were investigated in the near-infrared region. The absorption lines of the ethane gas were observed in the 1600-1616-nm region, and were totally different from those of the methane gas. To our knowledge, this is the first study to measure the individual absorption lines of ethane in this range of wavelengths, and our finding has a great potential for sensing highly sensitive gases.

    DOI

  • NIR Spectrum Analysis of Natural Gas Based on Hollow-Core Photonic Bandgap Fiber

    Xuefeng Li, Jinxing Liang, Shuo Lin, Yury Zimin, Yupeng Zhang, Toshitsugu Ueda

    IEEE SENSORS JOURNAL   12 ( 7 ) 2362 - 2367  2012.07

    　View Summary

    In this paper, we present a quantitative near-infrared spectroscopy measurement of the chemical compositions of gas mixtures, such as natural gas, based on a photonic bandgap fiber gas cell. The absorption spectra of the methane and ethane gases were investigated in the near-infrared region. The absorption lines of the ethane gas were observed in the 1600-1616-nm region, and were totally different from those of the methane gas. To our knowledge, this is the first study to measure the individual absorption lines of ethane in this range of wavelengths, and our finding has a great potential for sensing highly sensitive gases.

    DOI

  • 根管・歯周組織の微細構造観察を目指した高解像度内視鏡の開発

    吉居 慎二, 北村 知昭, 西原 達次, 寺下 正道, 植田 敏嗣

    日本歯内療法学会学術大会プログラム・抄録集   33回   82 - 82  2012.06

  • High-Sensitivity Fiber-Optic Fabry-Perot Interferometer Temperature Sensor

    Xuefeng Li, Shuo Lin, Jinxing Liang, Hiroshi Oigawa, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   51 ( 6 ) 06FL10 1-4  2012.06

    　View Summary

    A novel structure of a fiber-optic Fabry-Perot interferometric (FFPI) temperature sensor is presented in this paper. The design of the sensor is analyzed and evaluated by the finite-difference time-domain (FDTD) method. Then, the proposed sensor is fabricated using a conventional single-mode fiber (SMF). A gold (Au) layer and a nickel (Ni) layer are sputtered and electroplated on the surface of the SMF, respectively. As a Fabry-Perot (FP) cavity, a micro-punch-hole is machined by focused ion beam (FIB) milling. Here, the structure of the FP cavity can be considered a pair of bimetallic strips. On the basis of the sharp difference in thermal expansion coefficient between the fused silica and the metallic materials, the temperature sensitivity of the proposed sensor was determined to be over 70 pm/degrees C in the 0 to +60 degrees C range. The standard deviation of temperature is less than 0.15 degrees C in 1 h. (C) 2012 The Japan Society of Applied Physics

    DOI

  • Vibration Analysis of Original Shape Quartz Resonator for High Quality Factor Realization

    Hiroshi Oigawa, Yuuya Sakano, Jing Ji, Daisuke Yamazaki, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   51 ( 6 ) 06FL02 1-5  2012.06

    　View Summary

    AT-cut quartz resonators are widely used as timing devices in computers, mobile information, and communication tools, etc. Recently, quartz resonators have been applied to highly sensitive devices. To improve frequency stability, AT-cut quartz resonators must have an excellent temperature characteristic and high quality (Q) factor. Energy trapping and spurious mode coupling strongly affect the performance of resonators, and both parameters are determined by the shape of the resonator. As for achieving a higher Q, the most effective technique is to process the quartz cross-sectional shape into a plano-convex or bi-convex shape. However, it is difficult to manufacture a convex shape on the surface of a quartz wafer. For this reason, we propose an equivalent plano-convex shape, which was realized by arranging fine protrusions on the surface of quartz. In addition, the optimization of the original resonator shape has been discussed. (C) 2012 The Japan Society of Applied Physics

    DOI

  • High-Sensitivity Fiber-Optic Fabry-Perot Interferometer Temperature Sensor

    Xuefeng Li, Shuo Lin, Jinxing Liang, Hiroshi Oigawa, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   51 ( 6 ) 06FL10 1-4  2012.06

    　View Summary

    A novel structure of a fiber-optic Fabry-Perot interferometric (FFPI) temperature sensor is presented in this paper. The design of the sensor is analyzed and evaluated by the finite-difference time-domain (FDTD) method. Then, the proposed sensor is fabricated using a conventional single-mode fiber (SMF). A gold (Au) layer and a nickel (Ni) layer are sputtered and electroplated on the surface of the SMF, respectively. As a Fabry-Perot (FP) cavity, a micro-punch-hole is machined by focused ion beam (FIB) milling. Here, the structure of the FP cavity can be considered a pair of bimetallic strips. On the basis of the sharp difference in thermal expansion coefficient between the fused silica and the metallic materials, the temperature sensitivity of the proposed sensor was determined to be over 70 pm/degrees C in the 0 to +60 degrees C range. The standard deviation of temperature is less than 0.15 degrees C in 1 h. (C) 2012 The Japan Society of Applied Physics

    DOI

  • Vibration Analysis of Original Shape Quartz Resonator for High Quality Factor Realization

    Hiroshi Oigawa, Yuuya Sakano, Jing Ji, Daisuke Yamazaki, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   51 ( 6 ) 06FL02 1-5  2012.06

    　View Summary

    AT-cut quartz resonators are widely used as timing devices in computers, mobile information, and communication tools, etc. Recently, quartz resonators have been applied to highly sensitive devices. To improve frequency stability, AT-cut quartz resonators must have an excellent temperature characteristic and high quality (Q) factor. Energy trapping and spurious mode coupling strongly affect the performance of resonators, and both parameters are determined by the shape of the resonator. As for achieving a higher Q, the most effective technique is to process the quartz cross-sectional shape into a plano-convex or bi-convex shape. However, it is difficult to manufacture a convex shape on the surface of a quartz wafer. For this reason, we propose an equivalent plano-convex shape, which was realized by arranging fine protrusions on the surface of quartz. In addition, the optimization of the original resonator shape has been discussed. (C) 2012 The Japan Society of Applied Physics

    DOI

  • High-Sensitivity Fiber-Optic Fabry-Perot Interferometer Temperature Sensor

    Xuefeng Li, Shuo Lin, Jinxing Liang, Hiroshi Oigawa, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   51 ( 6 ) 06FL10 1-4  2012.06

    　View Summary

    A novel structure of a fiber-optic Fabry-Perot interferometric (FFPI) temperature sensor is presented in this paper. The design of the sensor is analyzed and evaluated by the finite-difference time-domain (FDTD) method. Then, the proposed sensor is fabricated using a conventional single-mode fiber (SMF). A gold (Au) layer and a nickel (Ni) layer are sputtered and electroplated on the surface of the SMF, respectively. As a Fabry-Perot (FP) cavity, a micro-punch-hole is machined by focused ion beam (FIB) milling. Here, the structure of the FP cavity can be considered a pair of bimetallic strips. On the basis of the sharp difference in thermal expansion coefficient between the fused silica and the metallic materials, the temperature sensitivity of the proposed sensor was determined to be over 70 pm/degrees C in the 0 to +60 degrees C range. The standard deviation of temperature is less than 0.15 degrees C in 1 h. (C) 2012 The Japan Society of Applied Physics

    DOI

  • Vibration Analysis of Original Shape Quartz Resonator for High Quality Factor Realization

    Hiroshi Oigawa, Yuuya Sakano, Jing Ji, Daisuke Yamazaki, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   51 ( 6 ) 06FL02 1-5  2012.06

    　View Summary

    AT-cut quartz resonators are widely used as timing devices in computers, mobile information, and communication tools, etc. Recently, quartz resonators have been applied to highly sensitive devices. To improve frequency stability, AT-cut quartz resonators must have an excellent temperature characteristic and high quality (Q) factor. Energy trapping and spurious mode coupling strongly affect the performance of resonators, and both parameters are determined by the shape of the resonator. As for achieving a higher Q, the most effective technique is to process the quartz cross-sectional shape into a plano-convex or bi-convex shape. However, it is difficult to manufacture a convex shape on the surface of a quartz wafer. For this reason, we propose an equivalent plano-convex shape, which was realized by arranging fine protrusions on the surface of quartz. In addition, the optimization of the original resonator shape has been discussed. (C) 2012 The Japan Society of Applied Physics

    DOI

  • Thermomechanical Fatigue Performance of Lead-Free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills

    Hongbin Shi, Cuihua Tian, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   51 ( 5 ) 05EE04 1-8  2012.05

    　View Summary

    In this paper, we present the results of temperature cycling test for full and partial capillary flow underfilled lead-free chip scale packages (CSPs), the tests were carried out on the basis of JEDEC standard. Two kinds of representative fast cure and reworkable underfill materials are used in this study, and CSPs without underfills were also tested for comparison. The test results show that the two underfill materials reduce the thermomechanical fatigue performance of CSP assemblies. The underfill with high T-g and storage modulus yielded better performance; indeed, the coefficient of thermal expansion (CTE) is also very critical to the thermomechanical fatigue performance, but its effects is not so obvious in this study owing to the similar CTEs of the underfills used. In addition, the negative effect of a partial underfill pattern is smaller than that of a full underfill pattern. Failure analysis shows that the dominant failure mode observed is solder cracking near the package and/or printed circuit board pads. (C) 2012 The Japan Society of Applied Physics

    DOI

  • Thermomechanical Fatigue Performance of Lead-Free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills

    Hongbin Shi, Cuihua Tian, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   51 ( 5 ) 05EE04 1-8  2012.05

    　View Summary

    In this paper, we present the results of temperature cycling test for full and partial capillary flow underfilled lead-free chip scale packages (CSPs), the tests were carried out on the basis of JEDEC standard. Two kinds of representative fast cure and reworkable underfill materials are used in this study, and CSPs without underfills were also tested for comparison. The test results show that the two underfill materials reduce the thermomechanical fatigue performance of CSP assemblies. The underfill with high T-g and storage modulus yielded better performance; indeed, the coefficient of thermal expansion (CTE) is also very critical to the thermomechanical fatigue performance, but its effects is not so obvious in this study owing to the similar CTEs of the underfills used. In addition, the negative effect of a partial underfill pattern is smaller than that of a full underfill pattern. Failure analysis shows that the dominant failure mode observed is solder cracking near the package and/or printed circuit board pads. (C) 2012 The Japan Society of Applied Physics

    DOI

  • Thermomechanical Fatigue Performance of Lead-Free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills

    Hongbin Shi, Cuihua Tian, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   51 ( 5 ) 05EE04 1-8  2012.05

    　View Summary

    In this paper, we present the results of temperature cycling test for full and partial capillary flow underfilled lead-free chip scale packages (CSPs), the tests were carried out on the basis of JEDEC standard. Two kinds of representative fast cure and reworkable underfill materials are used in this study, and CSPs without underfills were also tested for comparison. The test results show that the two underfill materials reduce the thermomechanical fatigue performance of CSP assemblies. The underfill with high T-g and storage modulus yielded better performance; indeed, the coefficient of thermal expansion (CTE) is also very critical to the thermomechanical fatigue performance, but its effects is not so obvious in this study owing to the similar CTEs of the underfills used. In addition, the negative effect of a partial underfill pattern is smaller than that of a full underfill pattern. Failure analysis shows that the dominant failure mode observed is solder cracking near the package and/or printed circuit board pads. (C) 2012 The Japan Society of Applied Physics

    DOI

  • Board-Level Solder Joint Reliability of Edge- and Corner-Bonded Lead-Free Chip Scale Package Assemblies Subjected to Thermal Cycling

    Hongbin Shi, Cuihua Tian, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   51 ( 4 ) 04DB08 1-10  2012.04

    　View Summary

    In this paper, we present the results of thermal cycling test for edge- and corner-bonded lead-free chip scale packages (CSPs), which was carried out on the basis of the IPC-9701 test standard. Six materials were used in this study: four edge- bond adhesives and two corner-bond adhesives. These adhesives were compared with CSPs with full capillary flow underfill (FCFU) and without adhesives. The thermal cycling test results show that corner-bond adhesive has comparable solder joint reliability performance with CSP without adhesive, and is better than edge- bond adhesive, followed by CSPs with FCFU. In addition, the adhesives with a low coefficient of thermal expansion, a high glass transition temperature and a intermediate storage modulus yielded good performance. Results of detailed failure analysis indicate that the dominant failure mode is solder bulk fatigue cracking near package and/or printed circuit board (PCB) pads, and that the location of critical solder joints change from die edges to package corners with the introduction of adhesives. (C) 2012 The Japan Society of Applied Physics

    DOI

  • Board-Level Solder Joint Reliability of Edge- and Corner-Bonded Lead-Free Chip Scale Package Assemblies Subjected to Thermal Cycling

    Hongbin Shi, Cuihua Tian, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   51 ( 4 ) 04DB08 1-10  2012.04

    　View Summary

    In this paper, we present the results of thermal cycling test for edge- and corner-bonded lead-free chip scale packages (CSPs), which was carried out on the basis of the IPC-9701 test standard. Six materials were used in this study: four edge- bond adhesives and two corner-bond adhesives. These adhesives were compared with CSPs with full capillary flow underfill (FCFU) and without adhesives. The thermal cycling test results show that corner-bond adhesive has comparable solder joint reliability performance with CSP without adhesive, and is better than edge- bond adhesive, followed by CSPs with FCFU. In addition, the adhesives with a low coefficient of thermal expansion, a high glass transition temperature and a intermediate storage modulus yielded good performance. Results of detailed failure analysis indicate that the dominant failure mode is solder bulk fatigue cracking near package and/or printed circuit board (PCB) pads, and that the location of critical solder joints change from die edges to package corners with the introduction of adhesives. (C) 2012 The Japan Society of Applied Physics

    DOI

  • Board-Level Solder Joint Reliability of Edge- and Corner-Bonded Lead-Free Chip Scale Package Assemblies Subjected to Thermal Cycling

    Hongbin Shi, Cuihua Tian, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   51 ( 4 ) 04DB08 1-10  2012.04

    　View Summary

    In this paper, we present the results of thermal cycling test for edge- and corner-bonded lead-free chip scale packages (CSPs), which was carried out on the basis of the IPC-9701 test standard. Six materials were used in this study: four edge- bond adhesives and two corner-bond adhesives. These adhesives were compared with CSPs with full capillary flow underfill (FCFU) and without adhesives. The thermal cycling test results show that corner-bond adhesive has comparable solder joint reliability performance with CSP without adhesive, and is better than edge- bond adhesive, followed by CSPs with FCFU. In addition, the adhesives with a low coefficient of thermal expansion, a high glass transition temperature and a intermediate storage modulus yielded good performance. Results of detailed failure analysis indicate that the dominant failure mode is solder bulk fatigue cracking near package and/or printed circuit board (PCB) pads, and that the location of critical solder joints change from die edges to package corners with the introduction of adhesives. (C) 2012 The Japan Society of Applied Physics

    DOI

  • Fiber-Optic Temperature Sensor Based on Difference of Thermal Expansion Coefficient Between Fused Silica and Metallic Materials

    Xuefeng Li, Shuo Lin, Jinxing Liang, Yupeng Zhang, Hiroshi Oigawa, Toshitsugu Ueda

    IEEE PHOTONICS JOURNAL   4 ( 1 ) 155 - 162  2012.02

    　View Summary

    In this paper, we report a novel fiber-optic Fabry-Perot interferometric (FFPI) temperature sensor based on the difference of thermal expansion coefficient between fused silica and metallic materials. The sensor head is made by a single-mode fiber (SMF). A gold film and a nickel film are sputtered and electroplated on the surface of the SMF. Then, a microcavity is micromachined by focused ion beam (FIB) milling. Because the thermal expansion coefficient of nickel is about 20 times of fused silica, the different thermal expansions force the sensor head to bend when the temperature is high or low. Its temperature sensitivity is over 14 pm/degrees C in a wide range from -79 degrees C to + 70 degrees C. And the coefficient of determination R-2 is excellent (over 0.995). Moreover, the metallic cylinder can reinforce the cavity spot of the fiber sensor, so that this kind of sensor can work in harsh environments. For the first time to the best of our knowledge, we report this type of FFPI temperature sensor based on difference of thermal expansion coefficient between fused silica and metallic materials.

    DOI

  • Fiber-Optic Temperature Sensor Based on Difference of Thermal Expansion Coefficient Between Fused Silica and Metallic Materials

    Xuefeng Li, Shuo Lin, Jinxing Liang, Yupeng Zhang, Hiroshi Oigawa, Toshitsugu Ueda

    IEEE PHOTONICS JOURNAL   4 ( 1 ) 155 - 162  2012.02

    　View Summary

    In this paper, we report a novel fiber-optic Fabry-Perot interferometric (FFPI) temperature sensor based on the difference of thermal expansion coefficient between fused silica and metallic materials. The sensor head is made by a single-mode fiber (SMF). A gold film and a nickel film are sputtered and electroplated on the surface of the SMF. Then, a microcavity is micromachined by focused ion beam (FIB) milling. Because the thermal expansion coefficient of nickel is about 20 times of fused silica, the different thermal expansions force the sensor head to bend when the temperature is high or low. Its temperature sensitivity is over 14 pm/degrees C in a wide range from -79 degrees C to + 70 degrees C. And the coefficient of determination R-2 is excellent (over 0.995). Moreover, the metallic cylinder can reinforce the cavity spot of the fiber sensor, so that this kind of sensor can work in harsh environments. For the first time to the best of our knowledge, we report this type of FFPI temperature sensor based on difference of thermal expansion coefficient between fused silica and metallic materials.

    DOI

  • Fiber-Optic Temperature Sensor Based on Difference of Thermal Expansion Coefficient Between Fused Silica and Metallic Materials

    Xuefeng Li, Shuo Lin, Jinxing Liang, Yupeng Zhang, Hiroshi Oigawa, Toshitsugu Ueda

    IEEE PHOTONICS JOURNAL   4 ( 1 ) 155 - 162  2012.02

    　View Summary

    In this paper, we report a novel fiber-optic Fabry-Perot interferometric (FFPI) temperature sensor based on the difference of thermal expansion coefficient between fused silica and metallic materials. The sensor head is made by a single-mode fiber (SMF). A gold film and a nickel film are sputtered and electroplated on the surface of the SMF. Then, a microcavity is micromachined by focused ion beam (FIB) milling. Because the thermal expansion coefficient of nickel is about 20 times of fused silica, the different thermal expansions force the sensor head to bend when the temperature is high or low. Its temperature sensitivity is over 14 pm/degrees C in a wide range from -79 degrees C to + 70 degrees C. And the coefficient of determination R-2 is excellent (over 0.995). Moreover, the metallic cylinder can reinforce the cavity spot of the fiber sensor, so that this kind of sensor can work in harsh environments. For the first time to the best of our knowledge, we report this type of FFPI temperature sensor based on difference of thermal expansion coefficient between fused silica and metallic materials.

    DOI

  • Detection of Cesium from Pollucite using Laser-Induced Breakdown Spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    Proceedings of 8th International Conference Mechatronic Systems and Materials, pp.198, Bialystok, Poland    2012

  • Development of The Quartz Resonators with Quasi-Convex Structure

    H. Oigawa, Y. Sakano, J. Ji, T. Ueda

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000087    2012

  • A New Solution of Anisotropic 3D Vertex Etching Simulation for Quartz Crystal

    M. Zhao, H. Oigawa, J. Ji, T. Ueda

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000091    2012

  • Size Optimization for Miniature High Frequency Quartz Resonator using Finite Element Method

    J. Ji, H.Oigawa, M. Zhao, H. Yu, T. Ueda

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000081    2012

  • Ringing reduction for radially restored images

    Yupeng Zhang, Toshitsugu Ueda

    Proceedings of Applied Industrial Optics: Spectroscopy, Imaging and Metrology (AIO) Monterey, JTu5A.24.pdf, California    2012

  • Thermomechanical Reliability Analysis and Optimization for MEMS Packages With AuSn Solder

    Rui Zhang, Hongbin Shi, Toshitsugu Ueda, Jiong Zhang, Yuehong Dai

    2012 INTERNATIONAL CONFERENCE ON QUALITY, RELIABILITY, RISK, MAINTENANCE, AND SAFETY ENGINEERING (ICQR2MSE)     794 - 797  2012

    　View Summary

    Thermal stress formed in the solder of the microelectromechanical systems (MEMS) sensor during the reflow soldering process due to the coefficients of thermal expansion (CTE) mismatch between the different materials. As the package needs to be hermetically sealed to protect the device from outside environmental effects, the local stress concentration would eventually cause cracks in the solder and influence the hermeticity. In this study, we present the thermo-mechanical analysis of the AuSn90 solder with low temperature co-fired ceramic (LTCC) package using Comsol Multiphysics. Thermal residual stress distribution in the solder after the reflow soldering process was simulated. According to the result, the maximum von Mises stress was found and several possible ways for minimizing the stress in the solder and improving the thermo-mechanical reliability were discussed.

    DOI

  • Technology and applications using laser-induced electro-avalanche fluorescence and laser induced incandescence technique

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    Proceedings of China-Japan Joint Symposium on Sensing Technology, , Southeast University, Nanjing, China, April 22-25     14  2012

  • A geometry solution for 3D anisotropic etching simulation

    Meng Zhao, Jing Ji, Toshitsugu Ueda

    Proceedings of China-Japan Joint Symposium on Sensing Technology, Southeast University, Nanjing, China, April 22-25     12  2012

  • Real scene capturing and deblurring for spherical single lens camera

    Yupeng Zhang, Lev G. Zimin, Toshitsugu Ueda

    Proceedings of China-Japan Joint Symposium on Sensing Technology, Southeast University, Nanjing, China, April 22-25     3  2012

  • Optimization of electrode structure for a high-frequency AT-cut quartz resonator using FEM

    Jing Ji, Hiroshi Oigawa, Hsin Hui Chen, Meng Zhao, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   132 ( 9 ) 275 - 281  2012

    　View Summary

    For the first time a peripheral electrode is employed to a high-frequency quartz plate resonator that has a rectangular excitation electrode. The two-dimensional finite element method is used to optimize the electrode and verify resonator performance. The results show that optimized electrodes provide effective energy trapping and less vibration coupling. The optimized peripheral electrode efficiently suppresses inharmonic overtone mode. High Q-factor is also achieved. © 2012 The Institute of Electrical Engineers of Japan.

    DOI

  • Development of semi-quantitative analytical system for metal nanoparticle ink using laser-induced breakdown spectroscopy

    S. Ikezawa, M. Wakamatsu, T. Ueda

    International Journal on Smart Sensing and Intelligent Systems   5 ( 1 ) 215 - 232  2012

    　View Summary

    This paper describes the semi-quantitative analysis of metal nanoparticle ink using laser-induced breakdown spectroscopy (LIBS). LIBS can be used to obtain information about the density and chemical composition of silver particles or copper particles, even ultrafine particles. Metal particles have been attracting much attention because of their increased use in new micro-nano technologies. In this work, LIBS was used as a fine metal particle measurement system for nanometallic materials used in printing. Good spectral peak resolutions were obtained when the Ag spectra were recorded at wavelengths of 328.068 nm and 338.289 nm and Cu spectra at 324.754 nm and 327.396 nm.

    DOI

  • 遮光マスクを用いた歯科治療用根管内観察システムの内部反射光の低減

    陳 号, 吉居 慎二, Lev, G. Zimin, 張 宇鵬, 池沢 聡, 植田 敏嗣

    平成24年第65回電気関係学会九州支部連合大会論文集, p.45    2012

  • 擬似コンベックス形状を有した水晶振動子の凸部の高さとＱ値の関係

    阪野 祐也, 大井川 寛, 植田 敏嗣

    平成24年第65回電気関係学会九州支部連合大会論文集, p. 44    2012

  • 異なる温度におけるATカット水晶振動子の有限要素法による寸法最適化

    宇 航, 紀 静, 大井川 寛, 池沢 聡, 植田敏嗣

    平成24年第65回電気関係学会九州支部連合大会論文集, p. 43    2012

  • コンベックス振動子を模擬した新形状の高安定振動子

    阪野祐也, 桐野雄宇, 大井川 寛, 植田敏嗣

    平成24年電気学会全国大会, pp. , (3-124),    2012

  • 傾斜角センサの演算表示プログラム開発

    羅 捷軍, 播磨幸一, 高森政聡, 幸坂扶佐夫, 植田敏嗣

    平成24年電気学会全国大会, pp. , (3-122)    2012

  • 二軸容量型傾斜角センサのプロセスの開発と評価

    劉健男, 播磨幸一, 高森政聡, 植田敏嗣

    平成24年電気学会全国大会, pp. , (3-121)    2012

  • MEMSパッケージの気密性評価法の開発

    程サンサン, 高森政聡, 植田敏嗣

    平成24年電気学会全国大会, pp. , (3-131),    2012

  • Detection of Cesium from Pollucite using Laser-Induced Breakdown Spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    Proceedings of 8th International Conference Mechatronic Systems and Materials, pp.198, Bialystok, Poland    2012

  • Development of The Quartz Resonators with Quasi-Convex Structure

    H. Oigawa, Y. Sakano, J. Ji, T. Ueda

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000087    2012

  • A New Solution of Anisotropic 3D Vertex Etching Simulation for Quartz Crystal

    M. Zhao, H. Oigawa, J. Ji, T. Ueda

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000091    2012

  • Size Optimization for Miniature High Frequency Quartz Resonator using Finite Element Method

    J. Ji, H.Oigawa, M. Zhao, H. Yu, T. Ueda

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000081    2012

  • Ringing reduction for radially restored images

    Yupeng Zhang, Toshitsugu Ueda

    Proceedings of Applied Industrial Optics: Spectroscopy, Imaging and Metrology (AIO) Monterey, JTu5A.24.pdf, California    2012

  • Thermomechanical Reliability Analysis and Optimization for MEMS Packages With AuSn Solder

    Rui Zhang, Hongbin Shi, Toshitsugu Ueda, Jiong Zhang, Yuehong Dai

    2012 INTERNATIONAL CONFERENCE ON QUALITY, RELIABILITY, RISK, MAINTENANCE, AND SAFETY ENGINEERING (ICQR2MSE)     794 - 797  2012

    　View Summary

    Thermal stress formed in the solder of the microelectromechanical systems (MEMS) sensor during the reflow soldering process due to the coefficients of thermal expansion (CTE) mismatch between the different materials. As the package needs to be hermetically sealed to protect the device from outside environmental effects, the local stress concentration would eventually cause cracks in the solder and influence the hermeticity. In this study, we present the thermo-mechanical analysis of the AuSn90 solder with low temperature co-fired ceramic (LTCC) package using Comsol Multiphysics. Thermal residual stress distribution in the solder after the reflow soldering process was simulated. According to the result, the maximum von Mises stress was found and several possible ways for minimizing the stress in the solder and improving the thermo-mechanical reliability were discussed.

    DOI

  • Technology and applications using laser-induced electro-avalanche fluorescence and laser induced incandescence technique

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    Proceedings of China-Japan Joint Symposium on Sensing Technology, , Southeast University, Nanjing, China, April 22-25     14  2012

  • A geometry solution for 3D anisotropic etching simulation

    Meng Zhao, Jing Ji, Toshitsugu Ueda

    Proceedings of China-Japan Joint Symposium on Sensing Technology, Southeast University, Nanjing, China, April 22-25     12  2012

  • Real scene capturing and deblurring for spherical single lens camera

    Yupeng Zhang, Lev G. Zimin, Toshitsugu Ueda

    Proceedings of China-Japan Joint Symposium on Sensing Technology, Southeast University, Nanjing, China, April 22-25     3  2012

  • Optimization of electrode structure for a high-frequency AT-cut quartz resonator using FEM

    Jing Ji, Hiroshi Oigawa, Hsin Hui Chen, Meng Zhao, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   132 ( 9 ) 275 - 281  2012

    　View Summary

    For the first time a peripheral electrode is employed to a high-frequency quartz plate resonator that has a rectangular excitation electrode. The two-dimensional finite element method is used to optimize the electrode and verify resonator performance. The results show that optimized electrodes provide effective energy trapping and less vibration coupling. The optimized peripheral electrode efficiently suppresses inharmonic overtone mode. High Q-factor is also achieved. © 2012 The Institute of Electrical Engineers of Japan.

    DOI

  • Development of semi-quantitative analytical system for metal nanoparticle ink using laser-induced breakdown spectroscopy

    S. Ikezawa, M. Wakamatsu, T. Ueda

    International Journal on Smart Sensing and Intelligent Systems   5 ( 1 ) 215 - 232  2012

    　View Summary

    This paper describes the semi-quantitative analysis of metal nanoparticle ink using laser-induced breakdown spectroscopy (LIBS). LIBS can be used to obtain information about the density and chemical composition of silver particles or copper particles, even ultrafine particles. Metal particles have been attracting much attention because of their increased use in new micro-nano technologies. In this work, LIBS was used as a fine metal particle measurement system for nanometallic materials used in printing. Good spectral peak resolutions were obtained when the Ag spectra were recorded at wavelengths of 328.068 nm and 338.289 nm and Cu spectra at 324.754 nm and 327.396 nm.

    DOI

  • Detection of Cesium from Pollucite using Laser-Induced Breakdown Spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    Proceedings of 8th International Conference Mechatronic Systems and Materials, pp.198, Bialystok, Poland    2012

  • Development of The Quartz Resonators with Quasi-Convex Structure

    H. Oigawa, Y. Sakano, J. Ji, T. Ueda

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000087    2012

  • A New Solution of Anisotropic 3D Vertex Etching Simulation for Quartz Crystal

    M. Zhao, H. Oigawa, J. Ji, T. Ueda

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000091    2012

  • Size Optimization for Miniature High Frequency Quartz Resonator using Finite Element Method

    J. Ji, H.Oigawa, M. Zhao, H. Yu, T. Ueda

    The Sixth Asia-Pacific Conference on Transducers and Micro/Nano Technologies (IEEE APCOT 2012), ac12000081    2012

  • Ringing reduction for radially restored images

    Yupeng Zhang, Toshitsugu Ueda

    Proceedings of Applied Industrial Optics: Spectroscopy, Imaging and Metrology (AIO) Monterey, JTu5A.24.pdf, California    2012

  • Thermomechanical Reliability Analysis and Optimization for MEMS Packages With AuSn Solder

    Rui Zhang, Hongbin Shi, Toshitsugu Ueda, Jiong Zhang, Yuehong Dai

    2012 INTERNATIONAL CONFERENCE ON QUALITY, RELIABILITY, RISK, MAINTENANCE, AND SAFETY ENGINEERING (ICQR2MSE)     794 - 797  2012

    　View Summary

    Thermal stress formed in the solder of the microelectromechanical systems (MEMS) sensor during the reflow soldering process due to the coefficients of thermal expansion (CTE) mismatch between the different materials. As the package needs to be hermetically sealed to protect the device from outside environmental effects, the local stress concentration would eventually cause cracks in the solder and influence the hermeticity. In this study, we present the thermo-mechanical analysis of the AuSn90 solder with low temperature co-fired ceramic (LTCC) package using Comsol Multiphysics. Thermal residual stress distribution in the solder after the reflow soldering process was simulated. According to the result, the maximum von Mises stress was found and several possible ways for minimizing the stress in the solder and improving the thermo-mechanical reliability were discussed.

    DOI

  • Technology and applications using laser-induced electro-avalanche fluorescence and laser induced incandescence technique

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    Proceedings of China-Japan Joint Symposium on Sensing Technology, , Southeast University, Nanjing, China, April 22-25     14  2012

  • A geometry solution for 3D anisotropic etching simulation

    Meng Zhao, Jing Ji, Toshitsugu Ueda

    Proceedings of China-Japan Joint Symposium on Sensing Technology, Southeast University, Nanjing, China, April 22-25     12  2012

  • Real scene capturing and deblurring for spherical single lens camera

    Yupeng Zhang, Lev G. Zimin, Toshitsugu Ueda

    Proceedings of China-Japan Joint Symposium on Sensing Technology, Southeast University, Nanjing, China, April 22-25     3  2012

  • Optimization of electrode structure for a high-frequency AT-cut quartz resonator using FEM

    Jing Ji, Hiroshi Oigawa, Hsin Hui Chen, Meng Zhao, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   132 ( 9 ) 275 - 281  2012

    　View Summary

    For the first time a peripheral electrode is employed to a high-frequency quartz plate resonator that has a rectangular excitation electrode. The two-dimensional finite element method is used to optimize the electrode and verify resonator performance. The results show that optimized electrodes provide effective energy trapping and less vibration coupling. The optimized peripheral electrode efficiently suppresses inharmonic overtone mode. High Q-factor is also achieved. © 2012 The Institute of Electrical Engineers of Japan.

    DOI

  • Development of Semi-Quantitative Analytical System for Metal Nanoparticle Ink using Laser-induced Breakdown Spectroscopy

    Ikezawa, M. Wakamatsu, T. Ueda

    International Journal on Smart Sensing and Intelligent Systems   Vol. 5 ( No. 1 ) 213 - 232  2012

  • Analysis of Radially Restored Images for Spherical Single Lens Cellphone Camera

    Yupeng Zhang, Ikumi Minema, Lev G. Zimin, Toshitsugu Ueda

    IEEE SENSORS JOURNAL   11 ( 11 ) 2834 - 2844  2011.11

    　View Summary

    A spherical single lens imaging system for cellphone camera is proposed in this research. The overall thickness from the front surface of the lens to the image sensor is approximately 4.5 mm, which is competitive compared to 6 similar to 7 mm of current cellphone camera modules that use compound lens system. One defect of this spherical single lens that deteriorates image quality is radially variant blur, which is produced by one of the optical aberrations called field curvature. We describe a novel method of blur restoration that employs polar image and polar Point Spread Function (PSF) converted from Cartesian image and Cartesian PSF. The blurred image was radially segmented into several regions, to which polar PSFs at different field angles were applied. Results of visual and quantitative evaluation indicate that number of segmented regions and weighted average of beta/n ratios, i.e., ratio of bandwidth to the number Circulant Blocks (CBs) of the polar PSF Block-Toeplitz-with-Circulant-Blocks (BTCB) matrices affect the restored image quality and Mean Square Error (MSE). Evaluation results on restored images using different polar image resolutions revealed that high resolution obtains good pixel continuity, whereas low resolution results in radially expanding pixel vacancies.

    DOI

  • Analysis of Radially Restored Images for Spherical Single Lens Cellphone Camera

    Yupeng Zhang, Ikumi Minema, Lev G. Zimin, Toshitsugu Ueda

    IEEE SENSORS JOURNAL   11 ( 11 ) 2834 - 2844  2011.11

    　View Summary

    A spherical single lens imaging system for cellphone camera is proposed in this research. The overall thickness from the front surface of the lens to the image sensor is approximately 4.5 mm, which is competitive compared to 6 similar to 7 mm of current cellphone camera modules that use compound lens system. One defect of this spherical single lens that deteriorates image quality is radially variant blur, which is produced by one of the optical aberrations called field curvature. We describe a novel method of blur restoration that employs polar image and polar Point Spread Function (PSF) converted from Cartesian image and Cartesian PSF. The blurred image was radially segmented into several regions, to which polar PSFs at different field angles were applied. Results of visual and quantitative evaluation indicate that number of segmented regions and weighted average of beta/n ratios, i.e., ratio of bandwidth to the number Circulant Blocks (CBs) of the polar PSF Block-Toeplitz-with-Circulant-Blocks (BTCB) matrices affect the restored image quality and Mean Square Error (MSE). Evaluation results on restored images using different polar image resolutions revealed that high resolution obtains good pixel continuity, whereas low resolution results in radially expanding pixel vacancies.

    DOI

  • Analysis of Radially Restored Images for Spherical Single Lens Cellphone Camera

    Yupeng Zhang, Ikumi Minema, Lev G. Zimin, Toshitsugu Ueda

    IEEE SENSORS JOURNAL   11 ( 11 ) 2834 - 2844  2011.11

    　View Summary

    A spherical single lens imaging system for cellphone camera is proposed in this research. The overall thickness from the front surface of the lens to the image sensor is approximately 4.5 mm, which is competitive compared to 6 similar to 7 mm of current cellphone camera modules that use compound lens system. One defect of this spherical single lens that deteriorates image quality is radially variant blur, which is produced by one of the optical aberrations called field curvature. We describe a novel method of blur restoration that employs polar image and polar Point Spread Function (PSF) converted from Cartesian image and Cartesian PSF. The blurred image was radially segmented into several regions, to which polar PSFs at different field angles were applied. Results of visual and quantitative evaluation indicate that number of segmented regions and weighted average of beta/n ratios, i.e., ratio of bandwidth to the number Circulant Blocks (CBs) of the polar PSF Block-Toeplitz-with-Circulant-Blocks (BTCB) matrices affect the restored image quality and Mean Square Error (MSE). Evaluation results on restored images using different polar image resolutions revealed that high resolution obtains good pixel continuity, whereas low resolution results in radially expanding pixel vacancies.

    DOI

  • U-Band Wavelength References Based on Photonic Bandgap Fiber Technology

    Xuefeng Li, Jinxing Liang, Yury Zimin, Yupeng Zhang, Shuo Lin, Toshitsugu Ueda

    JOURNAL OF LIGHTWAVE TECHNOLOGY   29 ( 19 ) 2934 - 2939  2011.10

    　View Summary

    In this paper, we surveyed potential wavelength references in U-band wavelength region. The hollow-core photonic bandgap fiber (PBGF) filled with methane (CH(4)) gas is used as a gas cell. The experimental results clearly indicate that the weak absorption lines of methane can be used as U-band wavelength division multiplexing (WDM) channel references due to the long interaction path length provided by PBGF. The absorption lines of CH(4) are useful as wavelength references in the 1625-1700 nm region. In addition, we have measured the pressure broadening and the wavelength stability of absorption lines, and find that absorption lines are particularly insensitive to external perturbation. This technique is useful for wavelength calibration of components of communication system, or as monitor the wavelength of the channels. It may be implemented in next-generation WDM communication systems.

    DOI

  • U-Band Wavelength References Based on Photonic Bandgap Fiber Technology

    Xuefeng Li, Jinxing Liang, Yury Zimin, Yupeng Zhang, Shuo Lin, Toshitsugu Ueda

    JOURNAL OF LIGHTWAVE TECHNOLOGY   29 ( 19 ) 2934 - 2939  2011.10

    　View Summary

    In this paper, we surveyed potential wavelength references in U-band wavelength region. The hollow-core photonic bandgap fiber (PBGF) filled with methane (CH(4)) gas is used as a gas cell. The experimental results clearly indicate that the weak absorption lines of methane can be used as U-band wavelength division multiplexing (WDM) channel references due to the long interaction path length provided by PBGF. The absorption lines of CH(4) are useful as wavelength references in the 1625-1700 nm region. In addition, we have measured the pressure broadening and the wavelength stability of absorption lines, and find that absorption lines are particularly insensitive to external perturbation. This technique is useful for wavelength calibration of components of communication system, or as monitor the wavelength of the channels. It may be implemented in next-generation WDM communication systems.

    DOI

  • U-Band Wavelength References Based on Photonic Bandgap Fiber Technology

    Xuefeng Li, Jinxing Liang, Yury Zimin, Yupeng Zhang, Shuo Lin, Toshitsugu Ueda

    JOURNAL OF LIGHTWAVE TECHNOLOGY   29 ( 19 ) 2934 - 2939  2011.10

    　View Summary

    In this paper, we surveyed potential wavelength references in U-band wavelength region. The hollow-core photonic bandgap fiber (PBGF) filled with methane (CH(4)) gas is used as a gas cell. The experimental results clearly indicate that the weak absorption lines of methane can be used as U-band wavelength division multiplexing (WDM) channel references due to the long interaction path length provided by PBGF. The absorption lines of CH(4) are useful as wavelength references in the 1625-1700 nm region. In addition, we have measured the pressure broadening and the wavelength stability of absorption lines, and find that absorption lines are particularly insensitive to external perturbation. This technique is useful for wavelength calibration of components of communication system, or as monitor the wavelength of the channels. It may be implemented in next-generation WDM communication systems.

    DOI

  • Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending

    Hongbin Shi, Faxing Che, Toshitsugu Ueda

    Microelectronics Reliability   51 ( 9-11 ) 1850 - 1855  2011.09

    　View Summary

    This paper presents the four-point bend test results for edge and corner bonded 0.5 mm pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package (PoP) bottom packages on a standard IPC/JEDEC bend test board. The tests were carried out based on the above standard with a 30 mm loading span, 90 mm support span and 7.5 mm/s crosshead speed. The daisy chain resistance, strain, crosshead displacement and load of each PSvfBGA were measured and a 20% increase in the resistance was used as the failure criterion. Materials used in this study were a UV-cured acrylic edge bond adhesive, a thermal-cured epoxy edge bond adhesive and a thermal-cured epoxy corner bond adhesive. The test results show that all of them can improve the bend performance significantly
    especially the edge bond high module epoxy increased the crosshead displacement, strain and bending force when mechanical damage occurred by 33.46%, 26.74% and 3.05% respectively. Failure analysis indicated that the predominant failure site was PCB pad lift/cratering regardless of with or without adhesives. The 3D quarter finite element model was also built to further study the improvement mechanism of bend performance by these adhesives. © 2011 Elsevier Ltd. All rights reserved.

    DOI

  • Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test

    Hongbin Shi, Toshitsugu Ueda

    MICROELECTRONICS RELIABILITY   51 ( 9-11 ) 1898 - 1902  2011.09

    　View Summary

    This paper discusses the influences of various adhesives on board-level shear strength of ChipArray (R) Thin Core Ball Grid Array (CTBGA) assemblies through an innovative reliability evaluation approach, i.e. array-based package (ABP) shear test. It is found that the adhesives do enhance the shear strength for all the test categories as compared with the assemblies without adhesives (w/o A), but the degree of improvements between different strategies vary quiet a lot. The specific shear strength is affected by a number of factors, in which dispending patterns and material properties of the adhesives used influences it obviously. In general, the adhesives with high storage modulus and large dispensing volume are preferred, for example, stiff full or partial capillary flow underfills. In order to further understand the failure mechanism of the CTBGA during the ABP shear test, failure analysis on tested devices are also conducted using side view optical microscopy, scanning electron microscope (SEM) and energy dispersive X-ray (EDX), the results indicate that the predominant failure mode changes from PCB pad lift/cratering to fracture at package side intermetallic compound (IMC)/solder interface with increasing dispensing volume and storage modulus, which basically improves the solder joint reliability of CTBGA assemblies. (C) 2011 Elsevier Ltd. All rights reserved.

    DOI

  • Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending

    Hongbin Shi, Faxing Che, Toshitsugu Ueda

    MICROELECTRONICS RELIABILITY   51 ( 9-11 ) 1850 - 1855  2011.09

    　View Summary

    This paper presents the four-point bend test results for edge and corner bonded 0.5 mm pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package (PoP) bottom packages on a standard IPC/JEDEC bend test board. The tests were carried out based on the above standard with a 30 mm loading span, 90 mm support span and 7.5 mm/s crosshead speed. The daisy chain resistance, strain, crosshead displacement and load of each PSvfBGA were measured and a 20% increase in the resistance was used as the failure criterion. Materials used in this study were a UV-cured acrylic edge bond adhesive, a thermal-cured epoxy edge bond adhesive and a thermal-cured epoxy corner bond adhesive. The test results show that all of them can improve the bend performance significantly: especially the edge bond high module epoxy increased the crosshead displacement, strain and bending force when mechanical damage occurred by 33.46%, 26.74% and 3.05% respectively. Failure analysis indicated that the predominant failure site was PCB pad lift/cratering regardless of with or without adhesives. The 3D quarter finite element model was also built to further study the improvement mechanism of bend performance by these adhesives. (C) 2011 Elsevier Ltd. All rights reserved.

    DOI

  • Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test

    Hongbin Shi, Toshitsugu Ueda

    Microelectronics Reliability   51 ( 9-11 ) 1898 - 1902  2011.09

    　View Summary

    This paper discusses the influences of various adhesives on board-level shear strength of ChipArray®
    Thin Core Ball Grid Array (CTBGA) assemblies through an innovative reliability evaluation approach, i.e. array-based package (ABP) shear test. It is found that the adhesives do enhance the shear strength for all the test categories as compared with the assemblies without adhesives (w/o A), but the degree of improvements between different strategies vary quiet a lot. The specific shear strength is affected by a number of factors, in which dispending patterns and material properties of the adhesives used influences it obviously. In general, the adhesives with high storage modulus and large dispensing volume are preferred, for example, stiff full or partial capillary flow underfills. In order to further understand the failure mechanism of the CTBGA during the ABP shear test, failure analysis on tested devices are also conducted using side view optical microscopy, scanning electron microscope (SEM) and energy dispersive X-ray (EDX), the results indicate that the predominant failure mode changes from PCB pad lift/cratering to fracture at package side intermetallic compound (IMC)/solder interface with increasing dispensing volume and storage modulus, which basically improves the solder joint reliability of CTBGA assemblies. © 2011 Elsevier Ltd. All rights reserved.

    DOI

  • Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending

    Hongbin Shi, Faxing Che, Toshitsugu Ueda

    MICROELECTRONICS RELIABILITY   51 ( 9-11 ) 1850 - 1855  2011.09

    　View Summary

    This paper presents the four-point bend test results for edge and corner bonded 0.5 mm pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package (PoP) bottom packages on a standard IPC/JEDEC bend test board. The tests were carried out based on the above standard with a 30 mm loading span, 90 mm support span and 7.5 mm/s crosshead speed. The daisy chain resistance, strain, crosshead displacement and load of each PSvfBGA were measured and a 20% increase in the resistance was used as the failure criterion. Materials used in this study were a UV-cured acrylic edge bond adhesive, a thermal-cured epoxy edge bond adhesive and a thermal-cured epoxy corner bond adhesive. The test results show that all of them can improve the bend performance significantly: especially the edge bond high module epoxy increased the crosshead displacement, strain and bending force when mechanical damage occurred by 33.46%, 26.74% and 3.05% respectively. Failure analysis indicated that the predominant failure site was PCB pad lift/cratering regardless of with or without adhesives. The 3D quarter finite element model was also built to further study the improvement mechanism of bend performance by these adhesives. (C) 2011 Elsevier Ltd. All rights reserved.

    DOI

  • Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending

    Hongbin Shi, Faxing Che, Toshitsugu Ueda

    Microelectronics Reliability   51 ( 9-11 ) 1850 - 1855  2011.09

    　View Summary

    This paper presents the four-point bend test results for edge and corner bonded 0.5 mm pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package (PoP) bottom packages on a standard IPC/JEDEC bend test board. The tests were carried out based on the above standard with a 30 mm loading span, 90 mm support span and 7.5 mm/s crosshead speed. The daisy chain resistance, strain, crosshead displacement and load of each PSvfBGA were measured and a 20% increase in the resistance was used as the failure criterion. Materials used in this study were a UV-cured acrylic edge bond adhesive, a thermal-cured epoxy edge bond adhesive and a thermal-cured epoxy corner bond adhesive. The test results show that all of them can improve the bend performance significantly
    especially the edge bond high module epoxy increased the crosshead displacement, strain and bending force when mechanical damage occurred by 33.46%, 26.74% and 3.05% respectively. Failure analysis indicated that the predominant failure site was PCB pad lift/cratering regardless of with or without adhesives. The 3D quarter finite element model was also built to further study the improvement mechanism of bend performance by these adhesives. © 2011 Elsevier Ltd. All rights reserved.

    DOI

  • Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test

    Hongbin Shi, Toshitsugu Ueda

    MICROELECTRONICS RELIABILITY   51 ( 9-11 ) 1898 - 1902  2011.09

    　View Summary

    This paper discusses the influences of various adhesives on board-level shear strength of ChipArray (R) Thin Core Ball Grid Array (CTBGA) assemblies through an innovative reliability evaluation approach, i.e. array-based package (ABP) shear test. It is found that the adhesives do enhance the shear strength for all the test categories as compared with the assemblies without adhesives (w/o A), but the degree of improvements between different strategies vary quiet a lot. The specific shear strength is affected by a number of factors, in which dispending patterns and material properties of the adhesives used influences it obviously. In general, the adhesives with high storage modulus and large dispensing volume are preferred, for example, stiff full or partial capillary flow underfills. In order to further understand the failure mechanism of the CTBGA during the ABP shear test, failure analysis on tested devices are also conducted using side view optical microscopy, scanning electron microscope (SEM) and energy dispersive X-ray (EDX), the results indicate that the predominant failure mode changes from PCB pad lift/cratering to fracture at package side intermetallic compound (IMC)/solder interface with increasing dispensing volume and storage modulus, which basically improves the solder joint reliability of CTBGA assemblies. (C) 2011 Elsevier Ltd. All rights reserved.

    DOI

  • Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending

    Hongbin Shi, Faxing Che, Toshitsugu Ueda

    MICROELECTRONICS RELIABILITY   51 ( 9-11 ) 1850 - 1855  2011.09

    　View Summary

    This paper presents the four-point bend test results for edge and corner bonded 0.5 mm pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package (PoP) bottom packages on a standard IPC/JEDEC bend test board. The tests were carried out based on the above standard with a 30 mm loading span, 90 mm support span and 7.5 mm/s crosshead speed. The daisy chain resistance, strain, crosshead displacement and load of each PSvfBGA were measured and a 20% increase in the resistance was used as the failure criterion. Materials used in this study were a UV-cured acrylic edge bond adhesive, a thermal-cured epoxy edge bond adhesive and a thermal-cured epoxy corner bond adhesive. The test results show that all of them can improve the bend performance significantly: especially the edge bond high module epoxy increased the crosshead displacement, strain and bending force when mechanical damage occurred by 33.46%, 26.74% and 3.05% respectively. Failure analysis indicated that the predominant failure site was PCB pad lift/cratering regardless of with or without adhesives. The 3D quarter finite element model was also built to further study the improvement mechanism of bend performance by these adhesives. (C) 2011 Elsevier Ltd. All rights reserved.

    DOI

  • Research on Quartz Resonator Hydrogen Sensor Using Platinum Black

    OIGAWA Hiroshi, KIRINO Yu, YAMAZAKI Daisuke, UEDA Toshitsugu

      2011 ( 1 ) 59 - 62  2011.07

    CiNii

  • Design and Fabrication of Quartz Micro-Electro-Mechanical System-Based Double-Ended Tuning Fork with Variable Sections

    Jinxing Liang, Xuefeng Li, Hongsheng Li, Yunfang Ni, Kunyu Li, Libin Huang, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   50 ( 6 ) 1 - 4  2011.06

    　View Summary

    In this paper, we report a novel double-ended tuning fork (DETF) with variable sections. The DETF is fabricated using a quartz micro-electromechanical system (MEMS) technique and packaged using the flip chip technique. The central part of the vibration beam is thinned to enhance the force-frequency sensitivity but not decrease the vibration frequency. The mechanical quality factor (Q value) can also be maintained, which determines the mechanical noise performance. Three types of DETF are designed and fabricated with a fixed beam length of 4 mm. The vibration characteristics (vibration frequency, Q value, and equivalent circuit parameters) are evaluated using an impedance analyzer 4294A. The finite element method (FEM) is used to simulate the natural frequency and force-frequency sensitivity. For the natural frequencies, the experimental results agreed well with the simulation results. High Q values are achieved for all the DETFs, which are 9924, 7083, and 6335. By multiplying the force-frequency sensitivity (Delta F) by the measured Q values, the performance of the new DETF structure can be improved by 1.9 times. (c) 2011 The Japan Society of Applied Physics

    DOI

  • Doubled Optical Path Length for Photonic Bandgap Fiber Gas Cell Using Micromirror

    Xuefeng Li, Jinxing Liang, Hiroshi Oigawa, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   50 ( 6 ) 1 - 4  2011.06

    　View Summary

    In this paper, we presented the double optical path length of a photonic bandgap fiber (PBGF) gas cell. The gas sensor sensitivity can be improved by a two fold lengthening of the optical length without changing the gas fluid. Furthermore, a high-reflection micromirror was included in the proposed double optical path length gas cell. A Cr/Au sputtering process was applied to fabricate the vertical micromirror using a single-mode fiber (SMF). A measurement system for low gas concentrations based on the micromirror has been implemented, and sensitivity was improved without increasing the response time. (c) 2011 The Japan Society of Applied Physics

    DOI

  • Design and Fabrication of Quartz Micro-Electro-Mechanical System-Based Double-Ended Tuning Fork with Variable Sections

    Jinxing Liang, Xuefeng Li, Hongsheng Li, Yunfang Ni, Kunyu Li, Libin Huang, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   50 ( 6 ) 1 - 4  2011.06

    　View Summary

    In this paper, we report a novel double-ended tuning fork (DETF) with variable sections. The DETF is fabricated using a quartz micro-electromechanical system (MEMS) technique and packaged using the flip chip technique. The central part of the vibration beam is thinned to enhance the force-frequency sensitivity but not decrease the vibration frequency. The mechanical quality factor (Q value) can also be maintained, which determines the mechanical noise performance. Three types of DETF are designed and fabricated with a fixed beam length of 4 mm. The vibration characteristics (vibration frequency, Q value, and equivalent circuit parameters) are evaluated using an impedance analyzer 4294A. The finite element method (FEM) is used to simulate the natural frequency and force-frequency sensitivity. For the natural frequencies, the experimental results agreed well with the simulation results. High Q values are achieved for all the DETFs, which are 9924, 7083, and 6335. By multiplying the force-frequency sensitivity (Delta F) by the measured Q values, the performance of the new DETF structure can be improved by 1.9 times. (c) 2011 The Japan Society of Applied Physics

    DOI

  • Doubled Optical Path Length for Photonic Bandgap Fiber Gas Cell Using Micromirror

    Xuefeng Li, Jinxing Liang, Hiroshi Oigawa, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   50 ( 6 ) 1 - 4  2011.06

    　View Summary

    In this paper, we presented the double optical path length of a photonic bandgap fiber (PBGF) gas cell. The gas sensor sensitivity can be improved by a two fold lengthening of the optical length without changing the gas fluid. Furthermore, a high-reflection micromirror was included in the proposed double optical path length gas cell. A Cr/Au sputtering process was applied to fabricate the vertical micromirror using a single-mode fiber (SMF). A measurement system for low gas concentrations based on the micromirror has been implemented, and sensitivity was improved without increasing the response time. (c) 2011 The Japan Society of Applied Physics

    DOI

  • Doubled Optical Path Length for Photonic Bandgap Fiber Gas Cell Using Micromirror

    Xuefeng Li, Jinxing Liang, Hiroshi Oigawa, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   50 ( 6 )  2011.06

    　View Summary

    In this paper, we presented the double optical path length of a photonic bandgap fiber (PBGF) gas cell. The gas sensor sensitivity can be improved by a two fold lengthening of the optical length without changing the gas fluid. Furthermore, a high-reflection micromirror was included in the proposed double optical path length gas cell. A Cr/Au sputtering process was applied to fabricate the vertical micromirror using a single-mode fiber (SMF). A measurement system for low gas concentrations based on the micromirror has been implemented, and sensitivity was improved without increasing the response time. (c) 2011 The Japan Society of Applied Physics

    DOI

  • Design and Fabrication of Quartz Micro-Electro-Mechanical System-Based Double-Ended Tuning Fork with Variable Sections

    Jinxing Liang, Xuefeng Li, Hongsheng Li, Yunfang Ni, Kunyu Li, Libin Huang, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   50 ( 6 ) 1 - 4  2011.06

    　View Summary

    In this paper, we report a novel double-ended tuning fork (DETF) with variable sections. The DETF is fabricated using a quartz micro-electromechanical system (MEMS) technique and packaged using the flip chip technique. The central part of the vibration beam is thinned to enhance the force-frequency sensitivity but not decrease the vibration frequency. The mechanical quality factor (Q value) can also be maintained, which determines the mechanical noise performance. Three types of DETF are designed and fabricated with a fixed beam length of 4 mm. The vibration characteristics (vibration frequency, Q value, and equivalent circuit parameters) are evaluated using an impedance analyzer 4294A. The finite element method (FEM) is used to simulate the natural frequency and force-frequency sensitivity. For the natural frequencies, the experimental results agreed well with the simulation results. High Q values are achieved for all the DETFs, which are 9924, 7083, and 6335. By multiplying the force-frequency sensitivity (Delta F) by the measured Q values, the performance of the new DETF structure can be improved by 1.9 times. (c) 2011 The Japan Society of Applied Physics

    DOI

  • Doubled Optical Path Length for Photonic Bandgap Fiber Gas Cell Using Micromirror

    Xuefeng Li, Jinxing Liang, Hiroshi Oigawa, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   50 ( 6 ) 1 - 4  2011.06

    　View Summary

    In this paper, we presented the double optical path length of a photonic bandgap fiber (PBGF) gas cell. The gas sensor sensitivity can be improved by a two fold lengthening of the optical length without changing the gas fluid. Furthermore, a high-reflection micromirror was included in the proposed double optical path length gas cell. A Cr/Au sputtering process was applied to fabricate the vertical micromirror using a single-mode fiber (SMF). A measurement system for low gas concentrations based on the micromirror has been implemented, and sensitivity was improved without increasing the response time. (c) 2011 The Japan Society of Applied Physics

    DOI

  • Effects of Reworkable Edge and Corner Bond Adhesives on the Thermal Fatigue Performance of Lead-Free Chip Scale Package Assemblies

    Hongbin Shi, Toshitsugu Ueda

    Proceedings of 13th International Conference on. Electronics Materials and Packaging, pp. EMAP2011-20 (1-10)    2011

  • Investigation on the optimum sampling rate of strain measurement during printed circuit board (PCB) system assembly

    Hong-Bin Shi, Toshitsugu Ueda

    2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011     579 - 584  2011

    　View Summary

    This paper discusses the Min. sampling rate of strain measurement during the system assembly process. The test boards including the server, desktop computer and laptop boards with different board thickness. A 1% variation in the diagonal strain and principle strain are used as the threshold for determining the Min. sampling rate. The test results show that the absolute values of diagonal strain and principle strain reduce with the decreasing sampling rate, this trend is really apparent when the sampling rates is lower than 100Hz. In addition, the principle strain metric is more conservative than diagonal strain metric. Min. sampling rates for strain gages at different locations of boards vary widely, this is due to they have different strain rate, i.e. change in strain divided by the time interval during which this change is measured. The higher strain rate of the strain gage, the larger Min. sampling rate should be chosen. The Min. sampling rate of the server, desktop computer and laptop boards is 250 Hz, 667 Hz and 200 Hz respective. If the strain measurement equipment doesn't have the selfsame option, a higher sampling rate should be chosen. © 2011 IEEE.

    DOI

  • Mitigation of Thermal Fatigue Failure in Fully Underfilled Lead-free Array-based Package Assemblies Using Partial Underfills

    Hongbin Shi, Toshitsugu Ueda

    Proceedings of the 13th Electronics Packaging Technology Conference     542 - 547  2011

    DOI

  • Quartz resonator hydrogen sensor using platinum black

    Hiroshi Oigawa, Yu Kirino, Daisuke Yamazaki, Toshitsugu Ueda

    Proceedings of the International Conference on Sensing Technology, ICST     561 - 564  2011

    　View Summary

    To achieve accurate detection of hydrogen concentration at the range of under 0.1% to 4% in air, we are developing the quartz resonator hydrogen sensor using platinum catalysts. The platinum electrodes of previous model were fabricated by sputtering. To improve its sensitivity, we focused on the platinum black of which structure has the three-dimensional porous. The electrodes of new model were coated by the platinum black through hydrogen reduction of the hexachloroplatinic acid. From experimental results, it was revealed that the sensitivity of a new model was two times bigger than the previous model. © 2011 IEEE.

    DOI

  • Quantitative Analysis of Silver Nanoparticle Ink using Laser-induced Breakdown Spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    Proceedings of the 2011 Fifth International Conference on Sensing Technology, , November 28     6 - 10  2011

    DOI

  • High Frequency Plano-convex Resonator Fabricated by DRIE

    Hiroshi Oigawa, Rui Qian, Hsin-Hui Chen, Daisuke Yamazaki, Toshitsugu Ueda

    Technical Meeting on Electronic Circuits, Kyoto, Japan     43 - 46  2011

  • A Novel Method for Evaluating Triaxial Strain Gages Used in Printed Circuit Board Assemblies (PCBA) Strain Monitoring

    Hongbin Shi, Satoshi Ikezawa, Toshitsugu Ueda

    2011 IEEE SENSORS     1697 - 1700  2011

    　View Summary

    This paper reports a novel method for evaluating strain gages. In this method, the evaluated gage is attached at a specific location of coupon board, and then deflects 5 known distances by steps by the insertion of shims with different thicknesses. The strain for each bended status is recorded and can be compared against expected variation. If the principle strain values and corresponding angles within the tolerance, the gage passes the test and can be applied in practical strain measurement with increased confidence, otherwise it will be deprived of the qualification to accept. Moreover, this method combines with accredited gages can also be used to find and eliminate many errors due to gage placement, gage attachment, measurement equipment setup, and lead wires. In order to prove the validity of the given method, three types of gages from various suppliers at are evaluated, and the results of test broadly consistent with technical backgrounds of their respective manufacturers.

    DOI

  • Application of a 2-D Anisotropic Etching Simulator on Perforated Etching of Quartz Wafer

    M. Zhao, H. Oigawa, J. Ji, T. Ueda

    2011 IEEE SENSORS     1693 - 1696  2011

    　View Summary

    This paper describes features of a new anisotropic etching simulator and its applications on predicting perforated etching shape of quartz wafer. Specialized flow chart and relative process was designed to deal with etching after perforation. We present here two examples of its application on Z-plate and one example on AT-plate quartz crystal to show its good performance.

    DOI

  • Size Optimization For High Frequency Quartz Resonator Using Finite Element Vibration Analysis

    Jing Ji, Hiroshi Oigawa, Hsin Hui Chen, Meng Zhao, Toshitsugu Ueda

    2011 IEEE SENSORS     1652 - 1655  2011

    　View Summary

    In this study, size optimization for a high frequency AT-cut quartz resonator using finite element vibration analysis is presented. The objective resonator is a high frequency fundamental resonator with one-sided electrodes structure, which has high Q value and low resistance compared to the widely used overtone resonators. The one-sided electrodes structure was designed to obtain effective energy trapping and suppress inharmonic overtone (IO) mode. A convenient 2-D model using rectangular element was established to well reconcile calculation time with accuracy. A frequency mode chart describing the relationship between vibration coupling and size of quart plate was achieved. Vibration coupling and energy trapping effect were examined for different sizes of electrodes. COMSOL MULTIPHYSICS (TM) was adopted as a FEM analysis tool and the simulation results confirmed the effectiveness of this work.

    DOI

  • Sensing System for Quantitative Analysis of Metal Particles Using Laser-induced Breakdown Spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    2011 IEEE SENSORS     1596 - 1599  2011

    　View Summary

    This report describes a real-time sensing system for the detection and analysis of fine metal particles using laser-induced breakdown spectroscopy (LIBS). In conventional particle measurement methods, the scanning mobility particle sizer (SMPS) is widely used to obtain particle size distributions. However, when more details on particles are required, another chemical analysis must be performed separately from the one involving the SMPS. Hence, it is difficult to obtain the size and composition of fine particles in real time by conventional methods. By the proposed LIBS method, it is possible to obtain information on the density of fine particles as well as the chemical components of even ultrafine particles. Metal particles are focused on because the use of metal nanoparticles is expanding with emerging micro- and nanotechnologies. This work describes the use of the LIBS system as a fine metal particle monitoring system in a fabrication process using nanometal materials.

    DOI

  • A reliability of silicon-crystalline quartz bonding through reducing of the residual stresses

    Yury Zimin, Toshitsugu Ueda

    2011 IEEE SENSORS     951 - 953  2011

    　View Summary

    In this work, a new additional opportunity to reduce the residual stresses when bonding a pair of dissimilar materials such as silicon and crystalline quartz has been revealed as a result of theoretical calculations. In parallel with a traditional method, based on lowering of dissimilar materials of the pair. In the case of coupled plates, with different coefficients of thermal expansion, the residual stresses can be reduced if the following two conditions hold simultaneously: E-1/(1-v(1))&lt;E-2/(1-v(2)) and h(1)&lt;h(2). Here E-1- the Young's modulus, v(1)- the Poisson ratio, and h(1)- the thickness of the first (i=1) and the second (i=2) bonded plates respectively. For the quartz/silicon pair, the residual stresses at the interface will be approximately 20% lower if h(1)/h(2) = 0.2 as compared the case when both wafers are of equal in thickness.

    DOI

  • Ultra-small imaging system for cell phone camera using birefringent lenses

    Yupeng Zhang, Toshitsugu Ueda

    2011 IEEE SENSORS     691 - 694  2011

    　View Summary

    In this research, an ultra-small imaging system using birefringent lenses was presented. This system is designed for the next generation mobile phone camera with an image sensor of smaller pixel size. The system thickness is reduced to approximately 1.7mm (from the first lens' front surface to the image sensor) by employing one aspheric lens and one spherical lens made of birefringent uniaxial crystal, which also act as two optical low pass filters (OLPFs). In conventional cameras, however, the OLPFs are stacked up and assembled separately with optical lenses, which makes it difficult to reduce system thickness. Quantitative and visual results of ordinary and extra-ordinary ray separation on the image plane demonstrated that the birefringent lenses system is able to cut off all higher spatial frequencies than the Nyquist frequency of a 0.5 mu m x 0.5 mu m image sensor.

    DOI

  • Alkanes Near-Infrared Spectrum Analysis Based on Hollow-Core Photonic Bandgap Fiber (口頭発表）

    Xuefeng Li, S. Lin, Yury Zimin, Yupeng Zhang, Toshitsugu Ueda, Jinxing Liang

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND    2011

  • Vibration Analysis of Original Shape Quartz Resonator for High Q Realization (ポスター発表）

    H. Oigawa, Y. Kirino, H. Chen, J. Ji, T. Ueda

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan    2011

  • Optimal Size Determination of Electrodes for High Frequency Fundamental AT-cut Quartz Resonator using 3-D FEM (ポスター発表）

    J. Ji, H. Ohigawa, H. Chen, M. Zhao, T. Ueda

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan    2011

  • High Sensitivity Fiber-optic Fabry-perot Interferometer Temperature Sensor (ポスター発表）

    X. Li, S. Lin, J. Liang, H. Oigawa, T. Ueda

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan    2011

  • Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test (ポスター発表）

    Hongbin Shi, Toshitsugu Ueda

    22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France    2011

    DOI

  • Board-level Solder Joint Reliability of Edge and Corner Bonded Lead-free Chip Scale Package Assemblies Subjected to Thermal Cycling (ポスター発表）

    Hongbin Shi, Toshitsugu Ueda

    2011 International Conference on Solid State Devices and Materials, Nagoya, Japan    2011

    DOI

  • Thermomechanical Fatigue Performance of Lead-free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills (口頭発表）

    Hongbin Shi, Toshitsugu Ueda

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan    2011

  • Analysis of Edge and Corner Bonded PoP Bottom Package Reliability under Temperature Cycling Conditions by Experimental and Finite Element Methods (ポスター発表）

    Hongbin Shi, Faxing Che, Shan Gao, Toshitsugu Ueda

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan    2011

  • Heat and Ultraviolet Dual-curable Edge Bonding Materials for Ball Grid Array Packages and the Impact on Solder Joint Reliability (ポスター発表）

    Hongbin Shi, Toshitsugu Ueda

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan    2011

  • Drop Impact Reliability Improvement of Lead-free Array-based Package Assemblies with Different Board-level Underfills and Adhesives (ポスター発表）

    Hongbin Shi, Toshitsugu Ueda

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan    2011

  • Experimental and Computational Characterization of Board-level Shear Behavior of PSvfBGA Assemblies with Edge and Corner Adhesives (ポスター発表）

    Hongbin Shi, Faxing Che, Toshitsugu Ueda

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan    2011

  • Halogen-free and Reworkable Corner Bond Adhesive for Array-based Packages and the Impact on Board-level Solder Joint Reliability

    Hongbin Shi, Toshitsugu Ueda

    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP)     108 - 113  2011

    　View Summary

    Capillary flow and no-flow underfill were demonstrated to yield dramatic reliability improvement in the mechanical shock and torsion of most array-base package (ABP) assemblies in portable electronic devices. However, it is very difficult to rework the defective ABPs after the underfill operation. Unfortunately, reworkability of the packages with underfill is needed for printed circuit board assemblies (PCBAs) with ABPs failing either during final test or in the field. Corner bond adhesive (CBA) applying an adhesive only near the corner of an ABP and curing. This adhesive forms a mechanical bridge between the ABP and the PCB, since much less adhesive is used compared to underfill, the area of adhesive in contact with the board and the package is smaller. This should aid in the ability to develop systems that are reworkable without damaging the PCB. In addition, with the improving of life quality and increasing of environmental protection thought, people's demand for environmentally friendly halogen-free products has become more and more pressing. This investigation provides initial results of an ongoing study aimed at thermo-mechanical reliability of the ABP assemblies with halogen-free and reworkable CBA in portable electronic devices. One halogen-free and reworkable CBA was evaluated in order to get the detail reliability performance for ABP assemblies. Material properties such as coefficient of thermal expansion (CTE), glass transition temperature (Tg), modulus, apparent strengths of adhesion (ASA), etc were obtained. Shear, bend, drop and thermal cycling tests have been conducted with this material. A comparative study of the performance of ABPs with one halogen reworkable CBA materials and no-bonded materials are reported. Results of the above tests shows that the halogen-free CBA has the equivalent or even better performance compared with the halogen CBA.

    DOI

  • Investigation of Various Board-level Underfills and Adhesives for CTBGA Bend Performance Enhancements in Lead-free Portable Electronic Products

    Hongbin Shi, Toshitsugu Ueda

    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP)     91 - 96  2011

    　View Summary

    This paper discusses the influences of various underfills and adhesives on board-level bend performance of ChipArray(R) Thin Core Ball Grid Array (CTBGA) assemblies through an the monotonic three-point bending test. It is found that the bonding materials do enhance the bend performance for all the test categories as compared with the control assemblies which are without bonding materials, but the degrees of improvements between different strategies vary quiet a lot. The specific bend strength is affected by a number of factors, in which dispending patterns and properties of the bonding materials used influence it obviously. In general, the partial capillary flow underfill and edge bond adhesive with relatively lower storage modulus and higher apparent strengths of adhesion (ASA) are preferred. In order to further understand the failure mechanism of the CTBGA during the bending test, failure analysis on tested devices are also conducted using dye-and-pry and cross-section, the results indicate that the dominant failure mode is PCB pad cratering, regardless with or without bonding materials.

    DOI

  • Thermal Cycling Reliability of Lead-free Package Stackable Very Thin Fine Pitch Ball Grid Array Assemblies with Reworkable Edge and Corner Bond Adhesives (ポスター発表）

    Hongbin Shi, Toshitsugu Ueda

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China    2011

    DOI

  • Use of a new anisotropic etching simulator on quartz crystal

    M. Zhao, H. Oigawa, J. Wang, J. Ji, T. Ueda

    2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11     450 - 453  2011

    　View Summary

    This paper describes features of a new anisotropic etching simulator and its applications on predicting etching shape of quartz crystal. The simulator is suitable to predict etching profiles of two-dimensional initial shape which has a profile formed by straight lines. In this simulator, a program flow with uneven time step was used to furthest reduced the probability of improper shape prediction. We present here two examples of its application on both Z-plate and AT-plate quartz crystal to show its good performance. © 2011 IEEE.

    DOI

  • On-Wafer-Packaging of Crystal Quartz Based Devises Using Low-Temperature Anodic Bonding（ (口頭発表＋ポスター発表）

    Yury ZIMIN Toshitsugu UEDA

    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2011) Aix-en-Provence, France    2011

  • Effects of Edge and Corner bond Adhesives on Board-level Shear Strength of Lead-free Package-on-Package Devices (口頭発表）

    Hongbin Shi, Toshitsugu Ueda

    2011 International Conference on Electronics Packaging, Nara, Japan    2011

  • Studies on the Bend Performance of Package Stackable Very Thin Fine Pitch Ball Grid Array Assemblies with Edge and Corner Bond Adhesives (oral)

    SHI Hongbin, UEDA Toshitsugu

    2011 International Conference on Solid-State and Integrated Circuit    2011

    DOI

  • Effects of Edge and Corner Bond Adhesives on the Drop Reliability of Package-on-Package Bottom Package Assemblies (oral)

    SHI Hongbin, UEDA Toshitsugu

    2011 International Conference on Solid-State and Integrated Circuit    2011

    DOI

  • A Real Double-convex Spherical Single Lens System with Blur Restoration Feature (oral)

    Yupeng Zhang, Ikumi Ninema, Toshitsugu Ueda

    2011 International Conference on Communication and Electronics Information, Haikou, China    2011

  • Saturated Absorption Spectroscopy of Hydrocarbons Based on Photonic Bandgap Fiber (oral)

    Xuefeng Li, Jinxing Liang, Yupeng Zhang, Toshitsugu Ueda

    2011 International Conference on Communication and Electronics Information, Haikou, China    2011

  • Bonding of silicon and crystal quartz wafers at the minimized residual stresses

    Yury Zimin, Toshitsugu Ueda, Joanna Pawlat

    PRZEGLAD ELEKTROTECHNICZNY   87 ( 8 ) 239 - 242  2011

    　View Summary

    In this work, strong low-temperature bonding of silicon and crystalline quartz wafers, effecting in mechanical strength, which is close to initial materials has been described. High bonding strength is associated with minimization of the residual stresses, optimization of surface activation, and application of an electric field during annealing. The bonding has a wide application field because both, silicon and crystalline quartz are key materials for many devices including generators, high frequency filters, gyroscopes, microbalances of high stability, etc.

  • Diesel Particulate Analysis Using SEM-EDX and Laser-induced Breakdown Spectroscopy

    S. Ikezawa, M. Wakamatsu, T. Ueda

    International Journal on Smart Sensing and Intelligent Systems   Vol. 4 ( No. 2 ) 174 - 188  2011

  • A two-dimensional anisotropic wet etching simulator for quartz crystal

    Meng Zhao, Jiani Wang, Hiroshi Oigawa, Jing Ji, Hisanori Hayashi, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   131 ( 5 ) 185 - 188  2011

    　View Summary

    We developed an anisotropic wet etching simulator that can predict the etching profile of initial shape, which is two-dimensional and formed by straight lines. New etching rate database of quartz at a special condition was obtained. Improved hull method was used to deal with round corner etching. New programming flow was adopted to avoid improper profile prediction. A friendly graphical user interface was built for user's convenience. The simulation result of this simulator meets well with the experimental results and shows nice accuracy in new emerging faces predicting. © 2011 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Development of carbonaceous particle size analyzer using laser-induced incandescence technology

    Satoshi Ikezawa, Muneaki Wakamatsu, Yury L'vovich Zimin, Joanna Pawlat, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   131 ( 5 ) 171 - 177  2011

    　View Summary

    This paper presents a new sensing system for carbonaceous nanoparticle measurement using a laser-induced incandescence (LII) technique. Our research group has improved the laser-induced breakdown spectroscopy (LIBS) system used for quantitative analysis. Although the basic principles of LIBS quantitative measurements are well understood, several uncertainties remain concerning complete descriptions-especially for particle size measurement. The elemental composition and density of the particles are determined using LIBS, and particle size measurements are accomplished with the help of LII. In the case of the present system, with temporally resolved LII, measurement of soot primary particle sizes is feasible in a combustion process derived from the ratio of emission signals after a laser pulse because the cooling behaviour is characteristic of the particle size. The LII temporal analysis was performed by a streak camera, which was also used for LIBS analysis. The LII technique allows in situ measurement of the average primary particle size of nanoscale soot particles. © 2011 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Deblur of radially variant blurred image for single lens system

    Yupeng Zhang Member, Toshitsugu Ueda

    IEEJ Transactions on Electrical and Electronic Engineering, Special Issue: Special Issue on Electronics, Information and Systems   Vol. 6 ( Issue S1 ) S7 2016-2011  2011

    DOI

  • Development of hydrogen gas sensors using quartz resonator

    Hiroshi Oigawa, Daisuke Yamazaki, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   131 ( 3 ) 3 - 121  2011

    　View Summary

    The hydrogen gas sensor using quartz resonators is developed to measure less than 4% hydrogen concentration in air. This sensor consists of two quartz resonators. Both sides of electrodes of the sensor resonator are made by platinum thin film. And the reference resonator has Au electrodes. By using this reference resonator, the influence of the temperature and pressure will be canceled. This sensor can measure hydrogen concentration from reaction heat on the platinum catalyst. From experimental results, the frequency of sensor changed linearly in 0% to 5% hydrogen concentrations mixed with the air. The sensor showed 20ppm frequency translation per 1%, and the time constant is about 20 seconds. © 2011 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • イメージファイバーを用いた根管内観察システムの開発 (口頭発表）

    李 慧頴, 張 宇鵬, 吉居 慎二, 李 雪峰, 植田 敏嗣

    第64回 電気関係学会九州支部連合大会, 佐賀大学    2011

  • 二軸傾斜センサシステムの開発-ステップ１ (口頭発表）

    章磊, 津野徹, 植田敏嗣

    第64回 電気関係学会九州支部連合大会, 佐賀大学    2011

  • 2 軸静電容量型傾斜角センサの開発と評価 (口頭発表）

    劉 健男, 播磨 幸一, 高森 政聡, 植田 敏嗣

    第64回 電気関係学会九州支部連合大会, 佐賀大学    2011

  • MEMS 精密実装におけるフラックスレスリフローのプロセスの改善 (口頭発表）

    程 サンサン, 高森 政聡, 植田 敏嗣

    第64回 電気関係学会九州支部連合大会, 佐賀大学    2011

  • MEMS 技術を利用したPlano-convex 形状水晶振動子の開発 (口頭発表）

    銭 鋭, 大井川 寛, 山崎 大輔, 植田 敏嗣

    第64回 電気関係学会九州支部連合大会, 佐賀大学    2011

  • High-Q を実現するための新たな形状の水晶振動子の研究 (口頭発表）

    桐野 雄宇, 大井川 寛, 陳 欣匯, 植田 敏嗣

    第64回 電気関係学会九州支部連合大会, 佐賀大学    2011

  • LTCCコイルを用いた渦電流変位センサの開発 (口頭発表）

    斎藤達也, 津野 徹, 植田敏嗣

    第64回 電気関係学会九州支部連合大会, 佐賀大学    2011

  • アルゴンガス雰囲気におけるレーザー誘起ブレークダウン分光分析 (口頭発表）

    池沢 聡, 若松 宗明, 植田 敏嗣

    レーザー学会第148回研究会報告，レーザー応用, Kumamoto, Japan    2011

  • 高感度傾斜角センサ作製プロセスの改善とその評価 (口頭)

    劉健男, 李 南浩, 播磨幸一, 高森政聡, 梁金星, 植田敏嗣

    平成23年 電気学会全国大会, 大阪大学    2011

  • リファレンス振動子により安定化したQCM匂いセンサ (口頭)

    陳睿思, 大井川寛, 水谷直貴, 李 丞祐, 植田敏嗣

    平成23年 電気学会全国大会, 大阪大学    2011

  • The 2-D Vibration Analysis of Plano-convex AT-cut Quartz Resonator by FEM (口頭)

    陳欣匯, 紀 靜, 大井川寛, 植田敏嗣

    平成23年 電気学会全国大会, 大阪大学    2011

  • Development of Slower Wet Etching Rates Measurement of α-Quartz (口頭)

    林碩, 大井川寛, 趙萌, 植田敏嗣

    平成23年 電気学会全国大会, 大阪大学    2011

  • Low noise design of the 2-axis tilt sensor (口頭)

    Chunlei Yu, Tooru Tsuno, Toshitsugu Ueda

    平成23年 電気学会全国大会, 大阪大学    2011

  • An Oscillating Circuit development for Hydrogen Gas Sensors using Quartz resonators (口頭)

    Hai Jiang, Hiroshi Oigawa, Tooru Tsuno, Toshitsugu Ueda

    平成23年 電気学会全国大会, 大阪大学    2011

  • Effects of Reworkable Edge and Corner Bond Adhesives on the Thermal Fatigue Performance of Lead-Free Chip Scale Package Assemblies

    Hongbin Shi, Toshitsugu Ueda

    Proceedings of 13th International Conference on. Electronics Materials and Packaging, pp. EMAP2011-20 (1-10)    2011

  • Investigation on the optimum sampling rate of strain measurement during printed circuit board (PCB) system assembly

    Hong-Bin Shi, Toshitsugu Ueda

    2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011     579 - 584  2011

    　View Summary

    This paper discusses the Min. sampling rate of strain measurement during the system assembly process. The test boards including the server, desktop computer and laptop boards with different board thickness. A 1% variation in the diagonal strain and principle strain are used as the threshold for determining the Min. sampling rate. The test results show that the absolute values of diagonal strain and principle strain reduce with the decreasing sampling rate, this trend is really apparent when the sampling rates is lower than 100Hz. In addition, the principle strain metric is more conservative than diagonal strain metric. Min. sampling rates for strain gages at different locations of boards vary widely, this is due to they have different strain rate, i.e. change in strain divided by the time interval during which this change is measured. The higher strain rate of the strain gage, the larger Min. sampling rate should be chosen. The Min. sampling rate of the server, desktop computer and laptop boards is 250 Hz, 667 Hz and 200 Hz respective. If the strain measurement equipment doesn't have the selfsame option, a higher sampling rate should be chosen. © 2011 IEEE.

    DOI

  • Mitigation of thermal fatigue failure in fully underfilled lead-free array-based package assemblies using partial underfills

    Hong-Bin Shi, Toshitsugu Ueda

    2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011     542 - 547  2011

    　View Summary

    A design of experiments was conducted to determine the thermal cycling reliability of full and partial capillary flow underfilled lead-free chip scale packages (CSPs), the tests were carried out based on the JEDEC JESD22-A104C standard. Two kinds of representative fast cure and reworkable underfill materials are used in this study, and CSPs without underfill were also tested for comparison. The test results show that both two underfill materials reduce the thermal cycling reliability of CSP assemblies. The underfill with high glass transition temperature (Tg) and storage modulus yielded better performance, of course, the CTE is also very critical to the thermomechanical fatigue performance, but its effects is not so obvious in this study due to the similar CTE of used underfills. In addition, the negative effect of partial underfill is smaller than that of full underfill. Failure analysis shows that the dominant failure mode observed is solder cracking near package and/or PCB pads. © 2011 IEEE.

    DOI

  • Quartz resonator hydrogen sensor using platinum black

    Hiroshi Oigawa, Yu Kirino, Daisuke Yamazaki, Toshitsugu Ueda

    Proceedings of the International Conference on Sensing Technology, ICST     561 - 564  2011

    　View Summary

    To achieve accurate detection of hydrogen concentration at the range of under 0.1% to 4% in air, we are developing the quartz resonator hydrogen sensor using platinum catalysts. The platinum electrodes of previous model were fabricated by sputtering. To improve its sensitivity, we focused on the platinum black of which structure has the three-dimensional porous. The electrodes of new model were coated by the platinum black through hydrogen reduction of the hexachloroplatinic acid. From experimental results, it was revealed that the sensitivity of a new model was two times bigger than the previous model. © 2011 IEEE.

    DOI

  • Quantitative analysis of silver nanoparticle ink using laser-induced breakdown spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    Proceedings of the International Conference on Sensing Technology, ICST     1 - 5  2011

    　View Summary

    This paper describes the quantitative analysis of silver nanoparticle ink using laser-induced breakdown spectroscopy (LIBS). LIBS can be used to obtain information about the density and chemical composition of silver particles, even ultrafine particles. Metal particles have been attracting much attention because of their increased use in new micro-nano technologies. In this work, LIBS was used as a fine metal particle measurement system for nanometallic materials used in printing. This paper reports new developments for quantitative analysis of silver nano particles. Good spectral peak resolutions were obtained when the spectra were recorded at wavelengths of 328 nm and 338 nm. © 2011 IEEE.

    DOI

  • High Frequency Plano-convex Resonator Fabricated by DRIE

    Hiroshi Oigawa, Rui Qian, Hsin-Hui Chen, Daisuke Yamazaki, Toshitsugu Ueda

    Technical Meeting on Electronic Circuits, Kyoto, Japan     43 - 46  2011

  • A Novel Method for Evaluating Triaxial Strain Gages Used in Printed Circuit Board Assemblies (PCBA) Strain Monitoring

    Hongbin Shi, Satoshi Ikezawa, Toshitsugu Ueda

    2011 IEEE SENSORS     1697 - 1700  2011

    　View Summary

    This paper reports a novel method for evaluating strain gages. In this method, the evaluated gage is attached at a specific location of coupon board, and then deflects 5 known distances by steps by the insertion of shims with different thicknesses. The strain for each bended status is recorded and can be compared against expected variation. If the principle strain values and corresponding angles within the tolerance, the gage passes the test and can be applied in practical strain measurement with increased confidence, otherwise it will be deprived of the qualification to accept. Moreover, this method combines with accredited gages can also be used to find and eliminate many errors due to gage placement, gage attachment, measurement equipment setup, and lead wires. In order to prove the validity of the given method, three types of gages from various suppliers at are evaluated, and the results of test broadly consistent with technical backgrounds of their respective manufacturers.

    DOI

  • Application of a 2-D Anisotropic Etching Simulator on Perforated Etching of Quartz Wafer

    M. Zhao, H. Oigawa, J. Ji, T. Ueda

    2011 IEEE SENSORS     1693 - 1696  2011

    　View Summary

    This paper describes features of a new anisotropic etching simulator and its applications on predicting perforated etching shape of quartz wafer. Specialized flow chart and relative process was designed to deal with etching after perforation. We present here two examples of its application on Z-plate and one example on AT-plate quartz crystal to show its good performance.

    DOI

  • Size Optimization For High Frequency Quartz Resonator Using Finite Element Vibration Analysis

    Jing Ji, Hiroshi Oigawa, Hsin Hui Chen, Meng Zhao, Toshitsugu Ueda

    2011 IEEE SENSORS     1652 - 1655  2011

    　View Summary

    In this study, size optimization for a high frequency AT-cut quartz resonator using finite element vibration analysis is presented. The objective resonator is a high frequency fundamental resonator with one-sided electrodes structure, which has high Q value and low resistance compared to the widely used overtone resonators. The one-sided electrodes structure was designed to obtain effective energy trapping and suppress inharmonic overtone (IO) mode. A convenient 2-D model using rectangular element was established to well reconcile calculation time with accuracy. A frequency mode chart describing the relationship between vibration coupling and size of quart plate was achieved. Vibration coupling and energy trapping effect were examined for different sizes of electrodes. COMSOL MULTIPHYSICS (TM) was adopted as a FEM analysis tool and the simulation results confirmed the effectiveness of this work.

    DOI

  • Sensing System for Quantitative Analysis of Metal Particles Using Laser-induced Breakdown Spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    2011 IEEE SENSORS     1596 - 1599  2011

    　View Summary

    This report describes a real-time sensing system for the detection and analysis of fine metal particles using laser-induced breakdown spectroscopy (LIBS). In conventional particle measurement methods, the scanning mobility particle sizer (SMPS) is widely used to obtain particle size distributions. However, when more details on particles are required, another chemical analysis must be performed separately from the one involving the SMPS. Hence, it is difficult to obtain the size and composition of fine particles in real time by conventional methods. By the proposed LIBS method, it is possible to obtain information on the density of fine particles as well as the chemical components of even ultrafine particles. Metal particles are focused on because the use of metal nanoparticles is expanding with emerging micro- and nanotechnologies. This work describes the use of the LIBS system as a fine metal particle monitoring system in a fabrication process using nanometal materials.

    DOI

  • A reliability of silicon-crystalline quartz bonding through reducing of the residual stresses

    Yury Zimin, Toshitsugu Ueda

    2011 IEEE SENSORS     951 - 953  2011

    　View Summary

    In this work, a new additional opportunity to reduce the residual stresses when bonding a pair of dissimilar materials such as silicon and crystalline quartz has been revealed as a result of theoretical calculations. In parallel with a traditional method, based on lowering of dissimilar materials of the pair. In the case of coupled plates, with different coefficients of thermal expansion, the residual stresses can be reduced if the following two conditions hold simultaneously: E-1/(1-v(1))&lt;E-2/(1-v(2)) and h(1)&lt;h(2). Here E-1- the Young's modulus, v(1)- the Poisson ratio, and h(1)- the thickness of the first (i=1) and the second (i=2) bonded plates respectively. For the quartz/silicon pair, the residual stresses at the interface will be approximately 20% lower if h(1)/h(2) = 0.2 as compared the case when both wafers are of equal in thickness.

    DOI

  • Ultra-small imaging system for cell phone camera using birefringent lenses

    Yupeng Zhang, Toshitsugu Ueda

    2011 IEEE SENSORS     691 - 694  2011

    　View Summary

    In this research, an ultra-small imaging system using birefringent lenses was presented. This system is designed for the next generation mobile phone camera with an image sensor of smaller pixel size. The system thickness is reduced to approximately 1.7mm (from the first lens' front surface to the image sensor) by employing one aspheric lens and one spherical lens made of birefringent uniaxial crystal, which also act as two optical low pass filters (OLPFs). In conventional cameras, however, the OLPFs are stacked up and assembled separately with optical lenses, which makes it difficult to reduce system thickness. Quantitative and visual results of ordinary and extra-ordinary ray separation on the image plane demonstrated that the birefringent lenses system is able to cut off all higher spatial frequencies than the Nyquist frequency of a 0.5 mu m x 0.5 mu m image sensor.

    DOI

  • Alkanes Near-Infrared Spectrum Analysis Based on Hollow-Core Photonic Bandgap Fiber (口頭発表）

    Xuefeng Li, S. Lin, Yury Zimin, Yupeng Zhang, Toshitsugu Ueda, Jinxing Liang

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND    2011

  • Vibration Analysis of Original Shape Quartz Resonator for High Q Realization (ポスター発表）

    H. Oigawa, Y. Kirino, H. Chen, J. Ji, T. Ueda

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan    2011

  • Optimal Size Determination of Electrodes for High Frequency Fundamental AT-cut Quartz Resonator using 3-D FEM (ポスター発表）

    J. Ji, H. Ohigawa, H. Chen, M. Zhao, T. Ueda

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan    2011

  • High Sensitivity Fiber-optic Fabry-perot Interferometer Temperature Sensor (ポスター発表）

    X. Li, S. Lin, J. Liang, H. Oigawa, T. Ueda

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan    2011

  • Experimental and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending (口頭発表）

    Hongbin Shi, Faxing Che, Toshitsugu Ueda

    22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France    2011

    DOI

  • Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test (ポスター発表）

    Hongbin Shi, Toshitsugu Ueda

    22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France    2011

    DOI

  • Board-level Solder Joint Reliability of Edge and Corner Bonded Lead-free Chip Scale Package Assemblies Subjected to Thermal Cycling (ポスター発表）

    Hongbin Shi, Toshitsugu Ueda

    2011 International Conference on Solid State Devices and Materials, Nagoya, Japan    2011

    DOI

  • Thermomechanical Fatigue Performance of Lead-free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills (口頭発表）

    Hongbin Shi, Toshitsugu Ueda

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan    2011

  • Analysis of Edge and Corner Bonded PoP Bottom Package Reliability under Temperature Cycling Conditions by Experimental and Finite Element Methods (ポスター発表）

    Hongbin Shi, Faxing Che, Shan Gao, Toshitsugu Ueda

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan    2011

  • Heat and Ultraviolet Dual-curable Edge Bonding Materials for Ball Grid Array Packages and the Impact on Solder Joint Reliability (ポスター発表）

    Hongbin Shi, Toshitsugu Ueda

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan    2011

  • Drop Impact Reliability Improvement of Lead-free Array-based Package Assemblies with Different Board-level Underfills and Adhesives (ポスター発表）

    Hongbin Shi, Toshitsugu Ueda

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan    2011

  • Experimental and Computational Characterization of Board-level Shear Behavior of PSvfBGA Assemblies with Edge and Corner Adhesives (ポスター発表）

    Hongbin Shi, Faxing Che, Toshitsugu Ueda

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan    2011

  • Halogen-free and Reworkable Corner Bond Adhesive for Array-based Packages and the Impact on Board-level Solder Joint Reliability

    Hongbin Shi, Toshitsugu Ueda

    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP)     108 - 113  2011

    　View Summary

    Capillary flow and no-flow underfill were demonstrated to yield dramatic reliability improvement in the mechanical shock and torsion of most array-base package (ABP) assemblies in portable electronic devices. However, it is very difficult to rework the defective ABPs after the underfill operation. Unfortunately, reworkability of the packages with underfill is needed for printed circuit board assemblies (PCBAs) with ABPs failing either during final test or in the field. Corner bond adhesive (CBA) applying an adhesive only near the corner of an ABP and curing. This adhesive forms a mechanical bridge between the ABP and the PCB, since much less adhesive is used compared to underfill, the area of adhesive in contact with the board and the package is smaller. This should aid in the ability to develop systems that are reworkable without damaging the PCB. In addition, with the improving of life quality and increasing of environmental protection thought, people's demand for environmentally friendly halogen-free products has become more and more pressing. This investigation provides initial results of an ongoing study aimed at thermo-mechanical reliability of the ABP assemblies with halogen-free and reworkable CBA in portable electronic devices. One halogen-free and reworkable CBA was evaluated in order to get the detail reliability performance for ABP assemblies. Material properties such as coefficient of thermal expansion (CTE), glass transition temperature (Tg), modulus, apparent strengths of adhesion (ASA), etc were obtained. Shear, bend, drop and thermal cycling tests have been conducted with this material. A comparative study of the performance of ABPs with one halogen reworkable CBA materials and no-bonded materials are reported. Results of the above tests shows that the halogen-free CBA has the equivalent or even better performance compared with the halogen CBA.

    DOI

  • Investigation of Various Board-level Underfills and Adhesives for CTBGA Bend Performance Enhancements in Lead-free Portable Electronic Products

    Hongbin Shi, Toshitsugu Ueda

    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP)     91 - 96  2011

    　View Summary

    This paper discusses the influences of various underfills and adhesives on board-level bend performance of ChipArray(R) Thin Core Ball Grid Array (CTBGA) assemblies through an the monotonic three-point bending test. It is found that the bonding materials do enhance the bend performance for all the test categories as compared with the control assemblies which are without bonding materials, but the degrees of improvements between different strategies vary quiet a lot. The specific bend strength is affected by a number of factors, in which dispending patterns and properties of the bonding materials used influence it obviously. In general, the partial capillary flow underfill and edge bond adhesive with relatively lower storage modulus and higher apparent strengths of adhesion (ASA) are preferred. In order to further understand the failure mechanism of the CTBGA during the bending test, failure analysis on tested devices are also conducted using dye-and-pry and cross-section, the results indicate that the dominant failure mode is PCB pad cratering, regardless with or without bonding materials.

    DOI

  • Thermal Cycling Reliability of Lead-free Package Stackable Very Thin Fine Pitch Ball Grid Array Assemblies with Reworkable Edge and Corner Bond Adhesives

    Hongbin Shi, Toshitsugu Ueda

    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP)     81 - 86  2011

    　View Summary

    This paper presents the thermal cycling test results for edge and corner bonded 0.5 mm pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package (PoP) bottom packages on a quasi-standard JEDEC thermal cycling test board. Thermal cycling tests were carried out based on the JEDEC JESD22-A104C standard, -40 similar to 125 degrees C temperature range with 32 minutes/cycle test condition was applied, and hold times in each extreme temperature were 10 minutes. The daisy chain resistance of each PSvfBGA was measured by an event detector and a 1000 Omega rise (or more) from initial resistance was considered as the failure criterion. Three materials used in this study were a UV-cured acrylic edge bond adhesive, a thermal-cured epoxy edge bond adhesive and a thermal-cured epoxy corner bond adhesive, and PSvfBGAs without bonding were also tested for comparison. Statistics of the number of cycles-to-failure for the 45 components of each test group are reported. The test results show that the characteristic lives of PSvfBGAs with edge bond acrylic, edge bond epoxy and corner bond epoxy are respectively about 0.6, 0.9 and 1.3 times of the PSvfBGAs without bonding. The corner bond epoxy with lowest CTE, highest storage modulus and smallest adhesive volume yielded best performance. Because it can slow down the CTE mismatch and reduce effective action area of interactive forces between the adhesive, BT substrate and PCB during thermal cycling test. So if we want to improve the thermal cycling reliability of PSvfBGA with adhesives, the thermal-mechanical material properties and dispending patterns of adhesives should be thoroughly considered. Failure analysis was performed using dye-and-pry, cross section scanning electron microscope (SEM) and energy dispersive X-ray (EDX) methods. The common failure mode observed is solder cracking near package and/or PCB pads.

    DOI

  • Use of a new anisotropic etching simulator on quartz crystal

    M. Zhao, H. Oigawa, J. Wang, J. Ji, T. Ueda

    2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11     450 - 453  2011

    　View Summary

    This paper describes features of a new anisotropic etching simulator and its applications on predicting etching shape of quartz crystal. The simulator is suitable to predict etching profiles of two-dimensional initial shape which has a profile formed by straight lines. In this simulator, a program flow with uneven time step was used to furthest reduced the probability of improper shape prediction. We present here two examples of its application on both Z-plate and AT-plate quartz crystal to show its good performance. © 2011 IEEE.

    DOI

  • On-Wafer-Packaging of Crystal Quartz Based Devises Using Low-Temperature Anodic Bonding（ (口頭発表＋ポスター発表）

    Yury ZIMIN Toshitsugu UEDA

    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2011) Aix-en-Provence, France    2011

  • Effects of Edge and Corner bond Adhesives on Board-level Shear Strength of Lead-free Package-on-Package Devices (口頭発表）

    Hongbin Shi, Toshitsugu Ueda

    2011 International Conference on Electronics Packaging, Nara, Japan    2011

  • Study on the bend performance of package stackable very thin fine pitch ball grid array assemblies with edge and corner bond adhesives

    Hongbin Shi, Toshitsugu Ueda

    ICCRD2011 - 2011 3rd International Conference on Computer Research and Development   3   421 - 425  2011

    　View Summary

    This paper presents the four-point bend test results for edge and corner bonded 0.5mm pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package (PoP) bottom packages on a standard IPC/JEDEC bend test board. Four-point bend tests were carried out based on the above standard with a 30 mm loading span, 90 mm support span and 7.5 mm/sec crosshead speed. The daisy chain resistance, strain, crosshead displacement and load of each PSvfBGA were measured and a 20% increase in the resistance was used as the failure criterion. Materials used in this study were a UV-cured acrylic edge bond adhesive, a thermal-cured epoxy edge bond adhesive and a thermal-cured epoxy corner bond adhesive. Tests were conducted on PSvfBGAs with adhesives and PSvfBGAs without bonding. The test results show that all of them can improve the bend performance significantly
    especially the edge bond epoxy increased the crosshead displacement, strain and bending force when mechanical damage occurred by 33.46%, 26.74% and 3.05% respectively. The combination of high module adhesive and edge bond dispensing pattern can provide the best improvement. Failure analysis indicated that the most common failure mode was PCB pad lift/crater. © 2011 IEEE.

    DOI

  • Effects of edge and corner bond adhesives on the drop reliability of package-on-package bottom package assemblies

    Hongbin Shi, Toshitsugu Ueda

    ICCRD2011 - 2011 3rd International Conference on Computer Research and Development   3   416 - 420  2011

    　View Summary

    This paper presents the drop test results for edge and corner bonded 0.5 mm pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package (PoP) bottom packages on a standard JEDEC drop test board. The test boards were dropped through an 1828.8 mm long, 110.0 mm diameter tube onto a steel plate. The daisy chain resistance of each PSvfBGA was measured by a post-drop resistance measurement system after each drop and a static 10 Ω rise (or more) from initial resistance was considered as the failure criterion. Three materials used in this study were a UV-cured acrylic edge bond adhesive, a thermal-cured epoxy edge bond adhesive and a thermal-cured epoxy corner bond adhesive. Tests were conducted on PSvfBGAs with adhesives and PSvfBGAs without bonding. Statistics of the number of drops-to-failure for the fifteen component locations on each test board are reported. The test results show that the drop test performance of PSvfBGAs with UV-cured edge bonding, thermal-cured edge bonding and corner bonding are respectively about six, eight and seven times better than the PSvfBGAs without bonding. Failure analysis was performed using dye-and-pry, cross section scanning electron microscope (SEM) and energy dispersive X-ray (EDX) methods. The most common failure mode observed is solder cracking at component side intermetallic compound (IMC)/solder interface. © 2011 IEEE.

    DOI

  • A Real Double-convex Spherical Single Lens System with Blur Restoration Feature (oral)

    Yupeng Zhang, Ikumi Ninema, Toshitsugu Ueda

    2011 International Conference on Communication and Electronics Information, Haikou, China    2011

  • Saturated Absorption Spectroscopy of Hydrocarbons Based on Photonic Bandgap Fiber (oral)

    Xuefeng Li, Jinxing Liang, Yupeng Zhang, Toshitsugu Ueda

    2011 International Conference on Communication and Electronics Information, Haikou, China    2011

  • Bonding of silicon and crystal quartz wafers at the minimized residual stresses

    Yury Zimin, Toshitsugu Ueda, Joanna Pawlat

    PRZEGLAD ELEKTROTECHNICZNY   87 ( 8 ) 239 - 242  2011

    　View Summary

    In this work, strong low-temperature bonding of silicon and crystalline quartz wafers, effecting in mechanical strength, which is close to initial materials has been described. High bonding strength is associated with minimization of the residual stresses, optimization of surface activation, and application of an electric field during annealing. The bonding has a wide application field because both, silicon and crystalline quartz are key materials for many devices including generators, high frequency filters, gyroscopes, microbalances of high stability, etc.

  • Diesel Particulate Analysis Using SEM-EDX and Laser-induced Breakdown Spectroscopy

    S. Ikezawa, M. Wakamatsu, T. Ueda

    International Journal on Smart Sensing and Intelligent Systems   Vol. 4 ( No. 2 ) 174 - 188  2011

  • A two-dimensional anisotropic wet etching simulator for quartz crystal

    Meng Zhao, Jiani Wang, Hiroshi Oigawa, Jing Ji, Hisanori Hayashi, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   131 ( 5 ) 185 - 188  2011

    　View Summary

    We developed an anisotropic wet etching simulator that can predict the etching profile of initial shape, which is two-dimensional and formed by straight lines. New etching rate database of quartz at a special condition was obtained. Improved hull method was used to deal with round corner etching. New programming flow was adopted to avoid improper profile prediction. A friendly graphical user interface was built for user's convenience. The simulation result of this simulator meets well with the experimental results and shows nice accuracy in new emerging faces predicting. © 2011 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Development of carbonaceous particle size analyzer using laser-induced incandescence technology

    Satoshi Ikezawa, Muneaki Wakamatsu, Yury L'vovich Zimin, Joanna Pawlat, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   131 ( 5 ) 171 - 177  2011

    　View Summary

    This paper presents a new sensing system for carbonaceous nanoparticle measurement using a laser-induced incandescence (LII) technique. Our research group has improved the laser-induced breakdown spectroscopy (LIBS) system used for quantitative analysis. Although the basic principles of LIBS quantitative measurements are well understood, several uncertainties remain concerning complete descriptions-especially for particle size measurement. The elemental composition and density of the particles are determined using LIBS, and particle size measurements are accomplished with the help of LII. In the case of the present system, with temporally resolved LII, measurement of soot primary particle sizes is feasible in a combustion process derived from the ratio of emission signals after a laser pulse because the cooling behaviour is characteristic of the particle size. The LII temporal analysis was performed by a streak camera, which was also used for LIBS analysis. The LII technique allows in situ measurement of the average primary particle size of nanoscale soot particles. © 2011 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Deblur of Radially Variant Blurred Image for Single Lens System

    Yupeng Zhang, Toshitsugu Ueda

    IEEJ TRANSACTIONS ON ELECTRICAL AND ELECTRONIC ENGINEERING   6 ( Issue S1 ) S7 - S16  2011

    　View Summary

    This paper introduces a method to deblur a radially blurred image which is created by a single lens imaging system. Single lens imaging system does not create stronger lens aberrations around the center of an image, but stronger around the outside. One obvious phenomenon caused by this is the radially increased blurring effect along the radial line. Researchers have already studied one kind of radial blur caused by vertical motion between camera and object, but few have studied on the radial blur caused by inherent defect of a single lens system. Because of the radially variant property, a method is proposed in this paper that carries out the deconvolution using Polar coordinate system for both image and point spread functions (PSFs) converted from Cartesian coordinate system. By doing this the deblurring becomes a regular spatially invariant (SI) linear mathematical model for each circled region in the image that has same radial distance from the image center. Simulation results suggest the proposed method visually obtained the best deblurred image quality using four PSFs applied to four SI regions compared to deblurred images by other simulation conditions. However, segmenting the blurred image into more than four regions is undesirable because of the high beta/n ratio. (C) 2010 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.

    DOI

  • Development of hydrogen gas sensors using quartz resonator

    Hiroshi Oigawa, Daisuke Yamazaki, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   131 ( 3 ) 3 - 121  2011

    　View Summary

    The hydrogen gas sensor using quartz resonators is developed to measure less than 4% hydrogen concentration in air. This sensor consists of two quartz resonators. Both sides of electrodes of the sensor resonator are made by platinum thin film. And the reference resonator has Au electrodes. By using this reference resonator, the influence of the temperature and pressure will be canceled. This sensor can measure hydrogen concentration from reaction heat on the platinum catalyst. From experimental results, the frequency of sensor changed linearly in 0% to 5% hydrogen concentrations mixed with the air. The sensor showed 20ppm frequency translation per 1%, and the time constant is about 20 seconds. © 2011 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Effects of Reworkable Edge and Corner Bond Adhesives on the Thermal Fatigue Performance of Lead-Free Chip Scale Package Assemblies

    Hongbin Shi, Toshitsugu Ueda

    Proceedings of 13th International Conference on. Electronics Materials and Packaging, pp. EMAP2011-20 (1-10)    2011

  • Investigation on the Optimum Sampling Rate of Strain Measurement during Printed Circuit Board (PCB) System Assembly

    Hongbin Shi, Toshitsugu Ueda

    Proceedings of the 13th Electronics Packaging Technology Conference     579 - 584  2011

    DOI

  • Mitigation of thermal fatigue failure in fully underfilled lead-free array-based package assemblies using partial underfills

    Hong-Bin Shi, Toshitsugu Ueda

    2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011     542 - 547  2011

    　View Summary

    A design of experiments was conducted to determine the thermal cycling reliability of full and partial capillary flow underfilled lead-free chip scale packages (CSPs), the tests were carried out based on the JEDEC JESD22-A104C standard. Two kinds of representative fast cure and reworkable underfill materials are used in this study, and CSPs without underfill were also tested for comparison. The test results show that both two underfill materials reduce the thermal cycling reliability of CSP assemblies. The underfill with high glass transition temperature (Tg) and storage modulus yielded better performance, of course, the CTE is also very critical to the thermomechanical fatigue performance, but its effects is not so obvious in this study due to the similar CTE of used underfills. In addition, the negative effect of partial underfill is smaller than that of full underfill. Failure analysis shows that the dominant failure mode observed is solder cracking near package and/or PCB pads. © 2011 IEEE.

    DOI

  • Quartz resonator hydrogen sensor using platinum black

    Hiroshi Oigawa, Yu Kirino, Daisuke Yamazaki, Toshitsugu Ueda

    Proceedings of the International Conference on Sensing Technology, ICST     561 - 564  2011

    　View Summary

    To achieve accurate detection of hydrogen concentration at the range of under 0.1% to 4% in air, we are developing the quartz resonator hydrogen sensor using platinum catalysts. The platinum electrodes of previous model were fabricated by sputtering. To improve its sensitivity, we focused on the platinum black of which structure has the three-dimensional porous. The electrodes of new model were coated by the platinum black through hydrogen reduction of the hexachloroplatinic acid. From experimental results, it was revealed that the sensitivity of a new model was two times bigger than the previous model. © 2011 IEEE.

    DOI

  • Quantitative analysis of silver nanoparticle ink using laser-induced breakdown spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    Proceedings of the International Conference on Sensing Technology, ICST     1 - 5  2011

    　View Summary

    This paper describes the quantitative analysis of silver nanoparticle ink using laser-induced breakdown spectroscopy (LIBS). LIBS can be used to obtain information about the density and chemical composition of silver particles, even ultrafine particles. Metal particles have been attracting much attention because of their increased use in new micro-nano technologies. In this work, LIBS was used as a fine metal particle measurement system for nanometallic materials used in printing. This paper reports new developments for quantitative analysis of silver nano particles. Good spectral peak resolutions were obtained when the spectra were recorded at wavelengths of 328 nm and 338 nm. © 2011 IEEE.

    DOI

  • High Frequency Plano-convex Resonator Fabricated by DRIE

    Hiroshi Oigawa, Rui Qian, Hsin-Hui Chen, Daisuke Yamazaki, Toshitsugu Ueda

    Technical Meeting on Electronic Circuits, Kyoto, Japan     43 - 46  2011

  • A Novel Method for Evaluating Triaxial Strain Gages Used in Printed Circuit Board Assemblies (PCBA) Strain Monitoring

    Hongbin Shi, Satoshi Ikezawa, Toshitsugu Ueda

    2011 IEEE SENSORS     1697 - 1700  2011

    　View Summary

    This paper reports a novel method for evaluating strain gages. In this method, the evaluated gage is attached at a specific location of coupon board, and then deflects 5 known distances by steps by the insertion of shims with different thicknesses. The strain for each bended status is recorded and can be compared against expected variation. If the principle strain values and corresponding angles within the tolerance, the gage passes the test and can be applied in practical strain measurement with increased confidence, otherwise it will be deprived of the qualification to accept. Moreover, this method combines with accredited gages can also be used to find and eliminate many errors due to gage placement, gage attachment, measurement equipment setup, and lead wires. In order to prove the validity of the given method, three types of gages from various suppliers at are evaluated, and the results of test broadly consistent with technical backgrounds of their respective manufacturers.

    DOI

  • Application of a 2-D Anisotropic Etching Simulator on Perforated Etching of Quartz Wafer

    M. Zhao, H. Oigawa, J. Ji, T. Ueda

    2011 IEEE SENSORS     1693 - 1696  2011

    　View Summary

    This paper describes features of a new anisotropic etching simulator and its applications on predicting perforated etching shape of quartz wafer. Specialized flow chart and relative process was designed to deal with etching after perforation. We present here two examples of its application on Z-plate and one example on AT-plate quartz crystal to show its good performance.

    DOI

  • Size Optimization For High Frequency Quartz Resonator Using Finite Element Vibration Analysis

    Jing Ji, Hiroshi Oigawa, Hsin Hui Chen, Meng Zhao, Toshitsugu Ueda

    2011 IEEE SENSORS     1652 - 1655  2011

    　View Summary

    In this study, size optimization for a high frequency AT-cut quartz resonator using finite element vibration analysis is presented. The objective resonator is a high frequency fundamental resonator with one-sided electrodes structure, which has high Q value and low resistance compared to the widely used overtone resonators. The one-sided electrodes structure was designed to obtain effective energy trapping and suppress inharmonic overtone (IO) mode. A convenient 2-D model using rectangular element was established to well reconcile calculation time with accuracy. A frequency mode chart describing the relationship between vibration coupling and size of quart plate was achieved. Vibration coupling and energy trapping effect were examined for different sizes of electrodes. COMSOL MULTIPHYSICS (TM) was adopted as a FEM analysis tool and the simulation results confirmed the effectiveness of this work.

    DOI

  • Sensing system for quantitative analysis of metal particles using laser-induced breakdown spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    Proceedings of IEEE Sensors     1596 - 1599  2011

    　View Summary

    This report describes a real-time sensing system for the detection and analysis of fine metal particles using laser-induced breakdown spectroscopy (LIBS). In conventional particle measurement methods, the scanning mobility particle sizer (SMPS) is widely used to obtain particle size distributions. However, when more details on particles are required, another chemical analysis must be performed separately from the one involving the SMPS. Hence, it is difficult to obtain the size and composition of fine particles in real time by conventional methods. By the proposed LIBS method, it is possible to obtain information on the density of fine particles as well as the chemical components of even ultrafine particles. Metal particles are focused on because the use of metal nanoparticles is expanding with emerging micro- and nanotechnologies. This work describes the use of the LIBS system as a fine metal particle monitoring system in a fabrication process using nanometal materials. © 2011 IEEE.

    DOI

  • A Reliability of Silicon-Crystalline Quartz Bonding Through Reducing of the Residual Stresses (口頭発表）

    Yury Zimin, Toshitsugu Ueda

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND    2011

    DOI

  • Ultra-Small Imaging System for Cell Phone Camera Using Birefringent Lenses (口頭発表）

    Yupeng Zhang, Toshitsugu Ueda

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND    2011

    DOI

  • Alkanes Near-Infrared Spectrum Analysis Based on Hollow-Core Photonic Bandgap Fiber (口頭発表）

    Xuefeng Li, S. Lin, Yury Zimin, Yupeng Zhang, Toshitsugu Ueda, Jinxing Liang

    IEEE SENSORS 2011 Conference, LIMERICK, IRELAND    2011

  • Vibration Analysis of Original Shape Quartz Resonator for High Q Realization (ポスター発表）

    H. Oigawa, Y. Kirino, H. Chen, J. Ji, T. Ueda

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan    2011

  • Optimal Size Determination of Electrodes for High Frequency Fundamental AT-cut Quartz Resonator using 3-D FEM (ポスター発表）

    J. Ji, H. Ohigawa, H. Chen, M. Zhao, T. Ueda

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan    2011

  • High Sensitivity Fiber-optic Fabry-perot Interferometer Temperature Sensor (ポスター発表）

    X. Li, S. Lin, J. Liang, H. Oigawa, T. Ueda

    24th International Microprocesses and Nanotechnology Conference, Kyoto, Japan    2011

  • Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test (ポスター発表）

    Hongbin Shi, Toshitsugu Ueda

    22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France    2011

    DOI

  • Board-level Solder Joint Reliability of Edge and Corner Bonded Lead-free Chip Scale Package Assemblies Subjected to Thermal Cycling (ポスター発表）

    Hongbin Shi, Toshitsugu Ueda

    2011 International Conference on Solid State Devices and Materials, Nagoya, Japan    2011

    DOI

  • Thermomechanical Fatigue Performance of Lead-free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills (口頭発表）

    Hongbin Shi, Toshitsugu Ueda

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan    2011

  • Analysis of Edge and Corner Bonded PoP Bottom Package Reliability under Temperature Cycling Conditions by Experimental and Finite Element Methods (ポスター発表）

    Hongbin Shi, Faxing Che, Shan Gao, Toshitsugu Ueda

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan    2011

  • Heat and Ultraviolet Dual-curable Edge Bonding Materials for Ball Grid Array Packages and the Impact on Solder Joint Reliability (ポスター発表）

    Hongbin Shi, Toshitsugu Ueda

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan    2011

  • Drop Impact Reliability Improvement of Lead-free Array-based Package Assemblies with Different Board-level Underfills and Adhesives (ポスター発表）

    Hongbin Shi, Toshitsugu Ueda

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan    2011

  • Experimental and Computational Characterization of Board-level Shear Behavior of PSvfBGA Assemblies with Edge and Corner Adhesives (ポスター発表）

    Hongbin Shi, Faxing Che, Toshitsugu Ueda

    Advanced Metallization Conference 2011: 21st Asian Session, Tokyo, Japan    2011

  • Halogen-free and Reworkable Corner Bond Adhesive for Array-based Packages and the Impact on Board-level Solder Joint Reliability (口頭発表）

    Hongbin Shi, Toshitsugu Ueda

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China    2011

    DOI

  • Investigation of Various Board-level Underfills and Adhesives for CTBGA Bend Performance Enhancements in Lead-free Portable Electronic Products (口頭発表）

    Hongbin Shi, Toshitsugu Ueda

    2011 International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China    2011

    DOI

  • Thermal Cycling Reliability of Lead-free Package Stackable Very Thin Fine Pitch Ball Grid Array Assemblies with Reworkable Edge and Corner Bond Adhesives

    Hongbin Shi, Toshitsugu Ueda

    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP)     81 - 86  2011

    　View Summary

    This paper presents the thermal cycling test results for edge and corner bonded 0.5 mm pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package (PoP) bottom packages on a quasi-standard JEDEC thermal cycling test board. Thermal cycling tests were carried out based on the JEDEC JESD22-A104C standard, -40 similar to 125 degrees C temperature range with 32 minutes/cycle test condition was applied, and hold times in each extreme temperature were 10 minutes. The daisy chain resistance of each PSvfBGA was measured by an event detector and a 1000 Omega rise (or more) from initial resistance was considered as the failure criterion. Three materials used in this study were a UV-cured acrylic edge bond adhesive, a thermal-cured epoxy edge bond adhesive and a thermal-cured epoxy corner bond adhesive, and PSvfBGAs without bonding were also tested for comparison. Statistics of the number of cycles-to-failure for the 45 components of each test group are reported. The test results show that the characteristic lives of PSvfBGAs with edge bond acrylic, edge bond epoxy and corner bond epoxy are respectively about 0.6, 0.9 and 1.3 times of the PSvfBGAs without bonding. The corner bond epoxy with lowest CTE, highest storage modulus and smallest adhesive volume yielded best performance. Because it can slow down the CTE mismatch and reduce effective action area of interactive forces between the adhesive, BT substrate and PCB during thermal cycling test. So if we want to improve the thermal cycling reliability of PSvfBGA with adhesives, the thermal-mechanical material properties and dispending patterns of adhesives should be thoroughly considered. Failure analysis was performed using dye-and-pry, cross section scanning electron microscope (SEM) and energy dispersive X-ray (EDX) methods. The common failure mode observed is solder cracking near package and/or PCB pads.

    DOI

  • Use of a new anisotropic etching simulator on quartz crystal

    M. Zhao, H. Oigawa, J. Wang, J. Ji, T. Ueda

    2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11     450 - 453  2011

    　View Summary

    This paper describes features of a new anisotropic etching simulator and its applications on predicting etching shape of quartz crystal. The simulator is suitable to predict etching profiles of two-dimensional initial shape which has a profile formed by straight lines. In this simulator, a program flow with uneven time step was used to furthest reduced the probability of improper shape prediction. We present here two examples of its application on both Z-plate and AT-plate quartz crystal to show its good performance. © 2011 IEEE.

    DOI

  • On-Wafer-Packaging of Crystal Quartz Based Devises Using Low-Temperature Anodic Bonding（ (口頭発表＋ポスター発表）

    Yury ZIMIN Toshitsugu UEDA

    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2011) Aix-en-Provence, France    2011

  • Effects of Edge and Corner bond Adhesives on Board-level Shear Strength of Lead-free Package-on-Package Devices (口頭発表）

    Hongbin Shi, Toshitsugu Ueda

    2011 International Conference on Electronics Packaging, Nara, Japan    2011

  • Study on the bend performance of package stackable very thin fine pitch ball grid array assemblies with edge and corner bond adhesives

    Hongbin Shi, Toshitsugu Ueda

    ICCRD2011 - 2011 3rd International Conference on Computer Research and Development   3   421 - 425  2011

    　View Summary

    This paper presents the four-point bend test results for edge and corner bonded 0.5mm pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package (PoP) bottom packages on a standard IPC/JEDEC bend test board. Four-point bend tests were carried out based on the above standard with a 30 mm loading span, 90 mm support span and 7.5 mm/sec crosshead speed. The daisy chain resistance, strain, crosshead displacement and load of each PSvfBGA were measured and a 20% increase in the resistance was used as the failure criterion. Materials used in this study were a UV-cured acrylic edge bond adhesive, a thermal-cured epoxy edge bond adhesive and a thermal-cured epoxy corner bond adhesive. Tests were conducted on PSvfBGAs with adhesives and PSvfBGAs without bonding. The test results show that all of them can improve the bend performance significantly
    especially the edge bond epoxy increased the crosshead displacement, strain and bending force when mechanical damage occurred by 33.46%, 26.74% and 3.05% respectively. The combination of high module adhesive and edge bond dispensing pattern can provide the best improvement. Failure analysis indicated that the most common failure mode was PCB pad lift/crater. © 2011 IEEE.

    DOI

  • Effects of edge and corner bond adhesives on the drop reliability of package-on-package bottom package assemblies

    Hongbin Shi, Toshitsugu Ueda

    ICCRD2011 - 2011 3rd International Conference on Computer Research and Development   3   416 - 420  2011

    　View Summary

    This paper presents the drop test results for edge and corner bonded 0.5 mm pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package (PoP) bottom packages on a standard JEDEC drop test board. The test boards were dropped through an 1828.8 mm long, 110.0 mm diameter tube onto a steel plate. The daisy chain resistance of each PSvfBGA was measured by a post-drop resistance measurement system after each drop and a static 10 Ω rise (or more) from initial resistance was considered as the failure criterion. Three materials used in this study were a UV-cured acrylic edge bond adhesive, a thermal-cured epoxy edge bond adhesive and a thermal-cured epoxy corner bond adhesive. Tests were conducted on PSvfBGAs with adhesives and PSvfBGAs without bonding. Statistics of the number of drops-to-failure for the fifteen component locations on each test board are reported. The test results show that the drop test performance of PSvfBGAs with UV-cured edge bonding, thermal-cured edge bonding and corner bonding are respectively about six, eight and seven times better than the PSvfBGAs without bonding. Failure analysis was performed using dye-and-pry, cross section scanning electron microscope (SEM) and energy dispersive X-ray (EDX) methods. The most common failure mode observed is solder cracking at component side intermetallic compound (IMC)/solder interface. © 2011 IEEE.

    DOI

  • A Real Double-convex Spherical Single Lens System with Blur Restoration Feature (oral)

    Yupeng Zhang, Ikumi Ninema, Toshitsugu Ueda

    2011 International Conference on Communication and Electronics Information, Haikou, China    2011

  • Saturated Absorption Spectroscopy of Hydrocarbons Based on Photonic Bandgap Fiber (oral)

    Xuefeng Li, Jinxing Liang, Yupeng Zhang, Toshitsugu Ueda

    2011 International Conference on Communication and Electronics Information, Haikou, China    2011

  • Bonding of silicon and crystal quartz wafers at the minimized residual stresses

    Yury Zimin, Toshitsugu Ueda, Joanna Pawlat

    PRZEGLAD ELEKTROTECHNICZNY   87 ( 8 ) 239 - 242  2011

    　View Summary

    In this work, strong low-temperature bonding of silicon and crystalline quartz wafers, effecting in mechanical strength, which is close to initial materials has been described. High bonding strength is associated with minimization of the residual stresses, optimization of surface activation, and application of an electric field during annealing. The bonding has a wide application field because both, silicon and crystalline quartz are key materials for many devices including generators, high frequency filters, gyroscopes, microbalances of high stability, etc.

  • Diesel Particulate Analysis Using SEM-EDX and Laser-induced Breakdown Spectroscopy

    S. Ikezawa, M. Wakamatsu, T. Ueda

    International Journal on Smart Sensing and Intelligent Systems   Vol. 4 ( No. 2 ) 174 - 188  2011

  • A two-dimensional anisotropic wet etching simulator for quartz crystal

    Meng Zhao, Jiani Wang, Hiroshi Oigawa, Jing Ji, Hisanori Hayashi, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   131 ( 5 ) 185 - 188  2011

    　View Summary

    We developed an anisotropic wet etching simulator that can predict the etching profile of initial shape, which is two-dimensional and formed by straight lines. New etching rate database of quartz at a special condition was obtained. Improved hull method was used to deal with round corner etching. New programming flow was adopted to avoid improper profile prediction. A friendly graphical user interface was built for user's convenience. The simulation result of this simulator meets well with the experimental results and shows nice accuracy in new emerging faces predicting. © 2011 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Development of carbonaceous particle size analyzer using laser-induced incandescence technology

    Satoshi Ikezawa, Muneaki Wakamatsu, Yury L'vovich Zimin, Joanna Pawlat, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   131 ( 5 ) 171 - 177  2011

    　View Summary

    This paper presents a new sensing system for carbonaceous nanoparticle measurement using a laser-induced incandescence (LII) technique. Our research group has improved the laser-induced breakdown spectroscopy (LIBS) system used for quantitative analysis. Although the basic principles of LIBS quantitative measurements are well understood, several uncertainties remain concerning complete descriptions-especially for particle size measurement. The elemental composition and density of the particles are determined using LIBS, and particle size measurements are accomplished with the help of LII. In the case of the present system, with temporally resolved LII, measurement of soot primary particle sizes is feasible in a combustion process derived from the ratio of emission signals after a laser pulse because the cooling behaviour is characteristic of the particle size. The LII temporal analysis was performed by a streak camera, which was also used for LIBS analysis. The LII technique allows in situ measurement of the average primary particle size of nanoscale soot particles. © 2011 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Deblur of radially variant blurred image for single lens system

    Yupeng Zhang, Toshitsugu Ueda

    IEEJ Transactions on Electrical and Electronic Engineering   6 ( 1 ) S7 - S16  2011

    　View Summary

    This paper introduces a method to deblur a radially blurred image which is created by a single lens imaging system. Single lens imaging system does not create stronger lens aberrations around the center of an image, but stronger around the outside. One obvious phenomenon caused by this is the radially increased blurring effect along the radial line. Researchers have already studied one kind of radial blur caused by vertical motion between camera and object, but few have studied on the radial blur caused by inherent defect of a single lens system. Because of the radially variant property, a method is proposed in this paper that carries out the deconvolution using Polar coordinate system for both image and point spread functions (PSFs) converted from Cartesian coordinate system. By doing this the deblurring becomes a regular spatially invariant (SI) linear mathematical model for each circled region in the image that has same radial distance from the image center. Simulation results suggest the proposed method visually obtained the best deblurred image quality using four PSFs applied to four SI regions compared to deblurred images by other simulation conditions. However, segmenting the blurred image into more than four regions is undesirable because of the high β/n ratio. © 2010 Institute of Electrical Engineers of Japan. Published by John Wiley &amp
    Sons, Inc.

    DOI

  • Development of hydrogen gas sensors using quartz resonator

    Hiroshi Oigawa, Daisuke Yamazaki, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   131 ( 3 ) 3 - 121  2011

    　View Summary

    The hydrogen gas sensor using quartz resonators is developed to measure less than 4% hydrogen concentration in air. This sensor consists of two quartz resonators. Both sides of electrodes of the sensor resonator are made by platinum thin film. And the reference resonator has Au electrodes. By using this reference resonator, the influence of the temperature and pressure will be canceled. This sensor can measure hydrogen concentration from reaction heat on the platinum catalyst. From experimental results, the frequency of sensor changed linearly in 0% to 5% hydrogen concentrations mixed with the air. The sensor showed 20ppm frequency translation per 1%, and the time constant is about 20 seconds. © 2011 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Design of a Singlet Lens and the Corresponding Aberration Correction Approaches for Cell Phone Camera

    Yupeng Zhang, Toshitsugu Ueda

    IEEJ TRANSACTIONS ON ELECTRICAL AND ELECTRONIC ENGINEERING   5 ( 4 ) 474 - 485  2010.07

    　View Summary

    A singlet lens model that is designed for future cell phone camera is discussed. The proposed lens model unavoidably introduces significant optical aberration because of its high field angle (maximum field angle 48). To correct the aberrations, traditional paraxial aberration and third-order Seidel aberration are no longer applicable because the accuracy will decline dramatically when the field angle reaches a high value. In this paper, the main objective is to find an improved first-order aberration equation and an improved third-order Seidel aberration equation using field-dependent coefficients to correct lateral chromatic aberration (LAT) and distortion, respectively, for a high-field-angle singlet lens. The simulation results suggest that improved higher order aberration equations are more accurate to represent real aberrations than the lower order case. However, the chromatic aberration is still visible in the resultant images even though LAT is corrected, because of the differences of blur between different colors caused by axial chromatic aberration (AX) and other monochromatic aberrations such as field curvature. This poses a new research topic as our future work. (C) 2010 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.

    DOI CiNii

  • Measurement of Low Gas Concentrations Using Photonic Bandgap Fiber Cell

    Xuefeng Li, Joanna Pawlat, Jinxing Liang, Toshitsugu Ueda

    IEEE SENSORS JOURNAL   10 ( 6 ) 1156 - 1161  2010.06

    　View Summary

    In this paper, we present a novel low-loss splice for use between the photonic bandgap fiber (PBGF) and the conventional solid-core fiber to make PBGFs more functional. Furthermore, the hollow-core and the holes in the cladding of PBGF act as gas pipes. Using the proposed splice, a measurement system for low gas concentrations based on the PBGF cell has been developed and implemented. Experiments for measuring ammonia (NH(3)) gas at the ppm level were performed. The basic peak agreed well with the database of the Pacific Northwest National Laboratory (PNNL), meaning that this method can be used to accurately and effectively measure gas concentration. The constructed gas cells are compact and cost-effective for sensitive, rapid, and continuous measurement of gases.

    DOI CiNii

  • Measurement of Low Gas Concentrations Using Photonic Bandgap Fiber Cell

    Xuefeng Li, Joanna Pawlat, Jinxing Liang, Toshitsugu Ueda

    IEEE SENSORS JOURNAL   10 ( 6 ) 1156 - 1161  2010.06

    　View Summary

    In this paper, we present a novel low-loss splice for use between the photonic bandgap fiber (PBGF) and the conventional solid-core fiber to make PBGFs more functional. Furthermore, the hollow-core and the holes in the cladding of PBGF act as gas pipes. Using the proposed splice, a measurement system for low gas concentrations based on the PBGF cell has been developed and implemented. Experiments for measuring ammonia (NH(3)) gas at the ppm level were performed. The basic peak agreed well with the database of the Pacific Northwest National Laboratory (PNNL), meaning that this method can be used to accurately and effectively measure gas concentration. The constructed gas cells are compact and cost-effective for sensitive, rapid, and continuous measurement of gases.

    DOI CiNii

  • Measurement of Low Gas Concentrations Using Photonic Bandgap Fiber Cell

    Xuefeng Li, Joanna Pawlat, Jinxing Liang, Toshitsugu Ueda

    IEEE SENSORS JOURNAL   10 ( 6 ) 1156 - 1161  2010.06

    　View Summary

    In this paper, we present a novel low-loss splice for use between the photonic bandgap fiber (PBGF) and the conventional solid-core fiber to make PBGFs more functional. Furthermore, the hollow-core and the holes in the cladding of PBGF act as gas pipes. Using the proposed splice, a measurement system for low gas concentrations based on the PBGF cell has been developed and implemented. Experiments for measuring ammonia (NH(3)) gas at the ppm level were performed. The basic peak agreed well with the database of the Pacific Northwest National Laboratory (PNNL), meaning that this method can be used to accurately and effectively measure gas concentration. The constructed gas cells are compact and cost-effective for sensitive, rapid, and continuous measurement of gases.

    DOI CiNii

  • Field-Dependent Distortion Coefficient and Backward Mapping for Distortion Correction of Singlet Lens Cameras

    Yupeng Zhang, Toshitsugu Ueda

    IEEJ TRANSACTIONS ON ELECTRICAL AND ELECTRONIC ENGINEERING   5 ( 2 ) 203 - 210  2010.03

    　View Summary

    This paper introduces approaches to deal with distortion created by a singlet lens camera. Due to the inherent optical defect of singlet lenses, considerable lens aberrations will appear in the resulting image, especially at high field angles. Among the well-known five monochromatic aberrations and two chromatic aberrations, distortion and blurring are the most obvious aberrations for the designed singlet lens. In this paper, we deal with two techniques for distortion correction: field-dependent distortion coefficient and backward mapping method. The former will produce more accurate correction than obtained using third-order coefficient and constant coefficients. The latter does not need additional interpolation process to fill Lip pixel vacancies and higher precision of pixel values can be obtained compared with our previous forward mapping method. Simulation results indicate the superiority of the proposed two techniques. (C) 2010 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.

    DOI CiNii

  • Doubled Optical Path Length for Photonic Bandgap Fiber Gas Cell using Micromirror (poster)

    Xuefeng Li, Jinxing Liang, Toshitsugu Ueda

    23st International Microprocesses and Nanotechnology Conference, Kitakyushu, Japan    2010

    DOI

  • Quartz MEMS based Double-Ended Tuning Fork with Variable sections (poster)

    Jinxing Liang, Xuefeng Li, Hongsheng Li, Yunfang Ni, Kunyu Li, Libin Huang, Toshitsugu Ueda

    23st International Microprocesses and Nanotechnology Conference, Kitakyushu, Japan    2010

  • Restoration of Radially Blurred Image Created by Spherical Single Lens System of Cell Phone Camera

    Yupeng Zhang, Ikumi Minema, Toshitsugu Ueda

    2010 IEEE SENSORS     1333 - 1337  2010

    　View Summary

    In this research, a method is proposed to restore the radially blurred image which is produced by a spherical double-convex single lens imaging system designed for cell phone cameras. This is a new study because the pieces of lens for cell phone camera has reduced to one compared to the widely accepted compound lens system that uses several pieces of lens nowadays. However, single lens imaging system introduces stronger aberrations than compound lens system, especially the radially increased blurring effect. To deal with it, a novel method is studied that restore the blurred image by deconvolving polar blurred image and polar Point Spread Functions (PSFs) converted from Cartesian coordinate system. Simulation results suggest the proposed method is applicable to both computer-created gray scale test image and natural color photographs.

    DOI

  • Development of Sensing System for Carbonaceous Particles Using LIBS Combined with LII Temporal Analytical Technique

    Satoshi Ikezawa, Muneaki Wakamatsu, Yury Zimin, Toshitsugu Ueda

    2010 IEEE SENSORS     1299 - 1304  2010

    　View Summary

    This report describes a new sensing system for carbonaceous particles detection using combination with two techniques of laser-induced breakdown spectroscopy (LIBS) and laser-induced incandescence (LII). Our research group has improved LIBS system applied for quantitative analysis. Although the basic principal of the LIBS quantitative measurements were well understood, several uncertainties still remained for complete description especially for the particle size measurement. Elemental composition and density of the particle were determined by using LIBS. Particle size measurement was accomplished with the help of LII. On the presented system, only controlling the power density of the light source allowed to switch from LIBS to LII.

    DOI

  • Low-Temperature Anodic Bonding of Silicon and Crystal Quartz Wafers for MEMS Application

    Y. Zimin, T. Ueda

    2010 IEEE SENSORS     269 - 272  2010

    　View Summary

    Conventional fabrication of MEMS devices based on the quartz consists of a high tech processing of the very crystal with electrodes and subsequent manual assembling to the package. The limitation of the manual assembling could be eliminated through integration of the processing and packaging in a single high-tech process by means of silicon/crystal quartz bonding. New integrated technology would be able to create devices with new capabilities unobtainable with outdated technology. Low-temperature anodic bonding of silicon and quartz wafer appears to be the most promising method for elaboration of the unified technology. In this work, strong bonding of Si- and crystal quartz wafers close to the mechanical strength of the initial materials has been achieved as result of low-temperature annealing in electric field under pre-activation of crystal surfaces by oxygen plasma. Tensile test shows a disruptive stress of the samples at about 35 MPa. High bonding strength is associated with electric field applied during the annealing process. Similar bonding strength has been achieved for a pair of crystal quartz and structured silicon wafer with pre-etched micro cavities. Strong low-temperature bonding, including the bonding with pre-etched cavities, could be a key element of new technology of MEMS devices and provide new opportunities for miniaturization of sensors based on crystal quartz.

    DOI

  • Anisotropic Etching Simulator for Quartz Crystal and Its Application to Design Micro-mechanical Device (oral)

    Toshitsugu Ueda

    2010 China International Symposium on Inertial Technology and Navigation, Nanjing, China    2010

  • Fabrication Process Improvement for High Sensitivity Tilt Sensor (poster)

    Lee Namho, Koichi Harima, Jiannan Liu, Masaaki Takamori, Jinxing Liang, Toshitsugu Ueda

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan    2010

  • Hydrogen Gas Sensors using Quartz Resonator (poster)

    Hiroshi Oigawa, Daisuke Yamazaki, Toshitugu Ueda

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan    2010

  • Development of a sensing system for carbonaceous particles using laser-induced incandescence technology (poster)

    Satoshi Ikezawa, Muneaki Wakamatsu, Yury Zimin, Joanna Pawlat, Toshitsugu Ueda

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan    2010

  • A Two-dimensional Anisotropic Wet Etching Simulator for Quartz Crystal (poster)

    Meng Zhao, Jiani Wang, Hiroshi Ohigawa, Jing Ji, Hisanori Hayashi, Toshitsugu Ueda

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan    2010

  • Process Development of Silver Conductor wiring on packages using Inkjet Printer (口頭)

    Sirikamon Sirisopanaporn, Satoshi Ikezawa, Toshitsugu Ueda

    The 63rd Joint Conference of Electrical and Electronics Engineers in Kyushu, Kyushu Sangyo University    2010

    DOI

  • Basic Research on Diesel Particulate Matter for Establishing Laser-induced Breakdown Spectroscopy Analysis Method (Presentation Award; oral)

    Satoshi Ikezawa, Muneaki Wakamatsu, Yury Zimin, Joanna Pawlat, Toshitsugu Ueda

    4th International Conference on Sensing Technology (ICST 2010), Lecce, Italy    2010

  • Design of a Singlet Lens and the Corresponding Aberration Correction Approaches for Cell Phone Camera

    Yupeng Zhang, Toshitsugu Ueda

    IEEJ Transactions on electrical and electronic engineering,   5 ( 4 ) 474 - 485  2010

    DOI CiNii

  • Sensing of Carbon Dioxide and Hydrocarbons Using Photonic Bandgap Fiber

    Joanna Pawlat, Xuefeng Li, Tadashi Sugiyama, Takahiro Matsuo, Yurij Zimin, Toshitsugu Ueda

    MECHATRONIC SYSTEMS AND MATERIALS: MATERIALS PRODUCTION TECHNOLOGIES   165   316 - +  2010

    　View Summary

    The sensing setup for detection and measurement of carbon dioxide and methane was designed. Absorption spectra of many compounds indicate several weak peaks around 1400-1600 nm wavelength. Thus, tunable lasers with 20 micron core photonic bandgap fiber matching above wavelengths were chosen for the optical measurement system. Measurements were performed at low pressure to eliminate pressure broadening effect and to sharpen the absorption peaks. The angled cut was performed to improve signal to noise ratio.

    DOI

  • Field-dependent distortion coefficient and backward mapping for distortion correction of singlet lens cameras

    Yupeng Zhang, Toshitsugu Ueda

    IEEJ Transactions on Electrical and Electronic Engineering   5 ( 2 ) 203 - 210  2010

    　View Summary

    This paper introduces approaches to deal with distortion created by a singlet lens camera. Due to the inherent optical defect of singlet lenses, considerable lens aberrations will appear in the resulting image, especially at high field angles. Among the wellknown five monochromatic aberrations and two chromatic aberrations, distortion and blurring are the most obvious aberrations for the designed singlet lens. In this paper, we deal with two techniques for distortion correction: field-dependent distortion coefficient and backward mapping method. The former will produce more accurate correction than obtained using third-order coefficient and constant coefficients. The latter does not need additional interpolation process to fill up pixel vacancies and higher precision of pixel values can be obtained compared with our previous forward mapping method. Simulation results indicate the superiority of the proposed two techniques. © 2010 Institute of Electrical Engineers of Japan. Published by John Wiley &amp
    Sons, Inc.

    DOI CiNii

  • Differential platinum thin film hydrogen gas sensor fabricated by MEMS techniques

    Daisuke Yamazaki, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   130 ( 3 ) 1 - 68  2010

    　View Summary

    In this paper, thermo-resistive platinum (Pt) thin film sensor, which was produced using Micro Electro Mechanical Systems (MEMS) fabrication techniques, is proposed. The sensor design incorporated resistor elements that would facilitate the temperature-resistance characteristics and mechanisms of Pt based thin film thermo-resistors. Especially, this paper reports the characteristics of a new differential Pt thin film hydrogen gas sensor. The fabricated hydrogen sensor detected the concentration of hydrogen gas in the air from 2% to 10%. It was possible to achieve the correct the heat transfer with this new differential Pt thin film hydrogen gas sensor. The characteristics of sensor's output are higher than conventional ones that we developed. © 2010 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • 白金黒を応用した水晶振動子型水素センサの研究 (口頭)

    近藤正浩, 大井川寛, 植田敏嗣

    第63回 電気関係学会九州支部連合大会, 九州産業大学    2010

    DOI

  • 高感度傾斜角センサダンピング特性と音叉振動子を用いたパッケージのリークレート測定 (口頭)

    陳涛, 高森政聡, 植田敏嗣

    第63回 電気関係学会九州支部連合大会, 九州産業大学    2010

    DOI

  • 高感度傾斜角センサ作製における金属薄膜形成プロセスの改善 (口頭)

    李南浩, 播磨幸一, 梁金星, 植田敏嗣

    第63回 電気関係学会九州支部連合大会, 九州産業大学    2010

  • Doubled Optical Path Length for Photonic Bandgap Fiber Gas Cell using Micromirror (poster)

    Xuefeng Li, Jinxing Liang, Toshitsugu Ueda

    23st International Microprocesses and Nanotechnology Conference, Kitakyushu, Japan    2010

    DOI

  • Quartz MEMS based Double-Ended Tuning Fork with Variable sections (poster)

    Jinxing Liang, Xuefeng Li, Hongsheng Li, Yunfang Ni, Kunyu Li, Libin Huang, Toshitsugu Ueda

    23st International Microprocesses and Nanotechnology Conference, Kitakyushu, Japan    2010

  • Restoration of Radially Blurred Image Created by Spherical Single Lens System of Cell Phone Camera

    Yupeng Zhang, Ikumi Minema, Toshitsugu Ueda

    2010 IEEE SENSORS     1333 - 1337  2010

    　View Summary

    In this research, a method is proposed to restore the radially blurred image which is produced by a spherical double-convex single lens imaging system designed for cell phone cameras. This is a new study because the pieces of lens for cell phone camera has reduced to one compared to the widely accepted compound lens system that uses several pieces of lens nowadays. However, single lens imaging system introduces stronger aberrations than compound lens system, especially the radially increased blurring effect. To deal with it, a novel method is studied that restore the blurred image by deconvolving polar blurred image and polar Point Spread Functions (PSFs) converted from Cartesian coordinate system. Simulation results suggest the proposed method is applicable to both computer-created gray scale test image and natural color photographs.

    DOI

  • Development of Sensing System for Carbonaceous Particles Using LIBS Combined with LII Temporal Analytical Technique

    Satoshi Ikezawa, Muneaki Wakamatsu, Yury Zimin, Toshitsugu Ueda

    2010 IEEE SENSORS     1299 - 1304  2010

    　View Summary

    This report describes a new sensing system for carbonaceous particles detection using combination with two techniques of laser-induced breakdown spectroscopy (LIBS) and laser-induced incandescence (LII). Our research group has improved LIBS system applied for quantitative analysis. Although the basic principal of the LIBS quantitative measurements were well understood, several uncertainties still remained for complete description especially for the particle size measurement. Elemental composition and density of the particle were determined by using LIBS. Particle size measurement was accomplished with the help of LII. On the presented system, only controlling the power density of the light source allowed to switch from LIBS to LII.

    DOI

  • Low-Temperature Anodic Bonding of Silicon and Crystal Quartz Wafers for MEMS Application

    Y. Zimin, T. Ueda

    2010 IEEE SENSORS     269 - 272  2010

    　View Summary

    Conventional fabrication of MEMS devices based on the quartz consists of a high tech processing of the very crystal with electrodes and subsequent manual assembling to the package. The limitation of the manual assembling could be eliminated through integration of the processing and packaging in a single high-tech process by means of silicon/crystal quartz bonding. New integrated technology would be able to create devices with new capabilities unobtainable with outdated technology. Low-temperature anodic bonding of silicon and quartz wafer appears to be the most promising method for elaboration of the unified technology. In this work, strong bonding of Si- and crystal quartz wafers close to the mechanical strength of the initial materials has been achieved as result of low-temperature annealing in electric field under pre-activation of crystal surfaces by oxygen plasma. Tensile test shows a disruptive stress of the samples at about 35 MPa. High bonding strength is associated with electric field applied during the annealing process. Similar bonding strength has been achieved for a pair of crystal quartz and structured silicon wafer with pre-etched micro cavities. Strong low-temperature bonding, including the bonding with pre-etched cavities, could be a key element of new technology of MEMS devices and provide new opportunities for miniaturization of sensors based on crystal quartz.

    DOI

  • Anisotropic Etching Simulator for Quartz Crystal and Its Application to Design Micro-mechanical Device (oral)

    Toshitsugu Ueda

    2010 China International Symposium on Inertial Technology and Navigation, Nanjing, China    2010

  • Fabrication Process Improvement for High Sensitivity Tilt Sensor (poster)

    Lee Namho, Koichi Harima, Jiannan Liu, Masaaki Takamori, Jinxing Liang, Toshitsugu Ueda

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan    2010

  • Hydrogen Gas Sensors using Quartz Resonator (poster)

    Hiroshi Oigawa, Daisuke Yamazaki, Toshitugu Ueda

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan    2010

  • Development of a sensing system for carbonaceous particles using laser-induced incandescence technology (poster)

    Satoshi Ikezawa, Muneaki Wakamatsu, Yury Zimin, Joanna Pawlat, Toshitsugu Ueda

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan    2010

  • A Two-dimensional Anisotropic Wet Etching Simulator for Quartz Crystal (poster)

    Meng Zhao, Jiani Wang, Hiroshi Ohigawa, Jing Ji, Hisanori Hayashi, Toshitsugu Ueda

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan    2010

  • Process Development of Silver Conductor wiring on packages using Inkjet Printer (口頭)

    Sirikamon Sirisopanaporn, Satoshi Ikezawa, Toshitsugu Ueda

    The 63rd Joint Conference of Electrical and Electronics Engineers in Kyushu, Kyushu Sangyo University    2010

    DOI

  • Basic Research on Diesel Particulate Matter for Establishing Laser-induced Breakdown Spectroscopy Analysis Method (Presentation Award; oral)

    Satoshi Ikezawa, Muneaki Wakamatsu, Yury Zimin, Joanna Pawlat, Toshitsugu Ueda

    4th International Conference on Sensing Technology (ICST 2010), Lecce, Italy    2010

  • Design of a singlet lens and the corresponding aberration correction approaches for cell phone camera

    Yupeng Zhang, Toshitsugu Ueda

    IEEJ Transactions on Electrical and Electronic Engineering   5 ( 4 ) 474 - 485  2010

    　View Summary

    A singlet lens model that is designed for future cell phone camera is discussed. The proposed lens model unavoidably introduces significant optical aberration because of its high field angle (maximum field angle 48°). To correct the aberrations, traditional paraxial aberration and third-order Seidel aberration are no longer applicable because the accuracy will decline dramatically when the field angle reaches a high value. In this paper, the main objective is to find an improved first-order aberration equation and an improved third-order Seidel aberration equation using field-dependent coefficients to correct lateral chromatic aberration (LAT) and distortion, respectively, for a high-field-angle singlet lens. The simulation results suggest that improved higher order aberration equations are more accurate to represent real aberrations than the lower order case. However, the chromatic aberration is still visible in the resultant images even though LAT is corrected, because of the differences of blur between different colors caused by axial chromatic aberration (AX) and other monochromatic aberrations such as field curvature. This poses a new research topic as our future work. © 2010 Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Sensing of Carbon Dioxide and Hydrocarbons Using Photonic Bandgap Fiber

    Joanna Pawlat, Xuefeng Li, Tadashi Sugiyama, Takahiro Matsuo, Yurij Zimin, Toshitsugu Ueda

    MECHATRONIC SYSTEMS AND MATERIALS: MATERIALS PRODUCTION TECHNOLOGIES   165   316 - +  2010

    　View Summary

    The sensing setup for detection and measurement of carbon dioxide and methane was designed. Absorption spectra of many compounds indicate several weak peaks around 1400-1600 nm wavelength. Thus, tunable lasers with 20 micron core photonic bandgap fiber matching above wavelengths were chosen for the optical measurement system. Measurements were performed at low pressure to eliminate pressure broadening effect and to sharpen the absorption peaks. The angled cut was performed to improve signal to noise ratio.

    DOI

  • Differential platinum thin film hydrogen gas sensor fabricated by MEMS techniques

    Daisuke Yamazaki, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   130 ( 3 ) 1 - 68  2010

    　View Summary

    In this paper, thermo-resistive platinum (Pt) thin film sensor, which was produced using Micro Electro Mechanical Systems (MEMS) fabrication techniques, is proposed. The sensor design incorporated resistor elements that would facilitate the temperature-resistance characteristics and mechanisms of Pt based thin film thermo-resistors. Especially, this paper reports the characteristics of a new differential Pt thin film hydrogen gas sensor. The fabricated hydrogen sensor detected the concentration of hydrogen gas in the air from 2% to 10%. It was possible to achieve the correct the heat transfer with this new differential Pt thin film hydrogen gas sensor. The characteristics of sensor's output are higher than conventional ones that we developed. © 2010 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Quartz MEMS based Double-Ended Tuning Fork with Variable sections (poster)

    Jinxing Liang, Xuefeng Li, Hongsheng Li, Yunfang Ni, Kunyu Li, Libin Huang, Toshitsugu Ueda

    23st International Microprocesses and Nanotechnology Conference, Kitakyushu, Japan    2010

  • Restoration of Radially Blurred Image Created by Spherical Single Lens System of Cell Phone Camera

    Yupeng Zhang, Ikumi Minema, Toshitsugu Ueda

    2010 IEEE SENSORS     1333 - 1337  2010

    　View Summary

    In this research, a method is proposed to restore the radially blurred image which is produced by a spherical double-convex single lens imaging system designed for cell phone cameras. This is a new study because the pieces of lens for cell phone camera has reduced to one compared to the widely accepted compound lens system that uses several pieces of lens nowadays. However, single lens imaging system introduces stronger aberrations than compound lens system, especially the radially increased blurring effect. To deal with it, a novel method is studied that restore the blurred image by deconvolving polar blurred image and polar Point Spread Functions (PSFs) converted from Cartesian coordinate system. Simulation results suggest the proposed method is applicable to both computer-created gray scale test image and natural color photographs.

    DOI

  • Development of Sensing System for Carbonaceous Particles Using LIBS Combined with LII Temporal Analytical Technique

    Satoshi Ikezawa, Muneaki Wakamatsu, Yury Zimin, Toshitsugu Ueda

    2010 IEEE SENSORS     1299 - 1304  2010

    　View Summary

    This report describes a new sensing system for carbonaceous particles detection using combination with two techniques of laser-induced breakdown spectroscopy (LIBS) and laser-induced incandescence (LII). Our research group has improved LIBS system applied for quantitative analysis. Although the basic principal of the LIBS quantitative measurements were well understood, several uncertainties still remained for complete description especially for the particle size measurement. Elemental composition and density of the particle were determined by using LIBS. Particle size measurement was accomplished with the help of LII. On the presented system, only controlling the power density of the light source allowed to switch from LIBS to LII.

    DOI

  • Low-Temperature Anodic Bonding of Silicon and Crystal Quartz Wafers for MEMS Application (poster)

    Zimin Yury, Toshitsugu Ueda

    IEEE Sensors 2010 Conference, Hawaii, USA    2010

    DOI

  • Anisotropic Etching Simulator for Quartz Crystal and Its Application to Design Micro-mechanical Device (oral)

    Toshitsugu Ueda

    2010 China International Symposium on Inertial Technology and Navigation, Nanjing, China    2010

  • Fabrication Process Improvement for High Sensitivity Tilt Sensor (poster)

    Lee Namho, Koichi Harima, Jiannan Liu, Masaaki Takamori, Jinxing Liang, Toshitsugu Ueda

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan    2010

  • Hydrogen Gas Sensors using Quartz Resonator (poster)

    Hiroshi Oigawa, Daisuke Yamazaki, Toshitugu Ueda

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan    2010

  • Development of a sensing system for carbonaceous particles using laser-induced incandescence technology (poster)

    Satoshi Ikezawa, Muneaki Wakamatsu, Yury Zimin, Joanna Pawlat, Toshitsugu Ueda

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan    2010

  • A Two-dimensional Anisotropic Wet Etching Simulator for Quartz Crystal (poster)

    Meng Zhao, Jiani Wang, Hiroshi Ohigawa, Jing Ji, Hisanori Hayashi, Toshitsugu Ueda

    27th Sensor Symposium on Sensors, Micromachines and Applied System, Matsue, Shimane, Japan    2010

  • Process Development of Silver Conductor wiring on packages using Inkjet Printer (口頭)

    Sirikamon Sirisopanaporn, Satoshi Ikezawa, Toshitsugu Ueda

    The 63rd Joint Conference of Electrical and Electronics Engineers in Kyushu, Kyushu Sangyo University    2010

    DOI

  • Basic Research on Diesel Particulate Matter for Establishing Laser-induced Breakdown Spectroscopy Analysis Method (Presentation Award; oral)

    Satoshi Ikezawa, Muneaki Wakamatsu, Yury Zimin, Joanna Pawlat, Toshitsugu Ueda

    4th International Conference on Sensing Technology (ICST 2010), Lecce, Italy    2010

  • Sensing of Carbon Dioxide and Hydrocarbons Using Photonic Bandgap Fiber

    Joanna Pawlat, Xuefeng Li, Tadashi Sugiyama, Takahiro Matsuo, Yurij Zimin, Toshitsugu Ueda

    MECHATRONIC SYSTEMS AND MATERIALS: MATERIALS PRODUCTION TECHNOLOGIES   165   316 - +  2010

    　View Summary

    The sensing setup for detection and measurement of carbon dioxide and methane was designed. Absorption spectra of many compounds indicate several weak peaks around 1400-1600 nm wavelength. Thus, tunable lasers with 20 micron core photonic bandgap fiber matching above wavelengths were chosen for the optical measurement system. Measurements were performed at low pressure to eliminate pressure broadening effect and to sharpen the absorption peaks. The angled cut was performed to improve signal to noise ratio.

    DOI

  • Field-Dependent Distortion Coefficient and Backward Mapping for Distortion Correction of Singlet Lens Cameras

    Yupeng Zhang, Toshitsugu Ued

    IEEJ Transactions on electrical and electronic engineering, published by John Wiley and Sons, Inc,,, pp203-210   5 ( 2 ) 203 - 210  2010

    DOI CiNii

  • Differential Platinum Thin Film Hydrogen Gas Sensor Fabricated by MEMS Techniques

    Daisuke Yamazaki, Toshitsugu Ued

    IEEJ Transactions on Sensors and Micromachines   130 ( 3 ) 65 - 68  2010

    DOI CiNii

  • Fabrication of Photonic Bandgap Fiber Gas Cell Using Focused Ion Beam Cutting

    Xuefeng Li, Joanna Pawlat, Jinxing Liang, Guan Xu, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   48 ( 6 ) 06FK05  2009.06

    　View Summary

    In this paper, we present a novel low-loss splice for use between the photonic bandgap fiber (PBGF) and the conventional step index fiber to make PBGFs more functional. The gap between the butt-coupled fibers is the most important parameter for maintaining good output coupling efficiency and allowing gas diffusion. To achieve the small gap, a focused ion beam (FIB) milling technique was developed to clean the fiber surface. The gap is adjustable from 0 to 400 mu m, and the typical connection loss at a gap of 20 mu m is 1.6 dB. A measurement system for low gas concentrations based on the PBGF cell has been developed and implemented. Experiments for measuring ammonia gas at the ppm level were performed. The basic peak agreed well with the database of the Pacific Northwest National Laboratory (PNNL), meaning that this method can be used to accurately and effectively measure gas concentration. (c) 2009 The Japan Society of Applied Physics

    DOI

  • Development of Highly Integrated Quartz Micro-Electro-Mechanical System Tilt Sensor

    Jinxing Liang, Fusao Kohsaka, Takahiro Matsuo, Xuefeng Li, Ken Kunitomo, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   48 ( 6 ) 06FK10  2009.06

    　View Summary

    In this paper, we report the research progress of a recently developed quartz micro-electro-mechanical system (MEMS)-based capacitive tilt sensor using bulk micromachining technology. The sensor, which is composed of a sensitive cantilever, proof mass and high-aspect-ratio vertical comb electrodes in wafer thickness, was fabricated using an anistropic wet etching process on a 100-mu m-thic z-cut quartz wafer. A ceramic package was designed for mounting the sensor and integrating the capacitance to a digital AD7746 circuit (Analog Devices). The sensor was mounted on the package using a flip chip method via a AuSn alloy solder. The dimensions of the integrated sensing system are 12 x 12 x 3.2 mm(3) and the weight of the system is below 1 g. The measured typical sensor sensitivity is 632 fF/degrees when the applied voltage is 0.625 V. The peak-to-peak output signal drift is limited to 1 fF in 2 h. Good linearity was achieved in the range of +/- 1 degrees High-precision detection at 0.001 degrees, which corresponds to micro-g acceleration, was also demonstrated. (c) 2009 The Japan Society of Applied Physics

    DOI

  • Fabrication of Photonic Bandgap Fiber Gas Cell Using Focused Ion Beam Cutting

    Xuefeng Li, Joanna Pawlat, Jinxing Liang, Guan Xu, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   48 ( 6 ) 06FK05  2009.06

    　View Summary

    In this paper, we present a novel low-loss splice for use between the photonic bandgap fiber (PBGF) and the conventional step index fiber to make PBGFs more functional. The gap between the butt-coupled fibers is the most important parameter for maintaining good output coupling efficiency and allowing gas diffusion. To achieve the small gap, a focused ion beam (FIB) milling technique was developed to clean the fiber surface. The gap is adjustable from 0 to 400 mu m, and the typical connection loss at a gap of 20 mu m is 1.6 dB. A measurement system for low gas concentrations based on the PBGF cell has been developed and implemented. Experiments for measuring ammonia gas at the ppm level were performed. The basic peak agreed well with the database of the Pacific Northwest National Laboratory (PNNL), meaning that this method can be used to accurately and effectively measure gas concentration. (c) 2009 The Japan Society of Applied Physics

    DOI

  • Development of Highly Integrated Quartz Micro-Electro-Mechanical System Tilt Sensor

    Jinxing Liang, Fusao Kohsaka, Takahiro Matsuo, Xuefeng Li, Ken Kunitomo, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   48 ( 6 ) 06FK10  2009.06

    　View Summary

    In this paper, we report the research progress of a recently developed quartz micro-electro-mechanical system (MEMS)-based capacitive tilt sensor using bulk micromachining technology. The sensor, which is composed of a sensitive cantilever, proof mass and high-aspect-ratio vertical comb electrodes in wafer thickness, was fabricated using an anistropic wet etching process on a 100-mu m-thic z-cut quartz wafer. A ceramic package was designed for mounting the sensor and integrating the capacitance to a digital AD7746 circuit (Analog Devices). The sensor was mounted on the package using a flip chip method via a AuSn alloy solder. The dimensions of the integrated sensing system are 12 x 12 x 3.2 mm(3) and the weight of the system is below 1 g. The measured typical sensor sensitivity is 632 fF/degrees when the applied voltage is 0.625 V. The peak-to-peak output signal drift is limited to 1 fF in 2 h. Good linearity was achieved in the range of +/- 1 degrees High-precision detection at 0.001 degrees, which corresponds to micro-g acceleration, was also demonstrated. (c) 2009 The Japan Society of Applied Physics

    DOI

  • Fabrication of Photonic Bandgap Fiber Gas Cell Using Focused Ion Beam Cutting

    Xuefeng Li, Joanna Pawlat, Jinxing Liang, Guan Xu, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   48 ( 6 ) 06FK05  2009.06

    　View Summary

    In this paper, we present a novel low-loss splice for use between the photonic bandgap fiber (PBGF) and the conventional step index fiber to make PBGFs more functional. The gap between the butt-coupled fibers is the most important parameter for maintaining good output coupling efficiency and allowing gas diffusion. To achieve the small gap, a focused ion beam (FIB) milling technique was developed to clean the fiber surface. The gap is adjustable from 0 to 400 mu m, and the typical connection loss at a gap of 20 mu m is 1.6 dB. A measurement system for low gas concentrations based on the PBGF cell has been developed and implemented. Experiments for measuring ammonia gas at the ppm level were performed. The basic peak agreed well with the database of the Pacific Northwest National Laboratory (PNNL), meaning that this method can be used to accurately and effectively measure gas concentration. (c) 2009 The Japan Society of Applied Physics

    DOI

  • Development of Highly Integrated Quartz Micro-Electro-Mechanical System Tilt Sensor

    Jinxing Liang, Fusao Kohsaka, Takahiro Matsuo, Xuefeng Li, Ken Kunitomo, Toshitsugu Ueda

    JAPANESE JOURNAL OF APPLIED PHYSICS   48 ( 6 ) 06FK10  2009.06

    　View Summary

    In this paper, we report the research progress of a recently developed quartz micro-electro-mechanical system (MEMS)-based capacitive tilt sensor using bulk micromachining technology. The sensor, which is composed of a sensitive cantilever, proof mass and high-aspect-ratio vertical comb electrodes in wafer thickness, was fabricated using an anistropic wet etching process on a 100-mu m-thic z-cut quartz wafer. A ceramic package was designed for mounting the sensor and integrating the capacitance to a digital AD7746 circuit (Analog Devices). The sensor was mounted on the package using a flip chip method via a AuSn alloy solder. The dimensions of the integrated sensing system are 12 x 12 x 3.2 mm(3) and the weight of the system is below 1 g. The measured typical sensor sensitivity is 632 fF/degrees when the applied voltage is 0.625 V. The peak-to-peak output signal drift is limited to 1 fF in 2 h. Good linearity was achieved in the range of +/- 1 degrees High-precision detection at 0.001 degrees, which corresponds to micro-g acceleration, was also demonstrated. (c) 2009 The Japan Society of Applied Physics

    DOI

  • Improved MEMS structure for stress-free flip-chip packaging

    Jinxing Liang, Toshitsugu Ueda

    JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS   8 ( 2 ) 021118  2009.04

    　View Summary

    We present a new method for stress-free microelectromechanical systems (MEMS) flip-chip packaging. Residual stress, which is mainly generated during the reflow process, is a notorious problem in flip-chip packaging. The residual stress reduces the bump fatigue life and device performance owing to the deformation. Underfill encapsulation is a common way to reduce the residual stress in a flip-chip integrated circuit (IC) packaging process. However, it cannot be applied to MEMS packaging because MEMS devices usually include moving microstructures. We intend to resolve this problem by improving the MEMS structure, designing spring beams to introduce electrical pads. The residual stress, which is caused by the mismatch of the coefficient of thermal expansion (CTE) between the MEMS device and the package substrate, can be absorbed through the deflection of spring beams. By using this idea, a quartz MEMS-based capacitive tilt sensor, which was bulk etched and composed of vertical comb electrodes in wafer thickness for achieving large initial capacitance, was successfully packaged. A high melting point alloy Au80Sn20 was used as the solder joint material. The thermal cycling test and sensitivity evaluation experimental results demonstrated the effectiveness of the proposed method. (C) 2009 Society of Photo-Optical Instrumentation Engineers. [DOI: 10.1117/1.3134087]

    DOI

  • Improved MEMS structure for stress-free flip-chip packaging

    Jinxing Liang, Toshitsugu Ueda

    JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS   8 ( 2 ) 021118  2009.04

    　View Summary

    We present a new method for stress-free microelectromechanical systems (MEMS) flip-chip packaging. Residual stress, which is mainly generated during the reflow process, is a notorious problem in flip-chip packaging. The residual stress reduces the bump fatigue life and device performance owing to the deformation. Underfill encapsulation is a common way to reduce the residual stress in a flip-chip integrated circuit (IC) packaging process. However, it cannot be applied to MEMS packaging because MEMS devices usually include moving microstructures. We intend to resolve this problem by improving the MEMS structure, designing spring beams to introduce electrical pads. The residual stress, which is caused by the mismatch of the coefficient of thermal expansion (CTE) between the MEMS device and the package substrate, can be absorbed through the deflection of spring beams. By using this idea, a quartz MEMS-based capacitive tilt sensor, which was bulk etched and composed of vertical comb electrodes in wafer thickness for achieving large initial capacitance, was successfully packaged. A high melting point alloy Au80Sn20 was used as the solder joint material. The thermal cycling test and sensitivity evaluation experimental results demonstrated the effectiveness of the proposed method. (C) 2009 Society of Photo-Optical Instrumentation Engineers. [DOI: 10.1117/1.3134087]

    DOI

  • Hydrogen gas sensor using quartz resonator

    Daisuke Yamazaki, Yoshinori Kakimoto, Toshitsugu Ueda

    The 8th IEEE Conference on Sensors, Proceedings, (B4P-005)pp., Christchurch, NewZealand, October 25-28, 2009     25 - 28  2009

  • Sensing of carbon dioxide and hydrocarbons using photonic bandgap fiber

    Joanna Pawlat, Xuefeng Li, Tadashi Sugiyama, Takahiro Matsuo, Yurij Zimin, Toshitsugu Ueda

    The 5th International Conference Mechatronic Systems and Materials (MSM 2009) 22-25 October 2009, Vilnius, Lithuania     22 - 25  2009

  • Sensing of Ammonia and Hydrocarbons Using Photonic Bandgap Fiber Cell

    Joanna Pawlat, Xuefeng Li, Takahiro Matsuo, Yura Zimin, Toshitsugu Ueda

    Proceedings of the 26th Sensor Symposium on Sensors, Micromachines and Applied System, October 15-16, 2009, Tokyo, Japan     5 - 8  2009

  • Development of the Miniaturized Eddy Current Displacement Sensor Using MEMS Coil

    Yungfeng Tsou, Toshitsugu Ueda, Tooru Tsuno

    Proceedings of the 26th Sensor Symposium on Sensors, Micromachines and Applied System, October 15-16, 2009, Tokyo, Japan     4 - 14  2009

  • Sensor for measurement of hydrocarbons concentration based on optic fiber

    Joanna Pawlat, Xuefeng Li, Takahiro Matsuo, Yura Zimin, Toshitsugu Ueda

    Proceedings of SPIE - The International Society for Optical Engineering   7389  2009

    　View Summary

    Measuring system based on Photonic Bandgap Fiber (PBGF), which will be able to detect, distinguish and measure the concentration of various aliphatic hydrocarbons is proposed. Such a system can be applied on each stage of fuel evaluation, production, distribution and storage of petroleum products. Aliphatic hydrocarbons absorption spectra show several peaks around 1400-1600 nm wavelength. Thus, tunable lasers with 20 micron core photonic bandgap fiber matching above wavelengths were chosen for the optical measurement system. Measurements were performed at a low pressure to eliminate pressure broadening effect and to sharpen the absorption peaks. The sensitivity of measurement increases with increasing of the fiber's length. Length of fiber was adjusted using several methods. The best results were obtained using argon ion beam cutting. The angled cut was performed to improve signal to noise ratio. © 2009 SPIE.

    DOI

  • Characterization of a quartz MEMS tilt sensor with 0.001° precision

    Jinxing Liang, Fusao Kohsaka, Xuefeng Li, Ken Kunitomo, Toshitsugu Ueda

    TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems     308 - 310  2009

    　View Summary

    This paper presents the performance of recently developed MEMS capacitive tilt sensor. The capacitive sensor, which can be considered as a static accelerometer, is fabricated using bulk micromachining technique on a 100-μm-thick z-cut quartz wafer. High-sensitivity and low-noise are achieved with stable output performance in the range of ±1°. The performance evaluation was performed at the 0.625 V excitation voltage and 9.1 Hz data update rate. The typical sensitivity with good linearity is 403.5 fF/°, which corresponds to 23.1 pF/g and the typical RMS noise is 74 aF, which corresponds to 25 aF/√Hz (0.9 μg/√Hz) noise floor. High-precision measurement of 0.001° has been demonstrated. ©2009 IEEE.

    DOI

  • Control of a Micro-Droplet for Laser-induced Breakdown Spectroscopy Solution Measurement

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawlat, Toshitsugu Ueda

    Solid State Phenomena   Vols. 147-149   639 - 644  2009

    DOI

  • High-precision gas sensor based on photonic bandgap fiber cell

    Joanna Pawłat, Xuefeng Li, Tadashi Sugiyama, Takahiro Matsuo, Yurij Zimin, Toshitsugu Ueda

    Solid State Phenomena   147-149   131 - 136  2009

    　View Summary

    As one of applications for Microstructured Optical Fiber, a new device for measurement of low gas concentration was designed. In the developed system the Photonic Bandgap Fiber (PBGF) was used as a gas cell. Proposed technique allowed reducing gas sample volume to 0.01 cc. The gas flow inside core of fiber was simulated and result was confirmed experimentally. During the experimental work several types of fibers of various parameters were specially designed, produced and used. Core diameters ranged from 10.9 μm to 700 μm. Various cutting techniques for fibers such as using the fiber cleaver, Focused Ion Beam and Cross Section Polisher were investigated. © (2009) Trans Tech Publications.

    DOI

  • PBG fiber low concentration gas sensor

    Joanna Pawłat, Xuefeng Li, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    Solid State Phenomena   144   163 - 168  2009

    　View Summary

    The photonic bandgap fiber for a high-sensitivity, compact set-up, which enables the precise measurement of low concentration of gas was designed. Fiber was used instead the traditional glass gas cell during the spectroscopic measurements. Ar ion beam was proposed among the other methods to process the inlet and outlet surface of fiber and adjust it to the required parameters. The gas flow inside PBF fiber and its optical properties were investigated. © (2009) Trans Tech Publications.

    DOI

  • Gas sensor based on microstructured optic fiber

    Joanna Pawlat, Xuefeng Li, Tadashi Sugiyama, Takahiro Matsuo, Yura Zimin, Toshitsugu Ueda

    PRZEGLAD ELEKTROTECHNICZNY   85 ( 5 ) 115 - 117  2009

    　View Summary

    Microstructured optical fiber was used as a gas cell in spectroscopic measurements of a low concentration of gas.. Proposed technique allowed reducing gas sample volume to 0.01 cc. The gas flow inside core of fiber was simulated and result was confirmed experimentally. During the experimental work several types of fibers of various parameters were specially designed, produced and used. Core diameters ranged from 10.9 mu m to 700 mu m. Various cutting techniques for fibers such as using the fiber cleaver, Focused Ion Beam and Cross Section Polisher were investigated.

  • Laser spectroscopy of minute amounts of gas using photonic bandgap fiber

    Tadashi Sugiyama, Toshitsugu Ueda, Joanna Pawlat

    IEEJ Transactions on Sensors and Micromachines   129 ( 6 ) 3 - 193  2009

    　View Summary

    This paper describes laser spectroscopy using a photonic bandgap fiber as a gas cell. The photonic bandgap fiber has an air hole core about 10μm in diameter at its center. After passing the test gas and a laser beam through the core simultaneously, the absorption spectrum is measured by laser spectrometry. The new method has the following features compared with the conventional gas cell method or the white cell method: 1. Extremely small amounts of gas can be measured. 2. Stable and highly-sensitive measurement that is less subject to environmental fluctuation is possible. This paper confirms the effectiveness of the new method by measuring the absorption spectrum of ammonia gas. © 2009 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Sensing system for multiple measurements of trace elements using laser-induced breakdown spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawłat, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   129 ( 4 ) 115 - 119  2009

    　View Summary

    The setup, micro-droplet sampling system combined with a gas-flow system for measurement using laser-induced breakdown spectroscopy (LIBS) is introduced. This setup was designed for high sensitive quantitative analysis using ink-jet technology and gas-flow assistance. The setup presented here allowed precise detection of a uniform volume of 30-μm micro-droplet location for guiding it into a 53.2-μm beam spot area, under the effects of any ambient gas. In this paper, experimental results with the use of two kind of ambient gasses
    air and argon gas, were compared in order to find proper time-delay values for time-resolving spectroscopy. From time-gated spectroscopy analysis of these experiments, different relaxation time spectral data were obtained. This result indicates that in the case of using argon ambient for assistance, broader range of time-gate setting is required as compared with the case of using air ambient. Sensitive LIBS measurement for trace elements was shown by using the proper gate-setting value. © 2009 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Control of a Micro-Droplet for Laser-Induced Breakdown Spectroscopy Solution Measurement

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    Solid State Phenomena    2009

    DOI

  • PBG fiber low concentration gas sensor

    Joanna Pawłat, Xuefeng Li, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    Solid State Phenomena   144   163 - 168  2009

    　View Summary

    The photonic bandgap fiber for a high-sensitivity, compact set-up, which enables the precise measurement of low concentration of gas was designed. Fiber was used instead the traditional glass gas cell during the spectroscopic measurements. Ar ion beam was proposed among the other methods to process the inlet and outlet surface of fiber and adjust it to the required parameters. The gas flow inside PBF fiber and its optical properties were investigated. © (2009) Trans Tech Publications.

    DOI

  • Hydrogen gas sensor using quartz resonator

    Daisuke Yamazaki, Yoshinori Kakimoto, Toshitsugu Ueda

    The 8th IEEE Conference on Sensors, Proceedings, (B4P-005)pp., Christchurch, NewZealand, October 25-28, 2009     25 - 28  2009

  • Sensing of carbon dioxide and hydrocarbons using photonic bandgap fiber

    Joanna Pawlat, Xuefeng Li, Tadashi Sugiyama, Takahiro Matsuo, Yurij Zimin, Toshitsugu Ueda

    The 5th International Conference Mechatronic Systems and Materials (MSM 2009) 22-25 October 2009, Vilnius, Lithuania     22 - 25  2009

  • Sensing of Ammonia and Hydrocarbons Using Photonic Bandgap Fiber Cell

    Joanna Pawlat, Xuefeng Li, Takahiro Matsuo, Yura Zimin, Toshitsugu Ueda

    Proceedings of the 26th Sensor Symposium on Sensors, Micromachines and Applied System, October 15-16, 2009, Tokyo, Japan     5 - 8  2009

  • Development of the Miniaturized Eddy Current Displacement Sensor Using MEMS Coil

    Yungfeng Tsou, Toshitsugu Ueda, Tooru Tsuno

    Proceedings of the 26th Sensor Symposium on Sensors, Micromachines and Applied System, October 15-16, 2009, Tokyo, Japan     4 - 14  2009

  • Sensor for measurement of hydrocarbons concentration based on optic fiber

    Joanna Pawlat, Xuefeng Li, Takahiro Matsuo, Yura Zimin, Toshitsugu Ueda

    Proceedings of SPIE - The International Society for Optical Engineering   7389  2009

    　View Summary

    Measuring system based on Photonic Bandgap Fiber (PBGF), which will be able to detect, distinguish and measure the concentration of various aliphatic hydrocarbons is proposed. Such a system can be applied on each stage of fuel evaluation, production, distribution and storage of petroleum products. Aliphatic hydrocarbons absorption spectra show several peaks around 1400-1600 nm wavelength. Thus, tunable lasers with 20 micron core photonic bandgap fiber matching above wavelengths were chosen for the optical measurement system. Measurements were performed at a low pressure to eliminate pressure broadening effect and to sharpen the absorption peaks. The sensitivity of measurement increases with increasing of the fiber's length. Length of fiber was adjusted using several methods. The best results were obtained using argon ion beam cutting. The angled cut was performed to improve signal to noise ratio. © 2009 SPIE.

    DOI

  • Characterization of a quartz MEMS tilt sensor with 0.001° precision

    Jinxing Liang, Fusao Kohsaka, Xuefeng Li, Ken Kunitomo, Toshitsugu Ueda

    TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems     308 - 310  2009

    　View Summary

    This paper presents the performance of recently developed MEMS capacitive tilt sensor. The capacitive sensor, which can be considered as a static accelerometer, is fabricated using bulk micromachining technique on a 100-μm-thick z-cut quartz wafer. High-sensitivity and low-noise are achieved with stable output performance in the range of ±1°. The performance evaluation was performed at the 0.625 V excitation voltage and 9.1 Hz data update rate. The typical sensitivity with good linearity is 403.5 fF/°, which corresponds to 23.1 pF/g and the typical RMS noise is 74 aF, which corresponds to 25 aF/√Hz (0.9 μg/√Hz) noise floor. High-precision measurement of 0.001° has been demonstrated. ©2009 IEEE.

    DOI

  • Control of a micro-droplet for laser-induced breakdown spectroscopy solution measurement

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawłat, Toshitsugu Ueda

    Solid State Phenomena   147-149   639 - 644  2009

    　View Summary

    In this paper, laser-induced breakdown spectroscopy (LIBS) using micro-droplet NaCl solution and set-up for control of micro-droplets are described. Micro-droplets controlling technique is important for solution quantitative analysis. In this study, micro-droplet ejection system for sampling is designed and presented. This micro-droplet ejection system enable a constant volume of the sample liquid to be obtained and it takes advantage of the liquid physical state
    the density of the solution can be controlled accurately. The method presented here generates small droplets (diameter 30 μm) by confining the entire volume of the sample material in the laser beam spot area (minimum beam spot diameter: 53.2 μm) and separating it from its surroundings. Using this liquid micronizing method, improved sensitivities are obtained. The Advantage of LIBS is a useful method for determining the elemental composition of various materials regardless of their physical state (solid, liquid, or gas) and without any preprocessing
    it is a type of atomic emission spectroscopy (AES). Despite the advantage of qualitative analysis, quantitative analysis is difficult because of sample and plasma fluctuations. Generating constant volume of micro-size sample and proper sample control technique contribute to LIBS quantitative analysis. © (2009) Trans Tech Publications.

    DOI

  • High-precision gas sensor based on photonic bandgap fiber cell

    Joanna Pawłat, Xuefeng Li, Tadashi Sugiyama, Takahiro Matsuo, Yurij Zimin, Toshitsugu Ueda

    Solid State Phenomena   147-149   131 - 136  2009

    　View Summary

    As one of applications for Microstructured Optical Fiber, a new device for measurement of low gas concentration was designed. In the developed system the Photonic Bandgap Fiber (PBGF) was used as a gas cell. Proposed technique allowed reducing gas sample volume to 0.01 cc. The gas flow inside core of fiber was simulated and result was confirmed experimentally. During the experimental work several types of fibers of various parameters were specially designed, produced and used. Core diameters ranged from 10.9 μm to 700 μm. Various cutting techniques for fibers such as using the fiber cleaver, Focused Ion Beam and Cross Section Polisher were investigated. © (2009) Trans Tech Publications.

    DOI

  • PBG fiber low concentration gas sensor

    Joanna Pawłat, Xuefeng Li, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    Solid State Phenomena   144   163 - 168  2009

    　View Summary

    The photonic bandgap fiber for a high-sensitivity, compact set-up, which enables the precise measurement of low concentration of gas was designed. Fiber was used instead the traditional glass gas cell during the spectroscopic measurements. Ar ion beam was proposed among the other methods to process the inlet and outlet surface of fiber and adjust it to the required parameters. The gas flow inside PBF fiber and its optical properties were investigated. © (2009) Trans Tech Publications.

    DOI

  • Gas sensor based on microstructured optic fiber

    Joanna Pawlat, Xuefeng Li, Tadashi Sugiyama, Takahiro Matsuo, Yura Zimin, Toshitsugu Ueda

    PRZEGLAD ELEKTROTECHNICZNY   85 ( 5 ) 115 - 117  2009

    　View Summary

    Microstructured optical fiber was used as a gas cell in spectroscopic measurements of a low concentration of gas.. Proposed technique allowed reducing gas sample volume to 0.01 cc. The gas flow inside core of fiber was simulated and result was confirmed experimentally. During the experimental work several types of fibers of various parameters were specially designed, produced and used. Core diameters ranged from 10.9 mu m to 700 mu m. Various cutting techniques for fibers such as using the fiber cleaver, Focused Ion Beam and Cross Section Polisher were investigated.

  • Laser spectroscopy of minute amounts of gas using photonic bandgap fiber

    Tadashi Sugiyama, Toshitsugu Ueda, Joanna Pawlat

    IEEJ Transactions on Sensors and Micromachines   129 ( 6 ) 3 - 193  2009

    　View Summary

    This paper describes laser spectroscopy using a photonic bandgap fiber as a gas cell. The photonic bandgap fiber has an air hole core about 10μm in diameter at its center. After passing the test gas and a laser beam through the core simultaneously, the absorption spectrum is measured by laser spectrometry. The new method has the following features compared with the conventional gas cell method or the white cell method: 1. Extremely small amounts of gas can be measured. 2. Stable and highly-sensitive measurement that is less subject to environmental fluctuation is possible. This paper confirms the effectiveness of the new method by measuring the absorption spectrum of ammonia gas. © 2009 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Improved MEMS structure for stress-free flip-chip packaging

    Jinxing Liang, Toshitsugu Ueda

    J. Micro/Nanolith. MEMS MOEMS   Vol. 8   021118  2009

    DOI

  • Sensing system for multiple measurements of trace elements using laser-induced breakdown spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawłat, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   129 ( 4 ) 115 - 119  2009

    　View Summary

    The setup, micro-droplet sampling system combined with a gas-flow system for measurement using laser-induced breakdown spectroscopy (LIBS) is introduced. This setup was designed for high sensitive quantitative analysis using ink-jet technology and gas-flow assistance. The setup presented here allowed precise detection of a uniform volume of 30-μm micro-droplet location for guiding it into a 53.2-μm beam spot area, under the effects of any ambient gas. In this paper, experimental results with the use of two kind of ambient gasses
    air and argon gas, were compared in order to find proper time-delay values for time-resolving spectroscopy. From time-gated spectroscopy analysis of these experiments, different relaxation time spectral data were obtained. This result indicates that in the case of using argon ambient for assistance, broader range of time-gate setting is required as compared with the case of using air ambient. Sensitive LIBS measurement for trace elements was shown by using the proper gate-setting value. © 2009 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Control of a Micro-Droplet for Laser-Induced Breakdown Spectroscopy Solution Measurement

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    Solid State Phenomena    2009

    DOI

  • PBG fiber low concentration gas sensor

    Joanna Pawłat, Xuefeng Li, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    Solid State Phenomena   144   163 - 168  2009

    　View Summary

    The photonic bandgap fiber for a high-sensitivity, compact set-up, which enables the precise measurement of low concentration of gas was designed. Fiber was used instead the traditional glass gas cell during the spectroscopic measurements. Ar ion beam was proposed among the other methods to process the inlet and outlet surface of fiber and adjust it to the required parameters. The gas flow inside PBF fiber and its optical properties were investigated. © (2009) Trans Tech Publications.

    DOI

  • Hydrogen gas sensor using quartz resonator

    Daisuke Yamazaki, Yoshinori Kakimoto, Toshitsugu Ueda

    The 8th IEEE Conference on Sensors, Proceedings, (B4P-005)pp., Christchurch, NewZealand, October 25-28, 2009     25 - 28  2009

  • Sensing of carbon dioxide and hydrocarbons using photonic bandgap fiber

    Joanna Pawlat, Xuefeng Li, Tadashi Sugiyama, Takahiro Matsuo, Yurij Zimin, Toshitsugu Ueda

    The 5th International Conference Mechatronic Systems and Materials (MSM 2009) 22-25 October 2009, Vilnius, Lithuania     22 - 25  2009

  • Sensing of Ammonia and Hydrocarbons Using Photonic Bandgap Fiber Cell

    Joanna Pawlat, Xuefeng Li, Takahiro Matsuo, Yura Zimin, Toshitsugu Ueda

    Proceedings of the 26th Sensor Symposium on Sensors, Micromachines and Applied System, October 15-16, 2009, Tokyo, Japan     5 - 8  2009

  • Development of the Miniaturized Eddy Current Displacement Sensor Using MEMS Coil

    Yungfeng Tsou, Toshitsugu Ueda, Tooru Tsuno

    Proceedings of the 26th Sensor Symposium on Sensors, Micromachines and Applied System, October 15-16, 2009, Tokyo, Japan     4 - 14  2009

  • Sensor for measurement of hydrocarbons concentration based on optic fiber

    Joanna Pawlat, Xuefeng Li, Takahiro Matsuo, Yura Zimin, Toshitsugu Ueda

    Proceedings of SPIE - The International Society for Optical Engineering   7389  2009

    　View Summary

    Measuring system based on Photonic Bandgap Fiber (PBGF), which will be able to detect, distinguish and measure the concentration of various aliphatic hydrocarbons is proposed. Such a system can be applied on each stage of fuel evaluation, production, distribution and storage of petroleum products. Aliphatic hydrocarbons absorption spectra show several peaks around 1400-1600 nm wavelength. Thus, tunable lasers with 20 micron core photonic bandgap fiber matching above wavelengths were chosen for the optical measurement system. Measurements were performed at a low pressure to eliminate pressure broadening effect and to sharpen the absorption peaks. The sensitivity of measurement increases with increasing of the fiber's length. Length of fiber was adjusted using several methods. The best results were obtained using argon ion beam cutting. The angled cut was performed to improve signal to noise ratio. © 2009 SPIE.

    DOI

  • Characterization of a quartz MEMS tilt sensor with 0.001° precision

    Jinxing Liang, Fusao Kohsaka, Xuefeng Li, Ken Kunitomo, Toshitsugu Ueda

    TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems     308 - 310  2009

    　View Summary

    This paper presents the performance of recently developed MEMS capacitive tilt sensor. The capacitive sensor, which can be considered as a static accelerometer, is fabricated using bulk micromachining technique on a 100-μm-thick z-cut quartz wafer. High-sensitivity and low-noise are achieved with stable output performance in the range of ±1°. The performance evaluation was performed at the 0.625 V excitation voltage and 9.1 Hz data update rate. The typical sensitivity with good linearity is 403.5 fF/°, which corresponds to 23.1 pF/g and the typical RMS noise is 74 aF, which corresponds to 25 aF/√Hz (0.9 μg/√Hz) noise floor. High-precision measurement of 0.001° has been demonstrated. ©2009 IEEE.

    DOI

  • Control of a micro-droplet for laser-induced breakdown spectroscopy solution measurement

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawłat, Toshitsugu Ueda

    Solid State Phenomena   147-149   639 - 644  2009

    　View Summary

    In this paper, laser-induced breakdown spectroscopy (LIBS) using micro-droplet NaCl solution and set-up for control of micro-droplets are described. Micro-droplets controlling technique is important for solution quantitative analysis. In this study, micro-droplet ejection system for sampling is designed and presented. This micro-droplet ejection system enable a constant volume of the sample liquid to be obtained and it takes advantage of the liquid physical state
    the density of the solution can be controlled accurately. The method presented here generates small droplets (diameter 30 μm) by confining the entire volume of the sample material in the laser beam spot area (minimum beam spot diameter: 53.2 μm) and separating it from its surroundings. Using this liquid micronizing method, improved sensitivities are obtained. The Advantage of LIBS is a useful method for determining the elemental composition of various materials regardless of their physical state (solid, liquid, or gas) and without any preprocessing
    it is a type of atomic emission spectroscopy (AES). Despite the advantage of qualitative analysis, quantitative analysis is difficult because of sample and plasma fluctuations. Generating constant volume of micro-size sample and proper sample control technique contribute to LIBS quantitative analysis. © (2009) Trans Tech Publications.

    DOI

  • High-precision gas sensor based on photonic bandgap fiber cell

    Joanna Pawłat, Xuefeng Li, Tadashi Sugiyama, Takahiro Matsuo, Yurij Zimin, Toshitsugu Ueda

    Solid State Phenomena   147-149   131 - 136  2009

    　View Summary

    As one of applications for Microstructured Optical Fiber, a new device for measurement of low gas concentration was designed. In the developed system the Photonic Bandgap Fiber (PBGF) was used as a gas cell. Proposed technique allowed reducing gas sample volume to 0.01 cc. The gas flow inside core of fiber was simulated and result was confirmed experimentally. During the experimental work several types of fibers of various parameters were specially designed, produced and used. Core diameters ranged from 10.9 μm to 700 μm. Various cutting techniques for fibers such as using the fiber cleaver, Focused Ion Beam and Cross Section Polisher were investigated. © (2009) Trans Tech Publications.

    DOI

  • PBG fiber low concentration gas sensor

    Joanna Pawłat, Xuefeng Li, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    Solid State Phenomena   144   163 - 168  2009

    　View Summary

    The photonic bandgap fiber for a high-sensitivity, compact set-up, which enables the precise measurement of low concentration of gas was designed. Fiber was used instead the traditional glass gas cell during the spectroscopic measurements. Ar ion beam was proposed among the other methods to process the inlet and outlet surface of fiber and adjust it to the required parameters. The gas flow inside PBF fiber and its optical properties were investigated. © (2009) Trans Tech Publications.

    DOI

  • Gas sensor based on microstructured optic fiber

    Joanna Pawlat, Xuefeng Li, Tadashi Sugiyama, Takahiro Matsuo, Yura Zimin, Toshitsugu Ueda

    PRZEGLAD ELEKTROTECHNICZNY   85 ( 5 ) 115 - 117  2009

    　View Summary

    Microstructured optical fiber was used as a gas cell in spectroscopic measurements of a low concentration of gas.. Proposed technique allowed reducing gas sample volume to 0.01 cc. The gas flow inside core of fiber was simulated and result was confirmed experimentally. During the experimental work several types of fibers of various parameters were specially designed, produced and used. Core diameters ranged from 10.9 mu m to 700 mu m. Various cutting techniques for fibers such as using the fiber cleaver, Focused Ion Beam and Cross Section Polisher were investigated.

  • Laser spectroscopy of minute amounts of gas using photonic bandgap fiber

    Tadashi Sugiyama, Toshitsugu Ueda, Joanna Pawlat

    IEEJ Transactions on Sensors and Micromachines   129 ( 6 ) 3 - 193  2009

    　View Summary

    This paper describes laser spectroscopy using a photonic bandgap fiber as a gas cell. The photonic bandgap fiber has an air hole core about 10μm in diameter at its center. After passing the test gas and a laser beam through the core simultaneously, the absorption spectrum is measured by laser spectrometry. The new method has the following features compared with the conventional gas cell method or the white cell method: 1. Extremely small amounts of gas can be measured. 2. Stable and highly-sensitive measurement that is less subject to environmental fluctuation is possible. This paper confirms the effectiveness of the new method by measuring the absorption spectrum of ammonia gas. © 2009 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Sensing system for multiple measurements of trace elements using laser-induced breakdown spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawłat, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   129 ( 4 ) 115 - 119  2009

    　View Summary

    The setup, micro-droplet sampling system combined with a gas-flow system for measurement using laser-induced breakdown spectroscopy (LIBS) is introduced. This setup was designed for high sensitive quantitative analysis using ink-jet technology and gas-flow assistance. The setup presented here allowed precise detection of a uniform volume of 30-μm micro-droplet location for guiding it into a 53.2-μm beam spot area, under the effects of any ambient gas. In this paper, experimental results with the use of two kind of ambient gasses
    air and argon gas, were compared in order to find proper time-delay values for time-resolving spectroscopy. From time-gated spectroscopy analysis of these experiments, different relaxation time spectral data were obtained. This result indicates that in the case of using argon ambient for assistance, broader range of time-gate setting is required as compared with the case of using air ambient. Sensitive LIBS measurement for trace elements was shown by using the proper gate-setting value. © 2009 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Control of a micro-droplet for laser-induced breakdown spectroscopy solution measurement

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawłat, Toshitsugu Ueda

    Solid State Phenomena   147-149   639 - 644  2009

    　View Summary

    In this paper, laser-induced breakdown spectroscopy (LIBS) using micro-droplet NaCl solution and set-up for control of micro-droplets are described. Micro-droplets controlling technique is important for solution quantitative analysis. In this study, micro-droplet ejection system for sampling is designed and presented. This micro-droplet ejection system enable a constant volume of the sample liquid to be obtained and it takes advantage of the liquid physical state
    the density of the solution can be controlled accurately. The method presented here generates small droplets (diameter 30 μm) by confining the entire volume of the sample material in the laser beam spot area (minimum beam spot diameter: 53.2 μm) and separating it from its surroundings. Using this liquid micronizing method, improved sensitivities are obtained. The Advantage of LIBS is a useful method for determining the elemental composition of various materials regardless of their physical state (solid, liquid, or gas) and without any preprocessing
    it is a type of atomic emission spectroscopy (AES). Despite the advantage of qualitative analysis, quantitative analysis is difficult because of sample and plasma fluctuations. Generating constant volume of micro-size sample and proper sample control technique contribute to LIBS quantitative analysis. © (2009) Trans Tech Publications.

    DOI

  • PBG fiber low concentration gas sensor

    Joanna Pawłat, Xuefeng Li, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    Solid State Phenomena   144   163 - 168  2009

    　View Summary

    The photonic bandgap fiber for a high-sensitivity, compact set-up, which enables the precise measurement of low concentration of gas was designed. Fiber was used instead the traditional glass gas cell during the spectroscopic measurements. Ar ion beam was proposed among the other methods to process the inlet and outlet surface of fiber and adjust it to the required parameters. The gas flow inside PBF fiber and its optical properties were investigated.

    DOI

  • Improved bi-layer lift-off process for MEMS applications

    Jinxing Liang, Fusao Kohsaka, Takahiro Matsuo, Xuefeng Li, Toshitsugu Ueda

    MICROELECTRONIC ENGINEERING   85 ( 5-6 ) 1000 - 1003  2008.05

    　View Summary

    Conventional lift-off process is designed for defining very fine pattern or removing metals hard to etch and the process is limited to surface microfabrication due to the requirement on directional deposition. We improved the process for the step coverage requirement in 3-D MEMS. A novel bi-layer (top image resist Shipley S1808 and bottom lift-off resist Microchem LOR) lift-off process was built up for patterning 3-D devices. Resists were coated and patterned with an overhang profile on a substrate before the substrate was etched. The key feature of the new lift-off process is to create a resist undercut profile, which is deep enough to reduce step coverage and durable to aggressive substrate etchant. The two-step development method was effective for patterning 3-D microdevices with high aspect ratio trench or through-holes. The development time of the resist profile was optimized. Fine pattern of 2 mu m/5 mu m (line/space) was achieved on quartz microstructure with high aspect ratio (2.7) trench. (C) 2008 Elsevier B.V. All rights reserved.

    DOI

  • Improved bi-layer lift-off process for MEMS applications

    Jinxing Liang, Fusao Kohsaka, Takahiro Matsuo, Xuefeng Li, Toshitsugu Ueda

    MICROELECTRONIC ENGINEERING   85 ( 5-6 ) 1000 - 1003  2008.05

    　View Summary

    Conventional lift-off process is designed for defining very fine pattern or removing metals hard to etch and the process is limited to surface microfabrication due to the requirement on directional deposition. We improved the process for the step coverage requirement in 3-D MEMS. A novel bi-layer (top image resist Shipley S1808 and bottom lift-off resist Microchem LOR) lift-off process was built up for patterning 3-D devices. Resists were coated and patterned with an overhang profile on a substrate before the substrate was etched. The key feature of the new lift-off process is to create a resist undercut profile, which is deep enough to reduce step coverage and durable to aggressive substrate etchant. The two-step development method was effective for patterning 3-D microdevices with high aspect ratio trench or through-holes. The development time of the resist profile was optimized. Fine pattern of 2 mu m/5 mu m (line/space) was achieved on quartz microstructure with high aspect ratio (2.7) trench. (C) 2008 Elsevier B.V. All rights reserved.

    DOI

  • Improved bi-layer lift-off process for MEMS applications

    Jinxing Liang, Fusao Kohsaka, Takahiro Matsuo, Xuefeng Li, Toshitsugu Ueda

    MICROELECTRONIC ENGINEERING   85 ( 5-6 ) 1000 - 1003  2008.05

    　View Summary

    Conventional lift-off process is designed for defining very fine pattern or removing metals hard to etch and the process is limited to surface microfabrication due to the requirement on directional deposition. We improved the process for the step coverage requirement in 3-D MEMS. A novel bi-layer (top image resist Shipley S1808 and bottom lift-off resist Microchem LOR) lift-off process was built up for patterning 3-D devices. Resists were coated and patterned with an overhang profile on a substrate before the substrate was etched. The key feature of the new lift-off process is to create a resist undercut profile, which is deep enough to reduce step coverage and durable to aggressive substrate etchant. The two-step development method was effective for patterning 3-D microdevices with high aspect ratio trench or through-holes. The development time of the resist profile was optimized. Fine pattern of 2 mu m/5 mu m (line/space) was achieved on quartz microstructure with high aspect ratio (2.7) trench. (C) 2008 Elsevier B.V. All rights reserved.

    DOI

  • Fabrication of Photonic Bandgap Fiber Gas Cell using Focused Ion Beam Cutting Technique

    Xuefeng Li, Joanna Pawlat, Jinxing Liang, G. Xu, Toshitsugu Ueda

    The 21st International Microprocesses and Nanotechnology Conference, JAL Resort Sea Hawk Hotel Fukuoka, Japan     29D  2008

  • Distortion Correction and Local Deblurring for Distorted and Blurred Images Projected from Two-dimensional Object

    Yupeng Zhang, Ikumi Minema, Toshitsugu Ueda

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa, Japan,     3 - 4  2008

  • A novel low-loss splice for photonic bandgap fiber gas sensor

    Xuefeng Li, Joanna Pawłat, Jinxing Liang, Toshitsugu Ueda

    Proceedings of IEEE Sensors     1289 - 1292  2008

    　View Summary

    This paper presents a novel low-loss splice between the Photonic bandgap fiber (PBGF) and conventional step index fiber, for making PBGFs more functional. The solidcore fiber is butt-coupled to a PBGF using a mechanical splice surrounded by the block. The gap between the butt-coupled fibers is the most important parameter for keeping good output coupling efficiency and allowing for gas diffusion. For achieving the small gap, a focused ion beam (FIB) milling technique was developed for getting clean fiber surface. The achieved gap is adjustable from 0 to 400ìm. And a typical value at the gap of 20μm was 1.6 dB. © 2008 IEEE.

    DOI

  • Ultratrace measurement using micro-droplet with gas-flow assistance in laser-induced breakdown Spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Yury Zimin, Joanna Pawłat, Toshitsugu Ueda

    Proceedings of IEEE Sensors     977 - 980  2008

    　View Summary

    A new setup for laser-induced breakdown spectroscopy (LIBS) is introduced. This setup was designed for high sensitive quantitative analysis using the ink-jet technology and gas-flow assistance. The setup presented here allowed precise detection of a micro-droplet for guiding it into a laser beam spot area. The micro-droplet ejection system created constant volume of sample liquid and taking advantage of liquid physical state
    density of the solution can be controlled accurately. That means the constant amount of media was maintained in a micro-droplet. This sampling system allowed generating small droplet (diameter 30 μm) confining the whole fixed volume of the sample material in the laser beam spot area (minimum beam spot diameter 53.2 μm), under the effects of any ambient gas. In this paper, the stability with practical use and improvement of detection limit for LIBS measurement is reported. © 2008 IEEE.

    DOI

  • Microstructured optic fiber cell sensor for low concentration gas measurement

    Joanna Pawłat, Xuefeng Li, Yura Zimin, Takahiro Matsuo, Toshitsugu Ueda, Tadashi Sugiyama

    Proceedings of IEEE Sensors     922 - 925  2008

    　View Summary

    A high-sensitivity, compact set-up, which enables the precise measurement of low concentration of gas, based on Microstructured Optic Fiber (MOF) was developed. Some of MOFs were designed especially for this research purpose and functioned as the gas cells of the apparatus during the spectroscopic measurements. Proposed technique allowed reducing the total size of the set-up (portability) and the gas sample volume to 0.01 cc. In the case of fibers' mass production, presented research project may lead to low cost, high-sensitivity and real-time measurement system. © 2008 IEEE.

    DOI

  • Application on Monte Carlo Method to X-ray Fluorescence Meter

    Koichi Harima, Toshitsugu Ueda

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa, Japan     451 - 454  2008

  • Photonic Bandgap Fiber Cell Sensor for Ammonia Gas Measurement

    Joanna Pawlat, Tadashi Sugiyama, Xuefeng Li, Takahiro Matsuo, Yura Zimin, Toshitsugu Ueda

    Proceedings of the 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa,     357 - 360  2008

  • Sensing System for LIBS Multiple Measurements of Trace Elements

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawlat, Toshitsugu Ueda

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa Japan     307 - 311  2008

  • Geometrically distorted image correction for single lens using decimal number mapping

    ZHANG Y

    Proceedings of the 10th IASTED International Conference on Signal and Image Processing (SIP 2008), Kailua-Kona, Hawaii, USA     26 - 31  2008

    CiNii

  • Control of a Micro-Droplet for Laser-Induced Breakdown Spectroscopy Solution Measurement

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawlat, Toshitsugu Ueda

    The 4th International Conference Mechatronic Systems and Materials, Bialystok, Poland     210 - 211  2008

  • High-Precision Gas Sensor Based on Photonic Bandgap Fiber Cell

    Joanna Pawlat, Xuefeng Li, Tadashi Sugiyama, Takahiro Matsuo, Yurij Zimin, Toshitsugu Ueda

    The 4th International Conference Mechatronic Systems and Materials, Bialystok, Poland,     54 - 55  2008

  • DESIGN OF PHOTONIC BANDGAP FIBER CELL GAS SENSOR

    Joanna Pawlat, Tadashi Sugiyama, Xuefeng Li, Takahiro Matsuo, Yura Zimin, Toshitsugu Ueda

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University   ( (Poster Session(1) ) 261 - 264  2008

  • "STRESS FREE FLIP CHIP PACKAGED QUARTZ MEMS CAPACITIVE TILT SENSOR",

    Jinxing Liang, Toshitsugu Ueda

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University,   ( Poster Session(1) ) 166 - 169  2008

  • DIFFERENTIAL PLATINUM THIN FILM HYDROGEN GAS SENSOR FABRICATED BY MEMS TECHNIQUES

    Daisuke Yamazaki, Lin Zhang, Joanna Pawlat, Toshitsugu Ueda

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University, pp.(132-135), 22-25   ( Oral Session(3) ) 132 - 135  2008

  • Gas sensor based on PBG fiber-possibilities and limitations

    Joanna Pawlat, Takahiro Matsuo, Xuefeng Li, Tadashi Suglyama, Toshitsugu Ueda

    19TH INTERNATIONAL CONFERENCE ON OPTICAL FIBRE SENSORS, PTS 1 AND 2   7004  2008

    　View Summary

    The Photonic Pandgap fiber was proposed as a new alternative for traditional glass-made gas cell used in spectroscopic measurements. Several PBG fibers were specially designed and produced for performed experiments. Gas flow within fiber was simulated and measured and ppm concentrations of ammonia gas were detected with short lengths of fiber. Final goal of the project is to produce portable and compact device for fast, ppb range rneasurement. Additionally, several fiber cutting methods were tested.

    DOI

  • Case Analysis Oriented Interpolation and a Two-Step Interpolation after Correction of Barrel Distortion and Lateral Chromatic Aberration

    Yupeng Zhang, Ikumi Minema, Toshitsugu Ueda

    , IEEJ Transactions on Sensors and Micromachines   Vol.128 ( No.11 )  2008

    DOI

  • Thermo-resistive platinum thin film hydrogen gas sensor fabricated by MEMS techniques

    Daisuke Yamazaki, Lin Zhang, Joanna Pawlat, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   128 ( 9 ) 1 - 351  2008

    　View Summary

    Thermo-resistive platinum(Pt) thin film sensor was produced using Micro Electro Mechanical Systems (MEMS) fabrication techniques. The sensor design incorporated resistor elements that would facilitate the temperature-resistance characteristics and mechanisms of Pt based thin film thermo-resistors. The sensor was fabricated with lift-off process that allowed the dual sensing surface area. Furthermore, the dual sensing surfaces ensured faster response to hydrogen gas. To increase the catalytic reaction comparing with at the room temperature, the sensor was heated to a specified temperature by applying the current to a Pt thin film. The catalytic reaction took place when the heated sensor came into the contact with hydrogen. Additionally, the differential Pt thin film hydrogen gas sensor was also developed. This gas sensor was able to compensate the changes in the external environment such as temperature, moisture, etc. The fabricated hydrogen sensor detected the concentration of hydrogen gas in air from 2% to 9%. © 2008 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Improvement of a micro-droplet guiding technique for laser-induced breakdown spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawłat, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   128 ( 7 ) 1 - 301  2008

    　View Summary

    A new and reliable set-up for laser-induced breakdown spectroscopy (LIBS) which enabled the precise micro-droplet observation and guiding the solution samples into a laser beam spot area was designed. The method presented here allowed micronizing of the liquid sample confining the whole volume of the sample in the laser beam spot area (minimum beam spot diameter 53.2um, micro-droplet diameter 30-40μm), separating it from its surroundings. As a result, LIBS with the micro-drop ejection system produced greater intensities than the old technique of bulk-liquid measurement based on data from 100 laser pulse shots. Advantages of this method were: strong emissions, no sample splashing, solution density controllability and ho chemical denaturation. This experimental set-up helped to overcome the disadvantage of LIBS with a micro-drop ejection system. © 2008 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Low concentration gas measurement using Photonic Bandgap Fiber cell sensor

    Joanna Pawłat, Tadashi Sugiyama, Xuefeng Li, Takahiro Matsuo, Satoshi Ikezawa, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   128 ( 5 ) 198 - 202  2008

    　View Summary

    Among few existing applications of Microstructured Optical Fibers, a new device for measurement of low gas concentration was designed. Developed set-up based on a Photonic Bandgap Fiber (PBGF), which was used as a gas cell. Proposed technique allowed reducing gas sample volume to 0.01 cc. The gas flow inside core of fiber was simulated and result was confirmed experimentally. During the experimental work several types of fibers of various parameters were specially designed, produced and used. Core diameters ranged from 10.9 μm to 700 μm. Various cutting techniques for fibers were investigated. © 2008 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Sensing Technique Using Laser-induced Breakdown Spectroscopy Integrated with Micro-droplet Ejection System

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawlat, Toshitsugu Ueda

    Sensors and Transducers Journal, Special Issue on Modern Sensing Technologies,   Vol..90  2008

  • Fabrication of Photonic Bandgap Fiber Gas Cell using Focused Ion Beam Cutting Technique

    Xuefeng Li, Joanna Pawlat, Jinxing Liang, G. Xu, Toshitsugu Ueda

    The 21st International Microprocesses and Nanotechnology Conference, JAL Resort Sea Hawk Hotel Fukuoka, Japan     29D  2008

  • Distortion Correction and Local Deblurring for Distorted and Blurred Images Projected from Two-dimensional Object

    Yupeng Zhang, Ikumi Minema, Toshitsugu Ueda

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa, Japan,     3 - 4  2008

  • A novel low-loss splice for photonic bandgap fiber gas sensor

    Xuefeng Li, Joanna Pawłat, Jinxing Liang, Toshitsugu Ueda

    Proceedings of IEEE Sensors     1289 - 1292  2008

    　View Summary

    This paper presents a novel low-loss splice between the Photonic bandgap fiber (PBGF) and conventional step index fiber, for making PBGFs more functional. The solidcore fiber is butt-coupled to a PBGF using a mechanical splice surrounded by the block. The gap between the butt-coupled fibers is the most important parameter for keeping good output coupling efficiency and allowing for gas diffusion. For achieving the small gap, a focused ion beam (FIB) milling technique was developed for getting clean fiber surface. The achieved gap is adjustable from 0 to 400ìm. And a typical value at the gap of 20μm was 1.6 dB. © 2008 IEEE.

    DOI

  • Ultratrace measurement using micro-droplet with gas-flow assistance in laser-induced breakdown Spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Yury Zimin, Joanna Pawłat, Toshitsugu Ueda

    Proceedings of IEEE Sensors     977 - 980  2008

    　View Summary

    A new setup for laser-induced breakdown spectroscopy (LIBS) is introduced. This setup was designed for high sensitive quantitative analysis using the ink-jet technology and gas-flow assistance. The setup presented here allowed precise detection of a micro-droplet for guiding it into a laser beam spot area. The micro-droplet ejection system created constant volume of sample liquid and taking advantage of liquid physical state
    density of the solution can be controlled accurately. That means the constant amount of media was maintained in a micro-droplet. This sampling system allowed generating small droplet (diameter 30 μm) confining the whole fixed volume of the sample material in the laser beam spot area (minimum beam spot diameter 53.2 μm), under the effects of any ambient gas. In this paper, the stability with practical use and improvement of detection limit for LIBS measurement is reported. © 2008 IEEE.

    DOI

  • Microstructured optic fiber cell sensor for low concentration gas measurement

    Joanna Pawłat, Xuefeng Li, Yura Zimin, Takahiro Matsuo, Toshitsugu Ueda, Tadashi Sugiyama

    Proceedings of IEEE Sensors     922 - 925  2008

    　View Summary

    A high-sensitivity, compact set-up, which enables the precise measurement of low concentration of gas, based on Microstructured Optic Fiber (MOF) was developed. Some of MOFs were designed especially for this research purpose and functioned as the gas cells of the apparatus during the spectroscopic measurements. Proposed technique allowed reducing the total size of the set-up (portability) and the gas sample volume to 0.01 cc. In the case of fibers' mass production, presented research project may lead to low cost, high-sensitivity and real-time measurement system. © 2008 IEEE.

    DOI

  • Application on Monte Carlo Method to X-ray Fluorescence Meter

    Koichi Harima, Toshitsugu Ueda

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa, Japan     451 - 454  2008

  • Photonic Bandgap Fiber Cell Sensor for Ammonia Gas Measurement

    Joanna Pawlat, Tadashi Sugiyama, Xuefeng Li, Takahiro Matsuo, Yura Zimin, Toshitsugu Ueda

    Proceedings of the 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa,     357 - 360  2008

  • Sensing System for LIBS Multiple Measurements of Trace Elements

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawlat, Toshitsugu Ueda

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa Japan     307 - 311  2008

  • GEOMETRICALLY DISTORTED IMAGE CORRECTION FOR SINGLE LENS USING DECIMAL NUMBER MAPPING

    Yupeng Zhang, Ikumi Minema, Toshitsugu Ueda

    The 10th IASTED International Conference SIGNAL AND IMAGE PROCESSING (SIP 2008), Kailua-Kona, HI, USA,     26 - 31  2008

  • Control of a Micro-Droplet for Laser-Induced Breakdown Spectroscopy Solution Measurement

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawlat, Toshitsugu Ueda

    The 4th International Conference Mechatronic Systems and Materials, Bialystok, Poland     210 - 211  2008

  • High-Precision Gas Sensor Based on Photonic Bandgap Fiber Cell

    Joanna Pawlat, Xuefeng Li, Tadashi Sugiyama, Takahiro Matsuo, Yurij Zimin, Toshitsugu Ueda

    The 4th International Conference Mechatronic Systems and Materials, Bialystok, Poland,     54 - 55  2008

  • DESIGN OF PHOTONIC BANDGAP FIBER CELL GAS SENSOR

    Joanna Pawlat, Tadashi Sugiyama, Xuefeng Li, Takahiro Matsuo, Yura Zimin, Toshitsugu Ueda

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University   ( (Poster Session(1) ) 261 - 264  2008

  • "STRESS FREE FLIP CHIP PACKAGED QUARTZ MEMS CAPACITIVE TILT SENSOR",

    Jinxing Liang, Toshitsugu Ueda

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University,   ( Poster Session(1) ) 166 - 169  2008

  • DIFFERENTIAL PLATINUM THIN FILM HYDROGEN GAS SENSOR FABRICATED BY MEMS TECHNIQUES

    Daisuke Yamazaki, Lin Zhang, Joanna Pawlat, Toshitsugu Ueda

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University, pp.(132-135), 22-25   ( Oral Session(3) ) 132 - 135  2008

  • Gas sensor based on PBG fiber-possibilities and limitations

    Joanna Pawlat, Takahiro Matsuo, Xuefeng Li, Tadashi Suglyama, Toshitsugu Ueda

    19TH INTERNATIONAL CONFERENCE ON OPTICAL FIBRE SENSORS, PTS 1 AND 2   7004  2008

    　View Summary

    The Photonic Pandgap fiber was proposed as a new alternative for traditional glass-made gas cell used in spectroscopic measurements. Several PBG fibers were specially designed and produced for performed experiments. Gas flow within fiber was simulated and measured and ppm concentrations of ammonia gas were detected with short lengths of fiber. Final goal of the project is to produce portable and compact device for fast, ppb range rneasurement. Additionally, several fiber cutting methods were tested.

    DOI

  • Case Analysis Oriented Interpolation and a Two-Step Interpolation after Correction of Barrel Distortion and Lateral Chromatic Aberration

    Yupeng Zhang, Ikumi Minema, Toshitsugu Ueda

    , IEEJ Transactions on Sensors and Micromachines   Vol.128 ( No.11 )  2008

    DOI

  • Thermo-resistive platinum thin film hydrogen gas sensor fabricated by MEMS techniques

    Daisuke Yamazaki, Lin Zhang, Joanna Pawlat, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   128 ( 9 ) 1 - 351  2008

    　View Summary

    Thermo-resistive platinum(Pt) thin film sensor was produced using Micro Electro Mechanical Systems (MEMS) fabrication techniques. The sensor design incorporated resistor elements that would facilitate the temperature-resistance characteristics and mechanisms of Pt based thin film thermo-resistors. The sensor was fabricated with lift-off process that allowed the dual sensing surface area. Furthermore, the dual sensing surfaces ensured faster response to hydrogen gas. To increase the catalytic reaction comparing with at the room temperature, the sensor was heated to a specified temperature by applying the current to a Pt thin film. The catalytic reaction took place when the heated sensor came into the contact with hydrogen. Additionally, the differential Pt thin film hydrogen gas sensor was also developed. This gas sensor was able to compensate the changes in the external environment such as temperature, moisture, etc. The fabricated hydrogen sensor detected the concentration of hydrogen gas in air from 2% to 9%. © 2008 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Improvement of a micro-droplet guiding technique for laser-induced breakdown spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawłat, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   128 ( 7 ) 1 - 301  2008

    　View Summary

    A new and reliable set-up for laser-induced breakdown spectroscopy (LIBS) which enabled the precise micro-droplet observation and guiding the solution samples into a laser beam spot area was designed. The method presented here allowed micronizing of the liquid sample confining the whole volume of the sample in the laser beam spot area (minimum beam spot diameter 53.2um, micro-droplet diameter 30-40μm), separating it from its surroundings. As a result, LIBS with the micro-drop ejection system produced greater intensities than the old technique of bulk-liquid measurement based on data from 100 laser pulse shots. Advantages of this method were: strong emissions, no sample splashing, solution density controllability and ho chemical denaturation. This experimental set-up helped to overcome the disadvantage of LIBS with a micro-drop ejection system. © 2008 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Low concentration gas measurement using Photonic Bandgap Fiber cell sensor

    Joanna Pawłat, Tadashi Sugiyama, Xuefeng Li, Takahiro Matsuo, Satoshi Ikezawa, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   128 ( 5 ) 198 - 202  2008

    　View Summary

    Among few existing applications of Microstructured Optical Fibers, a new device for measurement of low gas concentration was designed. Developed set-up based on a Photonic Bandgap Fiber (PBGF), which was used as a gas cell. Proposed technique allowed reducing gas sample volume to 0.01 cc. The gas flow inside core of fiber was simulated and result was confirmed experimentally. During the experimental work several types of fibers of various parameters were specially designed, produced and used. Core diameters ranged from 10.9 μm to 700 μm. Various cutting techniques for fibers were investigated. © 2008 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Sensing Technique Using Laser-induced Breakdown Spectroscopy Integrated with Micro-droplet Ejection System

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawlat, Toshitsugu Ueda

    Sensors and Transducers Journal, Special Issue on Modern Sensing Technologies,   Vol..90  2008

  • Fabrication of Photonic Bandgap Fiber Gas Cell using Focused Ion Beam Cutting Technique

    Xuefeng Li, Joanna Pawlat, Jinxing Liang, G. Xu, Toshitsugu Ueda

    The 21st International Microprocesses and Nanotechnology Conference, JAL Resort Sea Hawk Hotel Fukuoka, Japan     29D  2008

  • Distortion Correction and Local Deblurring for Distorted and Blurred Images Projected from Two-dimensional Object

    Yupeng Zhang, Ikumi Minema, Toshitsugu Ueda

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa, Japan,     3 - 4  2008

  • A novel low-loss splice for photonic bandgap fiber gas sensor

    Xuefeng Li, Joanna Pawłat, Jinxing Liang, Toshitsugu Ueda

    Proceedings of IEEE Sensors     1289 - 1292  2008

    　View Summary

    This paper presents a novel low-loss splice between the Photonic bandgap fiber (PBGF) and conventional step index fiber, for making PBGFs more functional. The solidcore fiber is butt-coupled to a PBGF using a mechanical splice surrounded by the block. The gap between the butt-coupled fibers is the most important parameter for keeping good output coupling efficiency and allowing for gas diffusion. For achieving the small gap, a focused ion beam (FIB) milling technique was developed for getting clean fiber surface. The achieved gap is adjustable from 0 to 400ìm. And a typical value at the gap of 20μm was 1.6 dB. © 2008 IEEE.

    DOI

  • Ultratrace measurement using micro-droplet with gas-flow assistance in laser-induced breakdown Spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Yury Zimin, Joanna Pawłat, Toshitsugu Ueda

    Proceedings of IEEE Sensors     977 - 980  2008

    　View Summary

    A new setup for laser-induced breakdown spectroscopy (LIBS) is introduced. This setup was designed for high sensitive quantitative analysis using the ink-jet technology and gas-flow assistance. The setup presented here allowed precise detection of a micro-droplet for guiding it into a laser beam spot area. The micro-droplet ejection system created constant volume of sample liquid and taking advantage of liquid physical state
    density of the solution can be controlled accurately. That means the constant amount of media was maintained in a micro-droplet. This sampling system allowed generating small droplet (diameter 30 μm) confining the whole fixed volume of the sample material in the laser beam spot area (minimum beam spot diameter 53.2 μm), under the effects of any ambient gas. In this paper, the stability with practical use and improvement of detection limit for LIBS measurement is reported. © 2008 IEEE.

    DOI

  • Microstructured optic fiber cell sensor for low concentration gas measurement

    Joanna Pawłat, Xuefeng Li, Yura Zimin, Takahiro Matsuo, Toshitsugu Ueda, Tadashi Sugiyama

    Proceedings of IEEE Sensors     922 - 925  2008

    　View Summary

    A high-sensitivity, compact set-up, which enables the precise measurement of low concentration of gas, based on Microstructured Optic Fiber (MOF) was developed. Some of MOFs were designed especially for this research purpose and functioned as the gas cells of the apparatus during the spectroscopic measurements. Proposed technique allowed reducing the total size of the set-up (portability) and the gas sample volume to 0.01 cc. In the case of fibers' mass production, presented research project may lead to low cost, high-sensitivity and real-time measurement system. © 2008 IEEE.

    DOI

  • Application on Monte Carlo Method to X-ray Fluorescence Meter

    Koichi Harima, Toshitsugu Ueda

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa, Japan     451 - 454  2008

  • Photonic Bandgap Fiber Cell Sensor for Ammonia Gas Measurement

    Joanna Pawlat, Tadashi Sugiyama, Xuefeng Li, Takahiro Matsuo, Yura Zimin, Toshitsugu Ueda

    Proceedings of the 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa,     357 - 360  2008

  • Sensing System for LIBS Multiple Measurements of Trace Elements

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawlat, Toshitsugu Ueda

    The 25th Sensor Symposium on Sensors, Micromachines and Applied System, Okinawa Japan     307 - 311  2008

  • GEOMETRICALLY DISTORTED IMAGE CORRECTION FOR SINGLE LENS USING DECIMAL NUMBER MAPPING

    Yupeng Zhang, Ikumi Minema, Toshitsugu Ueda

    The 10th IASTED International Conference SIGNAL AND IMAGE PROCESSING (SIP 2008), Kailua-Kona, HI, USA,     26 - 31  2008

  • Control of a Micro-Droplet for Laser-Induced Breakdown Spectroscopy Solution Measurement

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawlat, Toshitsugu Ueda

    The 4th International Conference Mechatronic Systems and Materials, Bialystok, Poland     210 - 211  2008

  • High-Precision Gas Sensor Based on Photonic Bandgap Fiber Cell

    Joanna Pawlat, Xuefeng Li, Tadashi Sugiyama, Takahiro Matsuo, Yurij Zimin, Toshitsugu Ueda

    The 4th International Conference Mechatronic Systems and Materials, Bialystok, Poland,     54 - 55  2008

  • DESIGN OF PHOTONIC BANDGAP FIBER CELL GAS SENSOR

    Joanna Pawlat, Tadashi Sugiyama, Xuefeng Li, Takahiro Matsuo, Yura Zimin, Toshitsugu Ueda

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University   ( (Poster Session(1) ) 261 - 264  2008

  • "STRESS FREE FLIP CHIP PACKAGED QUARTZ MEMS CAPACITIVE TILT SENSOR",

    Jinxing Liang, Toshitsugu Ueda

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University,   ( Poster Session(1) ) 166 - 169  2008

  • DIFFERENTIAL PLATINUM THIN FILM HYDROGEN GAS SENSOR FABRICATED BY MEMS TECHNIQUES

    Daisuke Yamazaki, Lin Zhang, Joanna Pawlat, Toshitsugu Ueda

    The 4th Asia Pacific Conference on Transducers and Micro/Nano Technologies, Tainan, Taiwan, National Cheng Kung University, pp.(132-135), 22-25   ( Oral Session(3) ) 132 - 135  2008

  • Gas sensor based on PBG fiber-possibilities and limitations

    Joanna Pawlat, Takahiro Matsuo, Xuefeng Li, Tadashi Suglyama, Toshitsugu Ueda

    19TH INTERNATIONAL CONFERENCE ON OPTICAL FIBRE SENSORS, PTS 1 AND 2   7004  2008

    　View Summary

    The Photonic Pandgap fiber was proposed as a new alternative for traditional glass-made gas cell used in spectroscopic measurements. Several PBG fibers were specially designed and produced for performed experiments. Gas flow within fiber was simulated and measured and ppm concentrations of ammonia gas were detected with short lengths of fiber. Final goal of the project is to produce portable and compact device for fast, ppb range rneasurement. Additionally, several fiber cutting methods were tested.

    DOI

  • Case Analysis Oriented Interpolation and a Two-Step Interpolation after Correction of Barrel Distortion and Lateral Chromatic Aberration

    Yupeng Zhang, Ikumi Minema, Toshitsugu Ueda

    , IEEJ Transactions on Sensors and Micromachines   Vol.128 ( No.11 )  2008

    DOI

  • Thermo-resistive platinum thin film hydrogen gas sensor fabricated by MEMS techniques

    Daisuke Yamazaki, Lin Zhang, Joanna Pawlat, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   128 ( 9 ) 1 - 351  2008

    　View Summary

    Thermo-resistive platinum(Pt) thin film sensor was produced using Micro Electro Mechanical Systems (MEMS) fabrication techniques. The sensor design incorporated resistor elements that would facilitate the temperature-resistance characteristics and mechanisms of Pt based thin film thermo-resistors. The sensor was fabricated with lift-off process that allowed the dual sensing surface area. Furthermore, the dual sensing surfaces ensured faster response to hydrogen gas. To increase the catalytic reaction comparing with at the room temperature, the sensor was heated to a specified temperature by applying the current to a Pt thin film. The catalytic reaction took place when the heated sensor came into the contact with hydrogen. Additionally, the differential Pt thin film hydrogen gas sensor was also developed. This gas sensor was able to compensate the changes in the external environment such as temperature, moisture, etc. The fabricated hydrogen sensor detected the concentration of hydrogen gas in air from 2% to 9%. © 2008 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Improvement of a micro-droplet guiding technique for laser-induced breakdown spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawłat, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   128 ( 7 ) 1 - 301  2008

    　View Summary

    A new and reliable set-up for laser-induced breakdown spectroscopy (LIBS) which enabled the precise micro-droplet observation and guiding the solution samples into a laser beam spot area was designed. The method presented here allowed micronizing of the liquid sample confining the whole volume of the sample in the laser beam spot area (minimum beam spot diameter 53.2um, micro-droplet diameter 30-40μm), separating it from its surroundings. As a result, LIBS with the micro-drop ejection system produced greater intensities than the old technique of bulk-liquid measurement based on data from 100 laser pulse shots. Advantages of this method were: strong emissions, no sample splashing, solution density controllability and ho chemical denaturation. This experimental set-up helped to overcome the disadvantage of LIBS with a micro-drop ejection system. © 2008 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Low concentration gas measurement using Photonic Bandgap Fiber cell sensor

    Joanna Pawłat, Tadashi Sugiyama, Xuefeng Li, Takahiro Matsuo, Satoshi Ikezawa, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   128 ( 5 ) 198 - 202  2008

    　View Summary

    Among few existing applications of Microstructured Optical Fibers, a new device for measurement of low gas concentration was designed. Developed set-up based on a Photonic Bandgap Fiber (PBGF), which was used as a gas cell. Proposed technique allowed reducing gas sample volume to 0.01 cc. The gas flow inside core of fiber was simulated and result was confirmed experimentally. During the experimental work several types of fibers of various parameters were specially designed, produced and used. Core diameters ranged from 10.9 μm to 700 μm. Various cutting techniques for fibers were investigated. © 2008 The Institute of Electrical Engineers of Japan.

    DOI CiNii

  • Sensing Technique Using Laser-induced Breakdown Spectroscopy Integrated with Micro-droplet Ejection System

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Pawlat, Toshitsugu Ueda

    Sensors and Transducers Journal, Special Issue on Modern Sensing Technologies,   Vol..90  2008

  • Development of a source-drain electrode coated with an insulation layer for detecting concentration changes in a nitrate ion solution

    T. Isoda, H. Makimoto, H. Imanaga, R. Imamura, J. Pawlat, T. Ueda

    SENSORS AND ACTUATORS B-CHEMICAL   123 ( 2 ) 805 - 815  2007.05

    　View Summary

    A chip-mounted source-drain electrode coated with an insulator layer was investigated with respect to its ability for monitoring in a concentrated nitrate ion solution. Exposing the electrode surface to highly concentrated nitrate ion solutions resulted in an increase in the detection voltage, while weakly concentrated solutions caused the detection voltage to decrease. Semi-circular shaped microelectrodes consisted of an Au/Cr film of 1/0. 1 1.mu m thickness on a class chip, constructed using photolithography. A novolac resin or fluoro-olefin vinyl ether copolymer was used as the precursor of an insulator layer on the source-drain electrode. NaNO3 solutions of 1.0 x 10(-6) to 1.0 mol 1(-1) (1 mu l) were applied to the insulated electrode. and the chemical sensitivity was evaluated by measuring the detection voltage. The effects of thickness, insulator type, solution, and sensor material, on the chemical sensitivity were investigated. For a novolac resin insulator layer of thickness &lt; 2.5 mu m, the sensor voltage was noticeably unstable, whereas a thicker insulator layer (&gt; 5 Rm) resulted in a sensor voltage that showed a linear response depending on the NaNO3 concentration in the range of 1.0 x 10-6 to 1.0 x 10(-3) mol 1(-1). The responsiveness of the sensor was improved with increasing insulator layer thickness. Optimization of the insulator thickness is therefore necessary if an effective sensor is to be realized. Sensor detection was also effected by the kind of solution and electrode material. The placing of a liquid droplet on the insulator surface resulted in the formation of an electric double layer at the boundary surface. Here, the molecules within the insulator become polarized, and a charge is formed at the boundary surface between the liquid and solid, and on the reverse side of the insulator. In this case, the relationship between the source-drain electrode current and the sensor voltage follows Ohm's law. Based on this principle, a source-drain electrode produces a signal in response to changes in current originating from polarization of the insulator layer. (C) 2006 Elsevier B.V. All rights reserved.

    DOI CiNii

  • Development of a source-drain electrode coated with an insulation layer for detecting concentration changes in a nitrate ion solution

    T. Isoda, H. Makimoto, H. Imanaga, R. Imamura, J. Pawlat, T. Ueda

    SENSORS AND ACTUATORS B-CHEMICAL   123 ( 2 ) 805 - 815  2007.05

    　View Summary

    A chip-mounted source-drain electrode coated with an insulator layer was investigated with respect to its ability for monitoring in a concentrated nitrate ion solution. Exposing the electrode surface to highly concentrated nitrate ion solutions resulted in an increase in the detection voltage, while weakly concentrated solutions caused the detection voltage to decrease. Semi-circular shaped microelectrodes consisted of an Au/Cr film of 1/0. 1 1.mu m thickness on a class chip, constructed using photolithography. A novolac resin or fluoro-olefin vinyl ether copolymer was used as the precursor of an insulator layer on the source-drain electrode. NaNO3 solutions of 1.0 x 10(-6) to 1.0 mol 1(-1) (1 mu l) were applied to the insulated electrode. and the chemical sensitivity was evaluated by measuring the detection voltage. The effects of thickness, insulator type, solution, and sensor material, on the chemical sensitivity were investigated. For a novolac resin insulator layer of thickness &lt; 2.5 mu m, the sensor voltage was noticeably unstable, whereas a thicker insulator layer (&gt; 5 Rm) resulted in a sensor voltage that showed a linear response depending on the NaNO3 concentration in the range of 1.0 x 10-6 to 1.0 x 10(-3) mol 1(-1). The responsiveness of the sensor was improved with increasing insulator layer thickness. Optimization of the insulator thickness is therefore necessary if an effective sensor is to be realized. Sensor detection was also effected by the kind of solution and electrode material. The placing of a liquid droplet on the insulator surface resulted in the formation of an electric double layer at the boundary surface. Here, the molecules within the insulator become polarized, and a charge is formed at the boundary surface between the liquid and solid, and on the reverse side of the insulator. In this case, the relationship between the source-drain electrode current and the sensor voltage follows Ohm's law. Based on this principle, a source-drain electrode produces a signal in response to changes in current originating from polarization of the insulator layer. (C) 2006 Elsevier B.V. All rights reserved.

    DOI CiNii

  • Development of a source-drain electrode coated with an insulation layer for detecting concentration changes in a nitrate ion solution

    T. Isoda, H. Makimoto, H. Imanaga, R. Imamura, J. Pawlat, T. Ueda

    SENSORS AND ACTUATORS B-CHEMICAL   123 ( 2 ) 805 - 815  2007.05

    　View Summary

    A chip-mounted source-drain electrode coated with an insulator layer was investigated with respect to its ability for monitoring in a concentrated nitrate ion solution. Exposing the electrode surface to highly concentrated nitrate ion solutions resulted in an increase in the detection voltage, while weakly concentrated solutions caused the detection voltage to decrease. Semi-circular shaped microelectrodes consisted of an Au/Cr film of 1/0. 1 1.mu m thickness on a class chip, constructed using photolithography. A novolac resin or fluoro-olefin vinyl ether copolymer was used as the precursor of an insulator layer on the source-drain electrode. NaNO3 solutions of 1.0 x 10(-6) to 1.0 mol 1(-1) (1 mu l) were applied to the insulated electrode. and the chemical sensitivity was evaluated by measuring the detection voltage. The effects of thickness, insulator type, solution, and sensor material, on the chemical sensitivity were investigated. For a novolac resin insulator layer of thickness &lt; 2.5 mu m, the sensor voltage was noticeably unstable, whereas a thicker insulator layer (&gt; 5 Rm) resulted in a sensor voltage that showed a linear response depending on the NaNO3 concentration in the range of 1.0 x 10-6 to 1.0 x 10(-3) mol 1(-1). The responsiveness of the sensor was improved with increasing insulator layer thickness. Optimization of the insulator thickness is therefore necessary if an effective sensor is to be realized. Sensor detection was also effected by the kind of solution and electrode material. The placing of a liquid droplet on the insulator surface resulted in the formation of an electric double layer at the boundary surface. Here, the molecules within the insulator become polarized, and a charge is formed at the boundary surface between the liquid and solid, and on the reverse side of the insulator. In this case, the relationship between the source-drain electrode current and the sensor voltage follows Ohm's law. Based on this principle, a source-drain electrode produces a signal in response to changes in current originating from polarization of the insulator layer. (C) 2006 Elsevier B.V. All rights reserved.

    DOI CiNii

  • Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Paw?at and Toshitsugu Ueda

    Evaluation of, Laser-Induced Breakdown Spectroscopy Quantitative Sensing Performance Using a Micro-droplet Ejection System

    IEEE SENSORS 2007 Conference    2007

  • Application on Monte Carlo Method to X-ray Fluorescence Analysis

    Koichi Harima, Noboru Iwasaki, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Case Analysis Oriented Interpolation and a Two-step Interpolation after Correction of Barrel Distortion and Lateral Chromatic Aberration

    Yupeng Zhang, Ikumi Minema, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Thermo-resistive Platinum Thin Film Hydrogen Gas Sensor Fabricated by MEMS Techniques

    Daisuke Yamazaki, Lin Zhang, Joanna Pawlat, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Fabrication of Two-axis Quartz MEMS-based Capacitive Tilt Sensor

    JJinxing Liang, Takahiro Matsuo, Fusao Kohsaka, Xuefeng Li, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Tilt Sensor System Using MEMS Device and CMOS Technology

    Takahiro MATSUO, Jinxing LIANG, Fusao KOHSAKA, Toyoki TAGUCHI, Toshitsugu UEDA

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Low Concentration Gas Measurement Using Photonic Bandgap Fiber Cell Sensor

    Joanna Paw?at, Tadashi Sugiyama, Xuefeng Li, Takahiro Matsuo, Satoshi Ikezawa, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Improvement of a Micro-Droplet Guiding Technique for Laser-Induced Breakdown Spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Paw?at, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Paw?at and Toshitsugu Ueda

    Evaluation of, Laser-Induced Breakdown Spectroscopy Quantitative Sensing Performance Using a Micro-droplet Ejection System

    IEEE SENSORS 2007 Conference    2007

  • Application on Monte Carlo Method to X-ray Fluorescence Analysis

    Koichi Harima, Noboru Iwasaki, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Case Analysis Oriented Interpolation and a Two-step Interpolation after Correction of Barrel Distortion and Lateral Chromatic Aberration

    Yupeng Zhang, Ikumi Minema, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Thermo-resistive Platinum Thin Film Hydrogen Gas Sensor Fabricated by MEMS Techniques

    Daisuke Yamazaki, Lin Zhang, Joanna Pawlat, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Fabrication of Two-axis Quartz MEMS-based Capacitive Tilt Sensor

    JJinxing Liang, Takahiro Matsuo, Fusao Kohsaka, Xuefeng Li, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Tilt Sensor System Using MEMS Device and CMOS Technology

    Takahiro MATSUO, Jinxing LIANG, Fusao KOHSAKA, Toyoki TAGUCHI, Toshitsugu UEDA

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Low Concentration Gas Measurement Using Photonic Bandgap Fiber Cell Sensor

    Joanna Paw?at, Tadashi Sugiyama, Xuefeng Li, Takahiro Matsuo, Satoshi Ikezawa, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Improvement of a Micro-Droplet Guiding Technique for Laser-Induced Breakdown Spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Paw?at, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • High sensitive tilt sensor for quartz micromachining

    Fusao Kohsaka, Jinxing Liang, Takahiro Matsuo, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   127 ( 10 ) 2 - 436  2007

    　View Summary

    Many kinds of tilt sensors have been developed and applied to the field of tilt angle measurement. However, the improvement of a"Size", "Cost","Operability" and other"Performances" is expected. On the other hand, the high performance acceleration sensors were developed by MEMS technology, but there is almost no high sensitive MEMS sensor that detects a minute gravity change. We examined the possibility of development of tilt sensor fabricated by quartz crystal anisotropic-etching technology which is suitable for mass production. The developed tilt sensor is constructed of"Beam spring","Moving element" and"Capacitive detector of comb electrode". The feature of this sensor is that sensor chip is placed horizontally, and this arrangement enables fabrication of"Two axes sensor" on one wafer chip. We developed quartz tilt sensor using our laboratory fabrication process. Size of sensor chip is 5×5×0.1 mm3, and the evaluation result showed the highest level performance of 0.0001 degree resolution. © 2007 The Institute of Electrical Engineers of Japan.

    DOI

  • Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Paw?at and Toshitsugu Ueda

    Evaluation of, Laser-Induced Breakdown Spectroscopy Quantitative Sensing Performance Using a Micro-droplet Ejection System

    IEEE SENSORS 2007 Conference    2007

  • Application on Monte Carlo Method to X-ray Fluorescence Analysis

    Koichi Harima, Noboru Iwasaki, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Case Analysis Oriented Interpolation and a Two-step Interpolation after Correction of Barrel Distortion and Lateral Chromatic Aberration

    Yupeng Zhang, Ikumi Minema, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Thermo-resistive Platinum Thin Film Hydrogen Gas Sensor Fabricated by MEMS Techniques

    Daisuke Yamazaki, Lin Zhang, Joanna Pawlat, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Fabrication of Two-axis Quartz MEMS-based Capacitive Tilt Sensor

    JJinxing Liang, Takahiro Matsuo, Fusao Kohsaka, Xuefeng Li, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Tilt Sensor System Using MEMS Device and CMOS Technology

    Takahiro MATSUO, Jinxing LIANG, Fusao KOHSAKA, Toyoki TAGUCHI, Toshitsugu UEDA

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Low Concentration Gas Measurement Using Photonic Bandgap Fiber Cell Sensor

    Joanna Paw?at, Tadashi Sugiyama, Xuefeng Li, Takahiro Matsuo, Satoshi Ikezawa, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Improvement of a Micro-Droplet Guiding Technique for Laser-Induced Breakdown Spectroscopy

    Satoshi Ikezawa, Muneaki Wakamatsu, Joanna Paw?at, Toshitsugu Ueda

    PROCEEDINGS OF THE 24th SENSOR SYMPOSIUM    2007

  • Particle Element and Size Simultaneous Measurement Using LIBS

    WAKAMATSU Muneaki, IKEZAWA Satoshi, UEDA Toshitsugu

    The Journal of the Institute of Electrical Engineers of Japan   127 ( 9 ) 397 - 402  2007

    　View Summary

    We have developed high-sensitivity in-situ measurement technology based on photons with visible to ultraviolet wavelength bands. This measurement technology builds on plasmatizing particles technology and a high-sensitivity measurement technology for measuring photons from the plasma. Thus, we have established a technology for measuring particle sizes and the constituent element content of particles with 10% accuracy.

    DOI CiNii

  • Development of Solution Measurement Using Laser-Induced Breakdown Spectroscopy Integrated with Micro-Droplet Ejection System

    IKEZAWA Satoshi, WAKAMATSU Muneaki, UEDA Toshitsugu

    The Journal of the Institute of Electrical Engineers of Japan   127 ( 7 ) 343 - 346  2007

    　View Summary

    The laser-induced breakdown spectroscopy (LIBS) using micro-droplet sodium chloride solution is presented. Since the 1980s, many liquid miniaturizations of analytical technique for LIBS measurements were reported. The method we present allowed micronizing the sample in such a way that whole volume of a sample was confined in the laser beam spot area (minimum beam spot diameter 53.2μm, microdroplet diameter 50-60μm) and was separated from its surrounding condition. If the sample's physical state was liquid, the density of solution could be controlled as needed. In this paper, originally designed ink-jet system for sampling procedure was presented. According to the new method, improved sensitivity for drawing calibration curves with the aim of the LIBS quantitative measurement were obtained.

    DOI CiNii

  • Wet Etched High Aspect Ratio Microstructures on Quartz for MEMS Applications

    LIANG Jinxing, KOHSAKA Fusao, MATSUO Takahiro, UEDA Toshitsugu

    The Journal of the Institute of Electrical Engineers of Japan   127 ( 7 ) 337 - 342  2007

    　View Summary

    Z cut α-quartz wafers were etched in saturated ammonium bifluoride solution at 87 degrees C. The side wall profiles were observed using the scanning electron microscopy (SEM) and plotted dependent on the polar direction. This research focused on investigating high aspect ratio trench and through-hole, which were dependent on the polar direction to the crystal axis. Aspect ratio in dependence on polar direction was also plotted and microchannels with aspect ratio > 3 could be achieved at the polar angle between 30° to 60°. The possibility of application for microcapillary was discussed, and the trench at 45° was considered best. Double-sided etching technique was used for manufacturing through-hole structures. Through-hole at 0° was demonstrated effective for fabrication of capacitive MEMS tilt sensor. Through-holes at 15° and 105° were proposed for fabrication of 90°-arranged two axis capactive tilt sensor, taking advantage of the twofold symmetry property around X axis and threefold symmetry property around Z axis.

    DOI CiNii

  • Particle Element and Size Simultaneous Measurement Using LIBS

    WAKAMATSU Muneaki, IKEZAWA Satoshi, UEDA Toshitsugu

    The Journal of the Institute of Electrical Engineers of Japan   127 ( 9 ) 397 - 402  2007

    　View Summary

    We have developed high-sensitivity in-situ measurement technology based on photons with visible to ultraviolet wavelength bands. This measurement technology builds on plasmatizing particles technology and a high-sensitivity measurement technology for measuring photons from the plasma. Thus, we have established a technology for measuring particle sizes and the constituent element content of particles with 10% accuracy.

    DOI CiNii

  • Development of Solution Measurement Using Laser-Induced Breakdown Spectroscopy Integrated with Micro-Droplet Ejection System

    IKEZAWA Satoshi, WAKAMATSU Muneaki, UEDA Toshitsugu

    The Journal of the Institute of Electrical Engineers of Japan   127 ( 7 ) 343 - 346  2007

    　View Summary

    The laser-induced breakdown spectroscopy (LIBS) using micro-droplet sodium chloride solution is presented. Since the 1980s, many liquid miniaturizations of analytical technique for LIBS measurements were reported. The method we present allowed micronizing the sample in such a way that whole volume of a sample was confined in the laser beam spot area (minimum beam spot diameter 53.2μm, microdroplet diameter 50-60μm) and was separated from its surrounding condition. If the sample's physical state was liquid, the density of solution could be controlled as needed. In this paper, originally designed ink-jet system for sampling procedure was presented. According to the new method, improved sensitivity for drawing calibration curves with the aim of the LIBS quantitative measurement were obtained.

    DOI CiNii

  • Wet Etched High Aspect Ratio Microstructures on Quartz for MEMS Applications

    LIANG Jinxing, KOHSAKA Fusao, MATSUO Takahiro, UEDA Toshitsugu

    The Journal of the Institute of Electrical Engineers of Japan   127 ( 7 ) 337 - 342  2007

    　View Summary

    Z cut α-quartz wafers were etched in saturated ammonium bifluoride solution at 87 degrees C. The side wall profiles were observed using the scanning electron microscopy (SEM) and plotted dependent on the polar direction. This research focused on investigating high aspect ratio trench and through-hole, which were dependent on the polar direction to the crystal axis. Aspect ratio in dependence on polar direction was also plotted and microchannels with aspect ratio > 3 could be achieved at the polar angle between 30° to 60°. The possibility of application for microcapillary was discussed, and the trench at 45° was considered best. Double-sided etching technique was used for manufacturing through-hole structures. Through-hole at 0° was demonstrated effective for fabrication of capacitive MEMS tilt sensor. Through-holes at 15° and 105° were proposed for fabrication of 90°-arranged two axis capactive tilt sensor, taking advantage of the twofold symmetry property around X axis and threefold symmetry property around Z axis.

    DOI CiNii

  • Particle Element and Size Stimutaneous Measurement Using LIBS

    Muneaki WAKAMATSU, Satoshi Ikezawa, Toshitsugu UEDA

    IEEJ Trana. SM   127 ( 9 ) 397 - 402  2007

    　View Summary

    We have developed high-sensitivity in-situ measurement technology based on photons with visible to ultraviolet wavelength bands. This measurement technology builds on plasmatizing particles technology and a high-sensitivity measurement technology for measuring photons from the plasma. Thus, we have established a technology for measuring particle sizes and the constituent element content of particles with 10% accuracy.

    DOI CiNii

  • Development of Solution Measurement Using Laser-Induced Breakdown Spectroscopy Integrated with Micro-Droplet Ejection System

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    IEEJ Trana. SM   127 ( 7 ) 343 - 346  2007

    　View Summary

    The laser-induced breakdown spectroscopy (LIBS) using micro-droplet sodium chloride solution is presented. Since the 1980s, many liquid miniaturizations of analytical technique for LIBS measurements were reported. The method we present allowed micronizing the sample in such a way that whole volume of a sample was confined in the laser beam spot area (minimum beam spot diameter 53.2μm, microdroplet diameter 50-60μm) and was separated from its surrounding condition. If the sample's physical state was liquid, the density of solution could be controlled as needed. In this paper, originally designed ink-jet system for sampling procedure was presented. According to the new method, improved sensitivity for drawing calibration curves with the aim of the LIBS quantitative measurement were obtained.

    DOI CiNii

  • Wet Etched High Aspect Ratio Microstructures on Quartz for MEMS Application

    Jinxing Liang, Fusao Kohsaka, Takahiro Matsuo, Toshitsugu Ueda

    IEEJ Trana. SM   127 ( 7 ) 337 - 342  2007

    　View Summary

    Z cut α-quartz wafers were etched in saturated ammonium bifluoride solution at 87 degrees C. The side wall profiles were observed using the scanning electron microscopy (SEM) and plotted dependent on the polar direction. This research focused on investigating high aspect ratio trench and through-hole, which were dependent on the polar direction to the crystal axis. Aspect ratio in dependence on polar direction was also plotted and microchannels with aspect ratio > 3 could be achieved at the polar angle between 30° to 60°. The possibility of application for microcapillary was discussed, and the trench at 45° was considered best. Double-sided etching technique was used for manufacturing through-hole structures. Through-hole at 0° was demonstrated effective for fabrication of capacitive MEMS tilt sensor. Through-holes at 15° and 105° were proposed for fabrication of 90°-arranged two axis capactive tilt sensor, taking advantage of the twofold symmetry property around X axis and threefold symmetry property around Z axis.

    DOI CiNii

  • A study on a diode-bridge type differential capacitance detection circuit

    Takahiro Matsuo, Joanna Pawlat, Jinxing Liang, Ken Kunitomo, Toshitsugu Ueda

    JOURNAL OF ADVANCED OXIDATION TECHNOLOGIES   9 ( 2 ) 156 - 159  2006.07

    　View Summary

    Differential capacitance sensor with movable electrodes is usually applied for accelerometers, pressure gauges, etc. because of its high sensitivity and resolution. Two axis inclination sensor with differential capacitance structure using MEMS (Micro Electro Mechanical Systems) technology has recently been designed for industrial and environmental purposes. The initial capacitance of the sensor should be very low, as few pF, therefore, a C-V converter circuit, which is able to detect very small capacitance variations is required. In this study, the particular principle of a "diode-bridge type differential capacitance detection circuit" has been analyzed. After the mathematical simulations performed by using PSpice simulator, the detection of the capacitance variations in fF order resolution are considered.

  • A study on a diode-bridge type differential capacitance detection circuit

    Takahiro Matsuo, Joanna Pawlat, Jinxing Liang, Ken Kunitomo, Toshitsugu Ueda

    JOURNAL OF ADVANCED OXIDATION TECHNOLOGIES   9 ( 2 ) 156 - 159  2006.07

    　View Summary

    Differential capacitance sensor with movable electrodes is usually applied for accelerometers, pressure gauges, etc. because of its high sensitivity and resolution. Two axis inclination sensor with differential capacitance structure using MEMS (Micro Electro Mechanical Systems) technology has recently been designed for industrial and environmental purposes. The initial capacitance of the sensor should be very low, as few pF, therefore, a C-V converter circuit, which is able to detect very small capacitance variations is required. In this study, the particular principle of a "diode-bridge type differential capacitance detection circuit" has been analyzed. After the mathematical simulations performed by using PSpice simulator, the detection of the capacitance variations in fF order resolution are considered.

  • A study on a diode-bridge type differential capacitance detection circuit

    Takahiro Matsuo, Joanna Pawlat, Jinxing Liang, Ken Kunitomo, Toshitsugu Ueda

    JOURNAL OF ADVANCED OXIDATION TECHNOLOGIES   9 ( 2 ) 156 - 159  2006.07

    　View Summary

    Differential capacitance sensor with movable electrodes is usually applied for accelerometers, pressure gauges, etc. because of its high sensitivity and resolution. Two axis inclination sensor with differential capacitance structure using MEMS (Micro Electro Mechanical Systems) technology has recently been designed for industrial and environmental purposes. The initial capacitance of the sensor should be very low, as few pF, therefore, a C-V converter circuit, which is able to detect very small capacitance variations is required. In this study, the particular principle of a "diode-bridge type differential capacitance detection circuit" has been analyzed. After the mathematical simulations performed by using PSpice simulator, the detection of the capacitance variations in fF order resolution are considered.

  • Deep wet etching of Z cut quartz wafer for MEMS applications

    Jinxing Liang, Fusao Kohsaka, Takahiro Matsuo, Toshitsugu Ueda

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM     31 - 35  2006

  • High Frequency Drive of a Diode-bridge Type Differential Capacitance Detection Circuit

    Takahiro MATSUO, Jinxing LIANG, Joanna PAWLAT, Toshitsugu UEDA

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM     287 - 290  2006

  • PHOTONIC BANDGAP FIBER IN LOW CONCETRATION MEASUREMENT

    Joanna Paw?at, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    10th International Symposium on High Pressure Low Temperature Plasma Chemistry , eptember 4-8     359 - 362  2006

  • Photonic bandgap fiber for a sensing device

    Joanna Paw?at, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM     329 - 333  2006

  • Absolute Calibration Technique using Micro-Droplet Ejection System for Enhancement of LIBS Quantitative Analysis

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    ”, PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM     362 - 365  2006

  • Particle Element and Size Measurement Using LIBS(2006)

    Muneaki WAKAMATSU, Satoshi Ikezawa, Toshitsugu UEDA

    , PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM,     356 - 361  2006

  • PHTONIC BANDGAP FIBER IN LOW CONCENTRATION GAS MEASUREMENT

    Joanna Pawlat, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    The First European Symposium on Plasma Chemist, May 28-30, (Poland)    2006

  • A novel lift off process and its application for capacitive tilt sensor

    Jinxing Liang, Fusao Kohsaka, Takahiro Matsuo, Toshitsugu Ueda

    2006 IEEE SENSORS, VOLS 1-3     1422 - +  2006

    　View Summary

    This paper presents a novel bi-layer (top image resist Shipley S1808 and bottom liftoff resist LOL2000) lift off process for patterning 3-D devices. Resists are coated and patterned with an overhang profile on substrate before it is etched and before the film deposition. The key feature of the new lift off process is to create a resist undercut profile, which should be deep enough to reduce step coverage and durable to aggressive substrate etchant. Two,-step development method was demonstrated effective. The resist profile is optimized by development time in the two step development process. Proposed lift off process was successively used for fabricating quartz based capacitive tilt sensor.

  • Study on a diode-bridge type capacitance detection circuit for differential capacitive sensor

    Takahiro Matsuo, Jinxing Liang, Joanna Pawlat, Toshitsugu Ueda

    2006 IEEE SENSORS, VOLS 1-3     1123 - +  2006

    　View Summary

    Diode-bridge type capacitance detection circuit was developed in order to detect very small variation of differential capacitances in higher resolution. The circuit was designed for a comb structure tilt sensor, which was made of quartz crystal and had several movable electrodes between fixed electrodes. The circuit's output was almost proportional to the displacement of the movable electrode. Over 100kHz AC voltage was supplied to obtain output signal sufficiently. In order to prevent decrease of the sensitivity, the diode-bridge part was composed of commercial PIN diodes, which had very low junction capacitance (less than 1pF), and was mounted in small ceramic package with the tilt sensor. At present, the resolution of 0.0015 degree was obtained using the combination of the sensor and the detection circuit. It corresponded to the resolution of about less than 4.5aF.

  • Study of laser-induced breakdown spectroscopy from micro-droplet of NaCl Solution

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    2006 IEEE SENSORS, VOLS 1-3     291 - +  2006

    　View Summary

    The laser-induced breakdown spectroscopy (LEBS) using micro-droplet sodium chloride solution is presented. Micronizing the sample made possible that whole volume of a sample was confined in the laser beam spot area and was separated from its surrounding condition. If the sample's physical state was liquid, the density of solution could be controlled as needed. Originally designed ink-jet system for sampling procedure was presented. According to the new method, improved calibration curves for the LIBS quantitative measurement were obtained.

  • Sensing of gas concentration using photonic bandgap fiber

    Joanna Pawlat, Takahiro Matsuo, Toshitsugu Ueda, Tadashi Sugiyama

    2006 IEEE SENSORS, VOLS 1-3     224 - +  2006

    　View Summary

    Photonic Bandgap (PBG) Fiber was developed for a new gas-sensing device. The micro-capillary gas flow inside fiber and light guiding parameters were estimated in order to develop a high-sensitivity gas concentration measuring system. Darcy - Weisbach equation for non-compressible flow and quasi-Panhandle equation for compressible gas flow were used for the calculation of gas velocity. Core diameters of fibers ranged from 10.9 to 700 mu m. The results of numerical simulations were compared with experimental results. Attenuation was calculated and concentrations of ammonia and CO2 were measured.

  • Application of photonic bandgap fiber in gas concentration measurement.

    Joanna Pawlat, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    IECON 2006 - 32ND ANNUAL CONFERENCE ON IEEE INDUSTRIAL ELECTRONICS, VOLS 1-11     1642 - +  2006

    　View Summary

    An idea of high-sensitivity gas concentration measuring system basing on Photonic Bandgap fiber (PBG fiber) was studied. Several types of PBG fibres of various parameters were designed. Core diameters ranged from 10.9 to 26 mu m. Capillary gas flow rate within the fiber was simulated and measured. Attenuation of newly produced fibres was investigated and concentration of ammonia gas was measured using the new type sensing system.

    DOI

  • Simulation of particle size measurement with LIBS

    Muneaki Wakamatsu, Toshitsugu Ueda, Alexander Andreev

    IECON 2006 - 32ND ANNUAL CONFERENCE ON IEEE INDUSTRIAL ELECTRONICS, VOLS 1-11     2887 - +  2006

    　View Summary

    The problem of small solid particle size and material detection is important for industrial and environmental applications. Previous investigations have shown the possibility of using the laser breakdown method to address the first issue; the sensitivity of this method is a thousand times higher than that of conventional methods. However, for small particle sizes, the damage threshold of the solid target in this case is very close to the breakdown point of pure gas. After breakdown, there is a small volume of dense hot plasma that emits radiation. We analyzed this radiation especially at the late stage using an analytical model and simulation code, and found that the emission intensity varied depending on the laser type and plasma parameters including initial particle size.

    DOI

  • EXAMINATION OF 3D CAD SYSTEM ON ANISOTROPIC ETCHING OF ALPHA- QUARTZ

    HISANORI HAYASHI, KENTO HASEGAWA, TOSHITSUGU UEDA

    Asia-Pacific Conference of Transducers and Micro-Nano Technology?APCOT 2006     1 - 4  2006

  • Correction of barrel distortion for simple digital camera systems

    Yupeng Zhang, Ikumi Minema, Toshitsugu Ueda

    成18 年度 電気関係学会九州支部連合大会     470 - 470  2006

  • MEMS技術を用いた白金薄膜熱抵抗変化型水素ガスセンサの研究

    王 蕾, 山崎 大輔, 植田 敏嗣

    成18 年度 電気関係学会九州支部連合大会     60 - 60  2006

  • 有限要素法を用いたAT 振動子のスプリアス解析

    水町 靖, 王 強, 植田 敏嗣

    平成18 年度 電気関係学会九州支部連合大会     56 - 56  2006

  • LIBSを用いたNaCl水溶液濃度の検出

    池沢 聡, 若松 宗明, 植田 敏嗣

    センサ・マイクロマシン準部門総合研究会     9 - 13  2006

  • 水晶MEMS技術による水素センサの開発

    植田 敏嗣

    福岡水素エネルギー社会近未来展(2006)    2006

  • Deep wet etching of Z cut quartz wafer for MEMS applications

    Jinxing Liang, Fusao Kohsaka, Takahiro Matsuo, Toshitsugu Ueda

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM     31 - 35  2006

  • High Frequency Drive of a Diode-bridge Type Differential Capacitance Detection Circuit

    Takahiro MATSUO, Jinxing LIANG, Joanna PAWLAT, Toshitsugu UEDA

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM     287 - 290  2006

  • PHOTONIC BANDGAP FIBER IN LOW CONCETRATION MEASUREMENT

    Joanna Paw?at, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    10th International Symposium on High Pressure Low Temperature Plasma Chemistry , eptember 4-8     359 - 362  2006

  • Photonic bandgap fiber for a sensing device

    Joanna Paw?at, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM     329 - 333  2006

  • Absolute Calibration Technique using Micro-Droplet Ejection System for Enhancement of LIBS Quantitative Analysis

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    ”, PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM     362 - 365  2006

  • Particle Element and Size Measurement Using LIBS(2006)

    Muneaki WAKAMATSU, Satoshi Ikezawa, Toshitsugu UEDA

    , PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM,     356 - 361  2006

  • PHTONIC BANDGAP FIBER IN LOW CONCENTRATION GAS MEASUREMENT

    Joanna Pawlat, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    The First European Symposium on Plasma Chemist, May 28-30, (Poland)    2006

  • A novel lift off process and its application for capacitive tilt sensor

    Jinxing Liang, Fusao Kohsaka, Takahiro Matsuo, Toshitsugu Ueda

    2006 IEEE SENSORS, VOLS 1-3     1422 - +  2006

    　View Summary

    This paper presents a novel bi-layer (top image resist Shipley S1808 and bottom liftoff resist LOL2000) lift off process for patterning 3-D devices. Resists are coated and patterned with an overhang profile on substrate before it is etched and before the film deposition. The key feature of the new lift off process is to create a resist undercut profile, which should be deep enough to reduce step coverage and durable to aggressive substrate etchant. Two,-step development method was demonstrated effective. The resist profile is optimized by development time in the two step development process. Proposed lift off process was successively used for fabricating quartz based capacitive tilt sensor.

  • Study on a diode-bridge type capacitance detection circuit for differential capacitive sensor

    Takahiro Matsuo, Jinxing Liang, Joanna Pawlat, Toshitsugu Ueda

    2006 IEEE SENSORS, VOLS 1-3     1123 - +  2006

    　View Summary

    Diode-bridge type capacitance detection circuit was developed in order to detect very small variation of differential capacitances in higher resolution. The circuit was designed for a comb structure tilt sensor, which was made of quartz crystal and had several movable electrodes between fixed electrodes. The circuit's output was almost proportional to the displacement of the movable electrode. Over 100kHz AC voltage was supplied to obtain output signal sufficiently. In order to prevent decrease of the sensitivity, the diode-bridge part was composed of commercial PIN diodes, which had very low junction capacitance (less than 1pF), and was mounted in small ceramic package with the tilt sensor. At present, the resolution of 0.0015 degree was obtained using the combination of the sensor and the detection circuit. It corresponded to the resolution of about less than 4.5aF.

  • Study of laser-induced breakdown spectroscopy from micro-droplet of NaCl Solution

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    2006 IEEE SENSORS, VOLS 1-3     291 - +  2006

    　View Summary

    The laser-induced breakdown spectroscopy (LEBS) using micro-droplet sodium chloride solution is presented. Micronizing the sample made possible that whole volume of a sample was confined in the laser beam spot area and was separated from its surrounding condition. If the sample's physical state was liquid, the density of solution could be controlled as needed. Originally designed ink-jet system for sampling procedure was presented. According to the new method, improved calibration curves for the LIBS quantitative measurement were obtained.

  • Sensing of gas concentration using photonic bandgap fiber

    Joanna Pawlat, Takahiro Matsuo, Toshitsugu Ueda, Tadashi Sugiyama

    2006 IEEE SENSORS, VOLS 1-3     224 - +  2006

    　View Summary

    Photonic Bandgap (PBG) Fiber was developed for a new gas-sensing device. The micro-capillary gas flow inside fiber and light guiding parameters were estimated in order to develop a high-sensitivity gas concentration measuring system. Darcy - Weisbach equation for non-compressible flow and quasi-Panhandle equation for compressible gas flow were used for the calculation of gas velocity. Core diameters of fibers ranged from 10.9 to 700 mu m. The results of numerical simulations were compared with experimental results. Attenuation was calculated and concentrations of ammonia and CO2 were measured.

  • Application of photonic bandgap fiber in gas concentration measurement.

    Joanna Pawlat, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    IECON 2006 - 32ND ANNUAL CONFERENCE ON IEEE INDUSTRIAL ELECTRONICS, VOLS 1-11     1642 - +  2006

    　View Summary

    An idea of high-sensitivity gas concentration measuring system basing on Photonic Bandgap fiber (PBG fiber) was studied. Several types of PBG fibres of various parameters were designed. Core diameters ranged from 10.9 to 26 mu m. Capillary gas flow rate within the fiber was simulated and measured. Attenuation of newly produced fibres was investigated and concentration of ammonia gas was measured using the new type sensing system.

    DOI

  • Simulation of particle size measurement with LIBS

    Muneaki Wakamatsu, Toshitsugu Ueda, Alexander Andreev

    IECON 2006 - 32ND ANNUAL CONFERENCE ON IEEE INDUSTRIAL ELECTRONICS, VOLS 1-11     2887 - +  2006

    　View Summary

    The problem of small solid particle size and material detection is important for industrial and environmental applications. Previous investigations have shown the possibility of using the laser breakdown method to address the first issue; the sensitivity of this method is a thousand times higher than that of conventional methods. However, for small particle sizes, the damage threshold of the solid target in this case is very close to the breakdown point of pure gas. After breakdown, there is a small volume of dense hot plasma that emits radiation. We analyzed this radiation especially at the late stage using an analytical model and simulation code, and found that the emission intensity varied depending on the laser type and plasma parameters including initial particle size.

    DOI

  • EXAMINATION OF 3D CAD SYSTEM ON ANISOTROPIC ETCHING OF ALPHA- QUARTZ

    HISANORI HAYASHI, KENTO HASEGAWA, TOSHITSUGU UEDA

    Asia-Pacific Conference of Transducers and Micro-Nano Technology?APCOT 2006     1 - 4  2006

  • In-situ Measurement for Gas Concentrations using Tunable Lasers

    Tadashi Sugiyama, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   126 ( 8 ) 464 - 468  2006

    DOI

  • Deep wet etching of Z cut quartz wafer for MEMS applications

    Jinxing Liang, Fusao Kohsaka, Takahiro Matsuo, Toshitsugu Ueda

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM     31 - 35  2006

  • High Frequency Drive of a Diode-bridge Type Differential Capacitance Detection Circuit

    Takahiro MATSUO, Jinxing LIANG, Joanna PAWLAT, Toshitsugu UEDA

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM     287 - 290  2006

  • PHOTONIC BANDGAP FIBER IN LOW CONCETRATION MEASUREMENT

    Joanna Paw?at, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    10th International Symposium on High Pressure Low Temperature Plasma Chemistry , eptember 4-8     359 - 362  2006

  • Photonic bandgap fiber for a sensing device

    Joanna Paw?at, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM     329 - 333  2006

  • Absolute Calibration Technique using Micro-Droplet Ejection System for Enhancement of LIBS Quantitative Analysis

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    ”, PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM     362 - 365  2006

  • Particle Element and Size Measurement Using LIBS(2006)

    Muneaki WAKAMATSU, Satoshi Ikezawa, Toshitsugu UEDA

    , PROCEEDINGS OF THE 23RD SENSOR SYMPOSIUM,     356 - 361  2006

  • PHTONIC BANDGAP FIBER IN LOW CONCENTRATION GAS MEASUREMENT

    Joanna Pawlat, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    The First European Symposium on Plasma Chemist, May 28-30, (Poland)    2006

  • A novel lift off process and its application for capacitive tilt sensor

    Jinxing Liang, Fusao Kohsaka, Takahiro Matsuo, Toshitsugu Ueda

    2006 IEEE SENSORS, VOLS 1-3     1422 - +  2006

    　View Summary

    This paper presents a novel bi-layer (top image resist Shipley S1808 and bottom liftoff resist LOL2000) lift off process for patterning 3-D devices. Resists are coated and patterned with an overhang profile on substrate before it is etched and before the film deposition. The key feature of the new lift off process is to create a resist undercut profile, which should be deep enough to reduce step coverage and durable to aggressive substrate etchant. Two,-step development method was demonstrated effective. The resist profile is optimized by development time in the two step development process. Proposed lift off process was successively used for fabricating quartz based capacitive tilt sensor.

  • Study on a diode-bridge type capacitance detection circuit for differential capacitive sensor

    Takahiro Matsuo, Jinxing Liang, Joanna Pawlat, Toshitsugu Ueda

    2006 IEEE SENSORS, VOLS 1-3     1123 - +  2006

    　View Summary

    Diode-bridge type capacitance detection circuit was developed in order to detect very small variation of differential capacitances in higher resolution. The circuit was designed for a comb structure tilt sensor, which was made of quartz crystal and had several movable electrodes between fixed electrodes. The circuit's output was almost proportional to the displacement of the movable electrode. Over 100kHz AC voltage was supplied to obtain output signal sufficiently. In order to prevent decrease of the sensitivity, the diode-bridge part was composed of commercial PIN diodes, which had very low junction capacitance (less than 1pF), and was mounted in small ceramic package with the tilt sensor. At present, the resolution of 0.0015 degree was obtained using the combination of the sensor and the detection circuit. It corresponded to the resolution of about less than 4.5aF.

  • Study of laser-induced breakdown spectroscopy from micro-droplet of NaCl Solution

    Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda

    2006 IEEE SENSORS, VOLS 1-3     291 - +  2006

    　View Summary

    The laser-induced breakdown spectroscopy (LEBS) using micro-droplet sodium chloride solution is presented. Micronizing the sample made possible that whole volume of a sample was confined in the laser beam spot area and was separated from its surrounding condition. If the sample's physical state was liquid, the density of solution could be controlled as needed. Originally designed ink-jet system for sampling procedure was presented. According to the new method, improved calibration curves for the LIBS quantitative measurement were obtained.

  • Sensing of Gas Concentration Using Photonic Bandgap Fiber”

    Pawlat J, Sugiyama T, Ueda T

    IEEE SENSORS 2006, EXCO Daegu, Korea/October 22-25     67 - 67  2006

  • Application of photonic bandgap fiber in gas concentration measurement.

    Joanna Pawlat, Takahiro Matsuo, Tadashi Sugiyama, Toshitsugu Ueda

    IECON 2006 - 32ND ANNUAL CONFERENCE ON IEEE INDUSTRIAL ELECTRONICS, VOLS 1-11     1642 - +  2006

    　View Summary

    An idea of high-sensitivity gas concentration measuring system basing on Photonic Bandgap fiber (PBG fiber) was studied. Several types of PBG fibres of various parameters were designed. Core diameters ranged from 10.9 to 26 mu m. Capillary gas flow rate within the fiber was simulated and measured. Attenuation of newly produced fibres was investigated and concentration of ammonia gas was measured using the new type sensing system.

    DOI

  • Simulation of particle size measurement with LIBS

    Muneaki Wakamatsu, Toshitsugu Ueda, Alexander Andreev

    IECON 2006 - 32ND ANNUAL CONFERENCE ON IEEE INDUSTRIAL ELECTRONICS, VOLS 1-11     2887 - +  2006

    　View Summary

    The problem of small solid particle size and material detection is important for industrial and environmental applications. Previous investigations have shown the possibility of using the laser breakdown method to address the first issue; the sensitivity of this method is a thousand times higher than that of conventional methods. However, for small particle sizes, the damage threshold of the solid target in this case is very close to the breakdown point of pure gas. After breakdown, there is a small volume of dense hot plasma that emits radiation. We analyzed this radiation especially at the late stage using an analytical model and simulation code, and found that the emission intensity varied depending on the laser type and plasma parameters including initial particle size.

    DOI

  • EXAMINATION OF 3D CAD SYSTEM ON ANISOTROPIC ETCHING OF ALPHA- QUARTZ

    HISANORI HAYASHI, KENTO HASEGAWA, TOSHITSUGU UEDA

    Asia-Pacific Conference of Transducers and Micro-Nano Technology?APCOT 2006     1 - 4  2006

  • TILT SENSOR USING QUARTZ MEMS TECHNOLOGY

    Toshitsugu Ueda, Husao Khosaka

    2005 International Symposium on Nano Science and Technology November 10-11, Taiwan, Tainan     8 - 9  2005

  • High Sensitive Tilt Sensor for Quartz Micromachining

    Fusao Kohsaka, Jinxing Liang, Toshitsugu Ueda

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)     171 - 174  2005

  • Performance Analysis of a Diode-bridge Type Differential Capacitance Detection Circuit and It’s Evaluation

    Takahiro MATSUO, Ken KUNITOMO, Toshitugu UEDA

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)     233 - 236  2005

  • In-situ Measurement of ppb Concentration of Gas

    Joanna Pawlat, Tadashi Sugiyama, Toshitsugu Uedapp

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)     279 - 284  2005

  • A Study on a Diode-bridge Type Differential Capacitance Detection Circuit

    Takahiro MATSUO, Ken KUNITOMO, Toshitsugu UEDA

    ELMECO-5, Naleczow (Poland)    2005

  • The measurement of ppb gas concentration using photonic crystal fiber

    Joanna Pawlat, Tadashi, Sugiyama, Toshitsugu Ueda

    ELMECO-5, Naleczow (Poland)    2005

  • Simulation of Anisotropic Etching of Alpha-Quartz for 3D CAD System

    Hisanori Hayashi, Toshitsugu Ueda

    Sensors and Materials,   17 ( 4 ) 167 - 177  2005

  • 蛍光X線膜厚計で使用するCr標準膜の開発(3)

    播磨 幸一, 植田 敏嗣, 岩崎 登

    平成17年度電気関係学会支部連合体会     164 - 164  2005

  • MEMS技術を用いた白金薄膜水素ガスセンサの研究

    チンウドンポン エッカリン, 植田敏嗣

    平成17年度電気関係学会支部連合体会     167 - 167  2005

  • α水晶の三次元加工のためのエッチング異方性の検討

    長谷川研人, 林尚典, 植田敏嗣

    平成17年度電気関係学会支部連合体会     165 - 165  2005

  • スプレー法によるレジストコーティングの検討

    井上幸広, 幸坂扶佐夫, 梁金星, 植田敏嗣

    平成17年度電気関係学会支部連合体会     163 - 163  2005

  • LIBSによる食塩濃度の測定

    池沢聡, 若松宗男, 植田敏嗣

    平成17年度電気関係学会支部連合体会     239 - 239  2005

  • 蛍光X線膜厚計で使用するCr標準膜の開発

    播磨 幸一, 植田 敏嗣, 岩崎 登

    センサ・マイクロマシン準部門総合研究会     1 - 5  2005

  • 蛍光X線膜厚計で使用するCr標準膜の開発

    播磨幸一, 植田 敏嗣, 播磨幸一, 植田 敏嗣

    第48回自動制御連合講演会     71 - 74  2005

  • 水晶を用いた高感度傾斜角センサの検討

    幸坂 扶佐夫, 梁 金星, 植田 敏嗣

    平成17年度電気学会全国大会講演論文集 ３     222 - 222  2005

  • 水晶ＭＥＭＳ技術による超高感度・超小型次世代センサの開発

    植田 敏嗣

    福岡水素エネルギー戦略会議総会記念講演会、福岡ナノテク推進会議    2005

  • 研究室便り、早稲田大学大学院情報生産システム研究科 植田研究室

    植田 敏嗣

    電気学会論文誌E   125 ( 4 ) 207 - 207  2005

  • TILT SENSOR USING QUARTZ MEMS TECHNOLOGY

    Toshitsugu Ueda, Husao Khosaka

    2005 International Symposium on Nano Science and Technology November 10-11, Taiwan, Tainan     8 - 9  2005

  • High Sensitive Tilt Sensor for Quartz Micromachining

    Fusao Kohsaka, Jinxing Liang, Toshitsugu Ueda

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)     171 - 174  2005

  • Performance Analysis of a Diode-bridge Type Differential Capacitance Detection Circuit and It’s Evaluation

    Takahiro MATSUO, Ken KUNITOMO, Toshitugu UEDA

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)     233 - 236  2005

  • In-situ Measurement of ppb Concentration of Gas

    Joanna Pawlat, Tadashi Sugiyama, Toshitsugu Uedapp

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)     279 - 284  2005

  • A Study on a Diode-bridge Type Differential Capacitance Detection Circuit

    Takahiro MATSUO, Ken KUNITOMO, Toshitsugu UEDA

    ELMECO-5, Naleczow (Poland)    2005

  • The measurement of ppb gas concentration using photonic crystal fiber

    Joanna Pawlat, Tadashi, Sugiyama, Toshitsugu Ueda

    ELMECO-5, Naleczow (Poland)    2005

  • Simulation of anisotropic etching of alpha-quartz for 3D computer-aided-design system

    H Hayashi, T Ueda

    SENSORS AND MATERIALS   17 ( 4 ) 167 - 177  2005

    　View Summary

    Alpha-quartz anisotropic etching is a powerful tool for micromachining for the fabrication of various devices by photolithography. Therefore, this technique can help sensor engineers to develop computer-aided-design (CAD) systems. In this study, we estimated the etching rates of alpha-quartz wafers for all cut angles on the basis of our experimental data. Then, the configuration of the alpha-quartz wafer faces was predicted with the etching rate profile calculated from the experimental data. These results confirmed that our proposed theory corresponds to the experimental results for etching rates in all directions of alpha-quartz. We believe that the results of these simulations lead to the development of a three-dimensional CAD system for the precision design of complex-shaped objects to be fabricated by anisotropic etching of alpha-quartz.

  • TILT SENSOR USING QUARTZ MEMS TECHNOLOGY

    Toshitsugu Ueda, Husao Khosaka

    2005 International Symposium on Nano Science and Technology November 10-11, Taiwan, Tainan     8 - 9  2005

  • High Sensitive Tilt Sensor for Quartz Micromachining

    Fusao Kohsaka, Jinxing Liang, Toshitsugu Ueda

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)     171 - 174  2005

  • Performance Analysis of a Diode-bridge Type Differential Capacitance Detection Circuit and It’s Evaluation

    Takahiro MATSUO, Ken KUNITOMO, Toshitugu UEDA

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)     233 - 236  2005

  • In-situ Measurement of ppb Concentration of Gas

    Joanna Pawlat, Tadashi Sugiyama, Toshitsugu Uedapp

    Proceedings of the 22nd Sensor Symposium、Tokyo (Japan)     279 - 284  2005

  • A Study on a Diode-bridge Type Differential Capacitance Detection Circuit

    Takahiro MATSUO, Ken KUNITOMO, Toshitsugu UEDA

    ELMECO-5, Naleczow (Poland)    2005

  • The measurement of ppb gas concentration using photonic crystal fiber

    Joanna Pawlat, Tadashi, Sugiyama, Toshitsugu Ueda

    ELMECO-5, Naleczow (Poland)    2005

  • Simulation of Anisotropic Etching of Alpha-Quartz for 3D CAD System

    Hisanori Hayashi, Toshitsugu Ueda

    Sensors and Materials,   17 ( 4 ) 167 - 177  2005

  • Theory to Predict Etching Shapes in Quartz Crystal and Its Application to Design Micro-mechanical Devices(invited speech)

    Toshitsugu Ueda, Hisanori Hayashi

    2004 International Symposium on Nano Science and Technology Novenver 20-21, Taiwan, Tainan     35 - 41  2004

  • Mechanical Strength of Quartz Micromechanical Devices

    Fusao Kohsaka, Jinxing Liang, Toshitsugu Ueda

    Proceedings of The 21st Sensor Symposium     225 - 228  2004

  • Simulation of Anisotropic Etching of Alpha-Quartz for 3D CAD System

    Hisanori Hayashi, Toshitsugu Ueda

    4th Workshop Physical Chemistry of Wet Etching of Silicon, PCWES 2004 May 26-28, Montreal, Canada    2004

  • Particle Element and Size Measurement Using LIBS

    Muneaki WAKAMATSU, Toshitsugu UEDA, Hysanori HAYASHI

    ICEE 2004 (Joint Conference with Asia-Pasific of Transducers and Micro-Nano Technology 2004) July 4-8 2004 in Sapporo     823 - 826  2004

  • Particle size measurement and material characterization with plasma atomic emission analysi

    Muneaki Wakamatsu, Toshitsugu Ueda

    Trans.of Airosll Research   19 ( 1 ) 28 - 33  2004

  • 蛍光X線膜厚計で使用するCr標準薄膜の開発

    播磨 幸一, 岩崎 登, 植田 敏嗣

    平成16年度電気関係学会連合大会     318 - 318  2004

  • 高周波水晶発振器（VCXO）の加工技術に関する基礎的研究

    郭 玉芳, 植田 敏嗣

    平成16年度電気関係学会連合大会     320 - 320  2004

  • α水晶のエッチング異方性に関する基礎研究

    花俣 秀幸, 林 尚典, 植田 敏嗣

    平成16年度電気関係学会連合大会     319 - 319  2004

  • 水晶マイクロ・ナノ加工とデバイス応用(招待講演)、、pp1-2(2004)

    植田 敏嗣

    ナノテク研究・ビジネス最前線 H16/12/24・MEMSの最新技術と九州における展望     1 - 2  2004

  • Theory to Predict Etching Shapes in Quartz Crystal and Its Application to Design Micro-mechanical Devices(invited speech)

    Toshitsugu Ueda, Hisanori Hayashi

    2004 International Symposium on Nano Science and Technology Novenver 20-21, Taiwan, Tainan     35 - 41  2004

  • Mechanical Strength of Quartz Micromechanical Devices

    Fusao Kohsaka, Jinxing Liang, Toshitsugu Ueda

    Proceedings of The 21st Sensor Symposium     225 - 228  2004

  • Simulation of Anisotropic Etching of Alpha-Quartz for 3D CAD System

    Hisanori Hayashi, Toshitsugu Ueda

    4th Workshop Physical Chemistry of Wet Etching of Silicon, PCWES 2004 May 26-28, Montreal, Canada    2004

  • Particle Element and Size Measurement Using LIBS

    Muneaki WAKAMATSU, Toshitsugu UEDA, Hysanori HAYASHI

    ICEE 2004 (Joint Conference with Asia-Pasific of Transducers and Micro-Nano Technology 2004) July 4-8 2004 in Sapporo     823 - 826  2004

  • Simultaneous Determination of Particle Size and Chemical Composition with Plasma Atomic Emission Analysis

    WAKAMATSU Muneaki, UEDA Toshitsugu

    Earozoru Kenkyu   19 ( 1 ) 28 - 33  2004

    　View Summary

    Information on the distribution of chemical composition with respect to particle size is necessary in various fields of aerosol research. Particle analyzer system using helium microwave-induced plasma (He-MIP) can simultaneously measure the composition and size of individual particles without any preparation, but the plasma is relatively unstable because of its low plasma capacity. We have overcome this difficulty by devising new single particle introduction system for He-MIP. Furthermore, we have developed a high-sensitivity in-situ measurement technology using Laser Induced Breakdown Spectroscopy (LIBS). This measurement technology couples new particle-plasmatizing technique with high-sensitivity measurement of photons from visible to ultraviolet wavelength bands emitted from the plasma, therefore allowing simultaneous stable measurement of particle size and composition as required in various processes.

    DOI CiNii

  • Theory to Predict Etching Shapes in Quartz Crystal and Its Application to Design Micro-mechanical Devices(invited speech)

    Toshitsugu Ueda, Hisanori Hayashi

    2004 International Symposium on Nano Science and Technology Novenver 20-21, Taiwan, Tainan     35 - 41  2004

  • Mechanical Strength of Quartz Micromechanical Devices

    Fusao Kohsaka, Jinxing Liang, Toshitsugu Ueda

    Proceedings of The 21st Sensor Symposium     225 - 228  2004

  • Simulation of Anisotropic Etching of Alpha-Quartz for 3D CAD System

    Hisanori Hayashi, Toshitsugu Ueda

    4th Workshop Physical Chemistry of Wet Etching of Silicon, PCWES 2004 May 26-28, Montreal, Canada    2004

  • Particle Element and Size Measurement Using LIBS

    Muneaki WAKAMATSU, Toshitsugu UEDA, Hysanori HAYASHI

    ICEE 2004 (Joint Conference with Asia-Pasific of Transducers and Micro-Nano Technology 2004) July 4-8 2004 in Sapporo     823 - 826  2004

  • Particle size measurement and material characterization with plasma atomic emission analysi

    Muneaki Wakamatsu, Toshitsugu Ueda

    Trans.of Airosll Research   19 ( 1 ) 28 - 33  2004

  • Particle element and size measurement using LIBS

    M Wakamatsu, T Ueda, H Hayashi

    SICE 2003 ANNUAL CONFERENCE, VOLS 1-3     1191 - 1195  2003

    　View Summary

    We have developed high-sensitivity in-situ measurement technology based on photons with visible to ultraviolet wavelength bands. This measurement technology builds on plasmatizing particles technology and a high-sensitivity measurement technology for measuring photons from the plama. Thus, we have established a technology for measuring particle sizes down to 30 nm and the constituent element content of particle with 10% accuracy.

  • In-situ Measurement for Gas Concentrations using Tunable Lasers"

    Tadashi Sugiyama, Toshitsugu Ueda

    Proceedings of the 20th Sensor Symposium, B1-5, July     91 - 96  2003

  • レーザーブレイクダウン(LIBS)による微粒子計測

    若松 宗明, 植田敏嗣

    、SICE第4回制御部門大会 予稿集    2003

  • 水晶振動子ナノ加工技術の研究開発” 高感度ガスセンサへの応用”

    植田敏嗣

    ASTE Annual Report of RISE, Waseda Univ   A11  2003

  • LD ビームデリバリ技術の研究開発

    植田敏嗣

    ASTE Annual Report of RISE, Waseda Univ.   A11  2003

  • 波長可変レーザーを用いた近赤外域での気体の分光計測

    杉山直, 植田敏嗣

    第一回赤外放射の応用関連学会等年会    2003

  • 波長可変レーザーを用いた気体の高感度分光

    杉山直, 植田敏嗣

    電気学会ケミカルセンサ研究会, CHS-03-56     1 - 4  2003

  • 紫外光光ファイバの試作と特性評価

    児玉, 石沢, 鳥羽, 植田

    第22回レーザセンシングシンポジウム     125 - 128  2003

  • Particle element and size measurement using LIBS

    M Wakamatsu, T Ueda, H Hayashi

    SICE 2003 ANNUAL CONFERENCE, VOLS 1-3     1191 - 1195  2003

    　View Summary

    We have developed high-sensitivity in-situ measurement technology based on photons with visible to ultraviolet wavelength bands. This measurement technology builds on plasmatizing particles technology and a high-sensitivity measurement technology for measuring photons from the plama. Thus, we have established a technology for measuring particle sizes down to 30 nm and the constituent element content of particle with 10% accuracy.

  • In-situ Measurement for Gas Concentrations using Tunable Lasers"

    Tadashi Sugiyama, Toshitsugu Ueda

    Proceedings of the 20th Sensor Symposium, B1-5, July     91 - 96  2003

  • Particle Element and Size Measurement Using LIBS

    M. Wakmatsu, T. Ueda

    SICE Annual Conference in Fukui, August 4-6     467 - 471  2003

  • In-situ Measurement for Gas Concentrations using Tunable Lasers"

    Tadashi Sugiyama, Toshitsugu Ueda

    Proceedings of the 20th Sensor Symposium, B1-5, July     91 - 96  2003

  • Development of Technology for Measuring Part-per-billion Gas concentrations and Nano-particles

    T. Ueda, T. Sugiyama, M. Wada

    Final report of The "Advanced Photon Proccesing Measurement Technology"     ⅩⅠ  2002

  • Laser plasma emission of small particles in different gas atmospheres

    A Andreev, T Ueda, M Wakamatsu

    PHOTON PROCESSING IN MICROELECTRONICS AND PHOTONICS   4637   413 - 418  2002

    　View Summary

    The problem of laser pulse interaction with small solid particles (SSP) in a gas atmosphere when detecting its parameters is a serious one in industrial and environmental applications. Previous investigations have shown the possibility of using the laser induced breakdown method. This method is very sensitive, but for a particle size of less than 0.1 mum the damage threshold of the solid target is very close to the breakdown point of pure gas. At breakdown, a small volume of dense hot plasma emits radiation by which the size and material of particles can be detected.
    We used an analytical model, simulation code and experiments to analyze this radiation and found that the emitted intensity varied with laser, gas and particle parameters. The increased dependence of SSP plasma emission rate on initial particle volume permits this method to be used for measuring small particle size by using emitted fine spectrum at the late time stage.

  • Growth of strain-blanced InAsp/InP/InGaAs multiple quantum well for infrared photodetectors

    M.Wada, S.Araki, T.Kudou, T. Umezawa, S.Nakajima, T.Ueda

    20th Sensor Symposium     177 - 181  2002

  • Laser with SBS Pulse Compression for LIBS

    Ueda Toshitsugu, Yashin Vladimir, Wakamatsu Muneaki, Andreev Alexsander

    IEEJ Transactions on Sensors and Micromachines   122-E ( 5 ) 244 - 248  2002

    　View Summary

    High Intensity pulse laser is very important device as a light source of LIBS. For obtaining high peak power and short pulses, different approaches based on MOPA (Master Oscillator-Power Amplifier) scheme of master oscillator (MO) power amplifiers(PA) can be used. We use Stimulated Brillouin Scattering (SBS) cell in the power amplifier for laser pulse compression. Compression of pulses by SBS allows potentially receiving pulses by duration down to 100 picosecond and has following advantages. The compression of pulses at SBS have enough large power efficiency (usually more than 50%), that is much higher than power efficiency of extracting of a short pulse, from a long &ldquo;train&rdquo; of mode-locked pulses or cutting of short pulse from a long Q-switched pulse. As a results, pulse duration of the laser which we have developed is less than 300ps at 50mJ out-put energy. This means that intensity of the laser is 20 times higher than conventional Nd:YAG pulse lasers.

    DOI CiNii

  • Development of InGaAs photodiodes for near-infrared spectroscopy

    M.Wada, S.Araki, T.Kudou, T.Umezawa, S.Nakajima, T.Ueda

    Trns. IEE of Japan   22 ( 1 ) 29 - 34  2002

  • 水晶振動子ナノ加工技術の研究開発

    植田敏嗣, Vol

    ASTE Annual Report of RISE, Waseda Univ.   A10  2002

  • ppbガス濃度とナノ粒子計測技術の研究開発

    植田敏嗣, 杉山 直, 若松宗明, 和田守夫

    フォトン計測・加工技術」プロジェクト成果報告会講演集    2002

  • Development of Technology for Measuring Part-per-billion Gas concentrations and Nano-particles

    T. Ueda, T. Sugiyama, M. Wada

    Final report of The "Advanced Photon Proccesing Measurement Technology"     ⅩⅠ  2002

  • Laser plasma emission of small particles in different gas atmospheres

    A Andreev, T Ueda, M Wakamatsu

    PHOTON PROCESSING IN MICROELECTRONICS AND PHOTONICS   4637   413 - 418  2002

    　View Summary

    The problem of laser pulse interaction with small solid particles (SSP) in a gas atmosphere when detecting its parameters is a serious one in industrial and environmental applications. Previous investigations have shown the possibility of using the laser induced breakdown method. This method is very sensitive, but for a particle size of less than 0.1 mum the damage threshold of the solid target is very close to the breakdown point of pure gas. At breakdown, a small volume of dense hot plasma emits radiation by which the size and material of particles can be detected.
    We used an analytical model, simulation code and experiments to analyze this radiation and found that the emitted intensity varied with laser, gas and particle parameters. The increased dependence of SSP plasma emission rate on initial particle volume permits this method to be used for measuring small particle size by using emitted fine spectrum at the late time stage.

  • Growth of strain-blanced InAsp/InP/InGaAs multiple quantum well for infrared photodetectors

    M.Wada, S.Araki, T.Kudou, T. Umezawa, S.Nakajima, T.Ueda

    20th Sensor Symposium     177 - 181  2002

  • Laser with SBS Pulse Compression for LIBS

    Ueda Toshitsugu, Yashin Vladimir, Wakamatsu Muneaki, Andreev Alexsander

    IEEJ Transactions on Sensors and Micromachines   122-E ( 5 ) 244 - 248  2002

    　View Summary

    High Intensity pulse laser is very important device as a light source of LIBS. For obtaining high peak power and short pulses, different approaches based on MOPA (Master Oscillator-Power Amplifier) scheme of master oscillator (MO) power amplifiers(PA) can be used. We use Stimulated Brillouin Scattering (SBS) cell in the power amplifier for laser pulse compression. Compression of pulses by SBS allows potentially receiving pulses by duration down to 100 picosecond and has following advantages. The compression of pulses at SBS have enough large power efficiency (usually more than 50%), that is much higher than power efficiency of extracting of a short pulse, from a long &ldquo;train&rdquo; of mode-locked pulses or cutting of short pulse from a long Q-switched pulse. As a results, pulse duration of the laser which we have developed is less than 300ps at 50mJ out-put energy. This means that intensity of the laser is 20 times higher than conventional Nd:YAG pulse lasers.

    DOI CiNii

  • Development of InGaAs photodiodes for near-infrared spectroscopy

    M.Wada, S.Araki, T.Kudou, T.Umezawa, S.Nakajima, T.Ueda

    電気学会論文誌E, Vol.122, No.1   22 ( 1 ) 29 - 34  2002

  • Development of Technology for Measuring Part-per-billion Gas concentrations and Nano-particles

    T. Ueda, T. Sugiyama, M. Wada

    Final report of The "Advanced Photon Proccesing Measurement Technology"     ⅩⅠ  2002

  • Laser plasma emission of small particles in different gas atmospheres

    A Andreev, T Ueda, M Wakamatsu

    PHOTON PROCESSING IN MICROELECTRONICS AND PHOTONICS   4637   413 - 418  2002

    　View Summary

    The problem of laser pulse interaction with small solid particles (SSP) in a gas atmosphere when detecting its parameters is a serious one in industrial and environmental applications. Previous investigations have shown the possibility of using the laser induced breakdown method. This method is very sensitive, but for a particle size of less than 0.1 mum the damage threshold of the solid target is very close to the breakdown point of pure gas. At breakdown, a small volume of dense hot plasma emits radiation by which the size and material of particles can be detected.
    We used an analytical model, simulation code and experiments to analyze this radiation and found that the emitted intensity varied with laser, gas and particle parameters. The increased dependence of SSP plasma emission rate on initial particle volume permits this method to be used for measuring small particle size by using emitted fine spectrum at the late time stage.

  • Growth of strain-blanced InAsp/InP/InGaAs multiple quantum well for infrared photodetectors

    M.Wada, S.Araki, T.Kudou, T. Umezawa, S.Nakajima, T.Ueda

    20th Sensor Symposium     177 - 181  2002

  • Laser with SBS Pulse Compression for LIBS

    T. Ueda, V. Yashin, M. Wakamatsu, A. Andreev

    Trns. IEE of Japan   122-E ( 5 ) 244 - 248  2002

    　View Summary

    High Intensity pulse laser is very important device as a light source of LIBS. For obtaining high peak power and short pulses, different approaches based on MOPA (Master Oscillator-Power Amplifier) scheme of master oscillator (MO) power amplifiers(PA) can be used. We use Stimulated Brillouin Scattering (SBS) cell in the power amplifier for laser pulse compression. Compression of pulses by SBS allows potentially receiving pulses by duration down to 100 picosecond and has following advantages. The compression of pulses at SBS have enough large power efficiency (usually more than 50%), that is much higher than power efficiency of extracting of a short pulse, from a long &ldquo;train&rdquo; of mode-locked pulses or cutting of short pulse from a long Q-switched pulse. As a results, pulse duration of the laser which we have developed is less than 300ps at 50mJ out-put energy. This means that intensity of the laser is 20 times higher than conventional Nd:YAG pulse lasers.

    DOI CiNii

  • Development of InGaAs photodiodes for near-infrared spectroscopy

    M.Wada, S.Araki, T.Kudou, T.Umezawa, S.Nakajima, T.Ueda

    Trns. IEE of Japan   22 ( 1 ) 29 - 34  2002

  • High-Sensitive Mesurement Technology for IR Spectroscopy

    Tadashi Sugiyama, Toshitsugu Ueda, Morio Wada, Shinichirou Nakajima, Toshimasa Umezawa

    Proceedings of The 5th Symposium Advanced Photon Processing and Mesurement Technology     57 - 58  2001

  • Development of In-situ Nono-Particle Measurement

    Toshitsugu Ueda, M. Wakamatsu, L.G.Zimne, H. Hayashi, T. Sugiyama, A.A. Andreev

    Proceedings of the 5th Symposium Advanced Photon Processing and Measurement Technology     55 - 56  2001

  • Detection of Carbon and Cluster Parameter by Laser-Induced Plasms Line Radiation

    A.Andreev, T.Ueda

    IWFAC'2001'Fulluence and Atomic Clusters'in Saint-Petersburg     288 - 288  2001

  • Growth of strain-balanced InAsP/InP/InGaAs multiple quantum well structures for mid-infrared photodetectors

    M Wada, S Araki, T Kudou, T Ueda

    CLEO(R)/PACIFIC RIM 2001, VOL I, TECHNICAL DIGEST     526 - 527  2001

    　View Summary

    This report discusses the growth of new strain-balanced InAsP, InP, and InGaAs multiple quantum well structures with +2.0% strained InAsP wells, InP barriers and -2.0% strained InGaAs layers for mid-infrared quantum well infrared photodetectors.

  • Particle Elements and Size Measurement Using LIB

    T.Ueda, M.Wakamatsu, H.Hayashi, T.Sugiyama, A.Andreev

    18th Sensor Symposium, May, 30     319 - 324  2001

  • Development of InGaAs photodiodes for near-infrared spectroscopy

    M.Wada, S.Araki, T.Kudou, T.Umezawa, S.Nakajima, T.Ueda

    18th Sensor Symposium, May, 29     99 - 103  2001

  • In-situ Spectroscopic Measurement of Gas Using Tunable Lasers and InGaAs Photodiodes

    Tadashi Sugiyama, Toshitsugu Ueda, Morio Wada, Shinichi Nakajima

    18th Sensor Symposium, May, 29     105 - 108  2001

  • Simulation of laser plasma emission characteristics of small solid particles in different gas atmospheres at various pressures

    A.Andreev, T.Ueda

    18th Sensor Symposium, May, 30     325 - 330  2001

  • Laser with SBS Pulse Compression for LIBS

    T.Ueda, V.E.Yashin, S.A.Chizhov, R.L.Sabirov, K.Lavrentev, A. Andreev, M.Wakamatsu, H.Hayashi, T.Sugiyama

    18th Sensor Symposium, May, 29     313 - 318  2001

  • Optimal lithium targets for laser-plasma lithography

    AA Andreev, T Ueda, J Limpouch

    EMERGING LITHOGRAPHIC TECHNOLOGIES V   4343   789 - 796  2001

    　View Summary

    Lithium containing droplet and cluster targets irradiated by laser pulses are proposed as prospective source of for soft x-ray lithography. Analytical model and simulations show that laser with repetition rate of several MHz with energy of several mJ and pulse duration 10 ps is required.

    DOI

  • Laser detection of the parameters of small solid particle located in air

    A Andreev, T Ueda, M Wakamatsu, A Golub

    LASER OPTICS 2000: SOLID STATE LASERS   4350   161 - 170  2001

    　View Summary

    The problem of small particle size and material detection is important for industrial and environmental applications. Previous investigations have shown the possibility of using the laser breakdown method to achieve first goal; the sensitivity of this method is a thousand times higher than that of conventional methods. However, for small particle sizes, the damage threshold of the solid target in this case is very close to the breakdown point of pure air. After breakdown, there is a small volume of dense hot plasma that emits radiation. We analyzed this radiation especially at late stage using an analytical model and simulation code as well as by experiment, and found that the emission intensity varied depending on the laser type and plasma parameters including initial particle size.

    DOI

  • Spectroscopic detection of ammonia using diode-pumped difference-frequency generation

    T Ueda, M Wada, T Sugiyama, S Nakajima, T Umezawa, S Araki, T Kudou

    GROWTH, FABRICATION, DEVICES, AND APPLICATIONS OF LASER AND NONLINEAR MATERIALS   4268   21 - 25  2001

    　View Summary

    Use of photons for in-situ measurements of various objects provides a number of benefits, such as precise real-time measurement with no effect on the measured objects. Our research aims to develop an in-situ measurement technology that uses the benefits of photons and is ideal for applications in production lines. We succeeded in developing a tunable laser beam source to obtain the spectral line width of 5 MHz and a continuous wavelength sweep bandwidth of 200 nm, thus achieving our initial target. We believe that these characteristics are sufficient for use in absorption spectroscopy measurement of gases. For a 2.5-2.7 mum-band quantum infrared photo detector, we achieved the initial target of D* = 1 to 3 x10(11) cmHz(1/2)/W (at room temperature). For a 3-10 mum-band quantum infrared photo detector, we performed a study on designing an InAsP/InP multi-quantum well light-absorbing layer.

    DOI

  • High Sensitive Quartz Crystal Microphone using Micro-Machining Technology

    Toshitsugu Ueda, Husao Kousaka, Daisuke Yamazaki, Hisanori Hayashi

    IEEJ Transactions on Sensors and Micromachines   121 ( 12 ) 629 - 635  2001

    　View Summary

    We report the development of high sensitive Quartz Crystal Microphone using micro machining technology. The purpose of the microphone is to apply it as a sensor in gas analysis system. Moving part and gap of Quartz Crystal Microphone are manufactured by anisotropic etching and electro plating technology. It's sensitivity and anti vibration characteristics have been greatly improved compare with conventional microphones. Keywords: micro machining, Quartz, microphone, Gas analyzer. © 2001, The Institute of Electrical Engineers of Japan. All rights reserved.

    DOI

  • Simulation of laser plasma emission characteristics of small solid particles in different gas atmospheres at various pressures

    A. Andreev, T. Ueda

    Trns. IEE of Japan   121-E ( 11 ) 593 - 598  2001

    DOI

  • MOVPE成長法による大面積2.5μm InGaAsフォトダイオードの製作

    和田 守夫, 荒木 昌二郎, 工藤貴裕, 梅沢 俊匡, 中島眞一, 植田敏嗣

    2001年秋季応用物理学会学術講演会    2001

  • レーザーブレークダウン分光による微粒子成分・粒径計測

    植田敏嗣, 若松宗明, 林尚典 杉山直

    SICE学術講演会    2001

  • 可変波長レーザーを用いた気体のIn-situ計測

    杉山 直, 植田敏嗣, 和田 守夫, 中島眞

    SICE学術講演会    2001

  • LIBSによる微粒子計測の可能性

    植田敏嗣

    レーザーアブレーション調査専門委員会    2001

  • 中赤外QWIP用InAsP/Inp/InGaAs歪バランス多重量子井戸構造のMOVPE成長

    和田 守夫, 植田敏嗣, 荒木昌二郎, 工藤貴裕, 中島眞一, 梅沢 俊匡

    第48回応用物理学関係連合講演会     31 - 31  2001

  • 波長可変レーザーと高感度InGaAs光検出器によるin-situガス濃度計測

    杉山直, 植田敏嗣, 和田守男, 中島眞一

    レーザー学会第290回研究会     6 - 9  2001

  • LIBSによるナノ粒子計測

    植田敏嗣, 若松宗明, 杉山直

    第4回「フォトン計測・加工技術」ワークショップ     63 - 66  2001

  • 気体の超高感度in-situ計測

    杉山 直, 植田敏嗣, 和田守男, 中島眞一

    第4回「フォトン計測・加工技術」ワークショップ     59 - 62  2001

  • High-Sensitive Mesurement Technology for IR Spectroscopy

    Tadashi Sugiyama, Toshitsugu Ueda, Morio Wada, Shinichirou Nakajima, Toshimasa Umezawa

    Proceedings of The 5th Symposium Advanced Photon Processing and Mesurement Technology     57 - 58  2001

  • Development of In-situ Nono-Particle Measurement

    Toshitsugu Ueda, M. Wakamatsu, L.G.Zimne, H. Hayashi, T. Sugiyama, A.A. Andreev

    Proceedings of the 5th Symposium Advanced Photon Processing and Measurement Technology     55 - 56  2001

  • Detection of Carbon and Cluster Parameter by Laser-Induced Plasms Line Radiation

    A.Andreev, T.Ueda

    IWFAC'2001'Fulluence and Atomic Clusters'in Saint-Petersburg     288 - 288  2001

  • Growth of strain-balanced InAsP/InP/InGaAs multiple quantum well structures for mid-infrared photodetectors

    M Wada, S Araki, T Kudou, T Ueda

    CLEO(R)/PACIFIC RIM 2001, VOL I, TECHNICAL DIGEST     526 - 527  2001

    　View Summary

    This report discusses the growth of new strain-balanced InAsP, InP, and InGaAs multiple quantum well structures with +2.0% strained InAsP wells, InP barriers and -2.0% strained InGaAs layers for mid-infrared quantum well infrared photodetectors.

  • Particle Elements and Size Measurement Using LIB

    T.Ueda, M.Wakamatsu, H.Hayashi, T.Sugiyama, A.Andreev

    18th Sensor Symposium, May, 30     319 - 324  2001

  • Development of InGaAs photodiodes for near-infrared spectroscopy

    M.Wada, S.Araki, T.Kudou, T.Umezawa, S.Nakajima, T.Ueda

    18th Sensor Symposium, May, 29     99 - 103  2001

  • In-situ Spectroscopic Measurement of Gas Using Tunable Lasers and InGaAs Photodiodes

    Tadashi Sugiyama, Toshitsugu Ueda, Morio Wada, Shinichi Nakajima

    18th Sensor Symposium, May, 29     105 - 108  2001

  • Simulation of laser plasma emission characteristics of small solid particles in different gas atmospheres at various pressures

    A.Andreev, T.Ueda

    18th Sensor Symposium, May, 30     325 - 330  2001

  • Laser with SBS Pulse Compression for LIBS

    T.Ueda, V.E.Yashin, S.A.Chizhov, R.L.Sabirov, K.Lavrentev, A. Andreev, M.Wakamatsu, H.Hayashi, T.Sugiyama

    18th Sensor Symposium, May, 29     313 - 318  2001

  • Optimal lithium targets for laser-plasma lithography

    AA Andreev, T Ueda, J Limpouch

    EMERGING LITHOGRAPHIC TECHNOLOGIES V   4343   789 - 796  2001

    　View Summary

    Lithium containing droplet and cluster targets irradiated by laser pulses are proposed as prospective source of for soft x-ray lithography. Analytical model and simulations show that laser with repetition rate of several MHz with energy of several mJ and pulse duration 10 ps is required.

    DOI

  • Laser detection of the parameters of small solid particle located in air

    A Andreev, T Ueda, M Wakamatsu, A Golub

    LASER OPTICS 2000: SOLID STATE LASERS   4350   161 - 170  2001

    　View Summary

    The problem of small particle size and material detection is important for industrial and environmental applications. Previous investigations have shown the possibility of using the laser breakdown method to achieve first goal; the sensitivity of this method is a thousand times higher than that of conventional methods. However, for small particle sizes, the damage threshold of the solid target in this case is very close to the breakdown point of pure air. After breakdown, there is a small volume of dense hot plasma that emits radiation. We analyzed this radiation especially at late stage using an analytical model and simulation code as well as by experiment, and found that the emission intensity varied depending on the laser type and plasma parameters including initial particle size.

    DOI

  • Spectroscopic detection of ammonia using diode-pumped difference-frequency generation

    T Ueda, M Wada, T Sugiyama, S Nakajima, T Umezawa, S Araki, T Kudou

    GROWTH, FABRICATION, DEVICES, AND APPLICATIONS OF LASER AND NONLINEAR MATERIALS   4268   21 - 25  2001

    　View Summary

    Use of photons for in-situ measurements of various objects provides a number of benefits, such as precise real-time measurement with no effect on the measured objects. Our research aims to develop an in-situ measurement technology that uses the benefits of photons and is ideal for applications in production lines. We succeeded in developing a tunable laser beam source to obtain the spectral line width of 5 MHz and a continuous wavelength sweep bandwidth of 200 nm, thus achieving our initial target. We believe that these characteristics are sufficient for use in absorption spectroscopy measurement of gases. For a 2.5-2.7 mum-band quantum infrared photo detector, we achieved the initial target of D* = 1 to 3 x10(11) cmHz(1/2)/W (at room temperature). For a 3-10 mum-band quantum infrared photo detector, we performed a study on designing an InAsP/InP multi-quantum well light-absorbing layer.

    DOI

  • High Sensitive Quartz Crystal Microphone using Micro-Machining Technology

    Toshitsugu Ueda, Husao Kousaka, Daisuke Yamazaki, Hisanori Hayashi

    IEEJ Transactions on Sensors and Micromachines   121 ( 12 ) 629 - 635  2001

    　View Summary

    We report the development of high sensitive Quartz Crystal Microphone using micro machining technology. The purpose of the microphone is to apply it as a sensor in gas analysis system. Moving part and gap of Quartz Crystal Microphone are manufactured by anisotropic etching and electro plating technology. It's sensitivity and anti vibration characteristics have been greatly improved compare with conventional microphones. Keywords: micro machining, Quartz, microphone, Gas analyzer. © 2001, The Institute of Electrical Engineers of Japan. All rights reserved.

    DOI

  • Simulation of laser plasma emission characteristics of small solid particles in different gas atmospheres at various pressures

    Er Andreev, Toshitsugu Ueda

    IEEJ Transactions on Sensors and Micromachines   121 ( 11 ) 593 - 598  2001

    　View Summary

    The problem of small solid particle size and material detection is important for industrial and environmental applications. Previous investigations have shown the possibility of using the laser breakdown method to address the first issue
    the sensitivity of this method is a thousand times higher than that of conventional methods. However, for small particle sizes, the damage threshold of the solid target in this case is very close to the breakdown point of pure gas. After breakdown, there is a small volume of dense hot plasma that emits radiation. We analyzed this radiation especially at the late stage using an analytical model and simulation code, and found that the emission intensity varied depending on the laser type and plasma parameters including initial particle size. © 2001, The Institute of Electrical Engineers of Japan. All rights reserved.

    DOI

  • High-Sensitive Mesurement Technology for IR Spectroscopy

    Tadashi Sugiyama, Toshitsugu Ueda, Morio Wada, Shinichirou Nakajima, Toshimasa Umezawa

    Proceedings of The 5th Symposium Advanced Photon Processing and Mesurement Technology     57 - 58  2001

  • Development of In-situ Nono-Particle Measurement

    Toshitsugu Ueda, M. Wakamatsu, L.G.Zimne, H. Hayashi, T. Sugiyama, A.A. Andreev

    Proceedings of the 5th Symposium Advanced Photon Processing and Measurement Technology     55 - 56  2001

  • Detection of Carbon and Cluster Parameter by Laser-Induced Plasms Line Radiation

    A.Andreev, T.Ueda

    IWFAC'2001'Fulluence and Atomic Clusters'in Saint-Petersburg     288 - 288  2001

  • Growth of strain-balanced InAsP/InP/InGaAs multiple quantum well structures for mid-infrared photodetectors

    M Wada, S Araki, T Kudou, T Ueda

    CLEO(R)/PACIFIC RIM 2001, VOL I, TECHNICAL DIGEST     526 - 527  2001

    　View Summary

    This report discusses the growth of new strain-balanced InAsP, InP, and InGaAs multiple quantum well structures with +2.0% strained InAsP wells, InP barriers and -2.0% strained InGaAs layers for mid-infrared quantum well infrared photodetectors.

  • Particle Elements and Size Measurement Using LIB

    T.Ueda, M.Wakamatsu, H.Hayashi, T.Sugiyama, A.Andreev

    18th Sensor Symposium, May, 30     319 - 324  2001

  • Development of InGaAs photodiodes for near-infrared spectroscopy

    M.Wada, S.Araki, T.Kudou, T.Umezawa, S.Nakajima, T.Ueda

    18th Sensor Symposium, May, 29     99 - 103  2001

  • In-situ Spectroscopic Measurement of Gas Using Tunable Lasers and InGaAs Photodiodes

    Tadashi Sugiyama, Toshitsugu Ueda, Morio Wada, Shinichi Nakajima

    18th Sensor Symposium, May, 29     105 - 108  2001

  • Simulation of laser plasma emission characteristics of small solid particles in different gas atmospheres at various pressures

    A.Andreev, T.Ueda

    18th Sensor Symposium, May, 30     325 - 330  2001

  • Laser with SBS Pulse Compression for LIBS

    T.Ueda, V.E.Yashin, S.A.Chizhov, R.L.Sabirov, K.Lavrentev, A. Andreev, M.Wakamatsu, H.Hayashi, T.Sugiyama

    18th Sensor Symposium, May, 29     313 - 318  2001

  • Optimal lithium targets for laser-plasma lithography

    AA Andreev, T Ueda, J Limpouch

    EMERGING LITHOGRAPHIC TECHNOLOGIES V   4343   789 - 796  2001

    　View Summary

    Lithium containing droplet and cluster targets irradiated by laser pulses are proposed as prospective source of for soft x-ray lithography. Analytical model and simulations show that laser with repetition rate of several MHz with energy of several mJ and pulse duration 10 ps is required.

    DOI

  • Laser detection of the parameters of small solid particle located in air

    A Andreev, T Ueda, M Wakamatsu, A Golub

    LASER OPTICS 2000: SOLID STATE LASERS   4350   161 - 170  2001

    　View Summary

    The problem of small particle size and material detection is important for industrial and environmental applications. Previous investigations have shown the possibility of using the laser breakdown method to achieve first goal; the sensitivity of this method is a thousand times higher than that of conventional methods. However, for small particle sizes, the damage threshold of the solid target in this case is very close to the breakdown point of pure air. After breakdown, there is a small volume of dense hot plasma that emits radiation. We analyzed this radiation especially at late stage using an analytical model and simulation code as well as by experiment, and found that the emission intensity varied depending on the laser type and plasma parameters including initial particle size.

    DOI

  • Spectroscopic detection of ammonia using diode-pumped difference-frequency generation

    T Ueda, M Wada, T Sugiyama, S Nakajima, T Umezawa, S Araki, T Kudou

    GROWTH, FABRICATION, DEVICES, AND APPLICATIONS OF LASER AND NONLINEAR MATERIALS   4268   21 - 25  2001

    　View Summary

    Use of photons for in-situ measurements of various objects provides a number of benefits, such as precise real-time measurement with no effect on the measured objects. Our research aims to develop an in-situ measurement technology that uses the benefits of photons and is ideal for applications in production lines. We succeeded in developing a tunable laser beam source to obtain the spectral line width of 5 MHz and a continuous wavelength sweep bandwidth of 200 nm, thus achieving our initial target. We believe that these characteristics are sufficient for use in absorption spectroscopy measurement of gases. For a 2.5-2.7 mum-band quantum infrared photo detector, we achieved the initial target of D* = 1 to 3 x10(11) cmHz(1/2)/W (at room temperature). For a 3-10 mum-band quantum infrared photo detector, we performed a study on designing an InAsP/InP multi-quantum well light-absorbing layer.

    DOI

  • High Sensitive Quartz Crystal Microphone using Micro-Machining Technology

    Toshitsugu Ueda, Husao Kousaka, Daisuke Yamazaki, Hisanori Hayashi

    IEEJ Transactions on Sensors and Micromachines   121 ( 12 ) 629 - 635  2001

    　View Summary

    We report the development of high sensitive Quartz Crystal Microphone using micro machining technology. The purpose of the microphone is to apply it as a sensor in gas analysis system. Moving part and gap of Quartz Crystal Microphone are manufactured by anisotropic etching and electro plating technology. It's sensitivity and anti vibration characteristics have been greatly improved compare with conventional microphones. Keywords: micro machining, Quartz, microphone, Gas analyzer. © 2001, The Institute of Electrical Engineers of Japan. All rights reserved.