Updated on 2022/05/17

写真a

 
SAITO, Mikiko
 
Affiliation
Research Council (Research Organization), Research Organization for Nano & Life Innovation
Job title
Senior Researcher(Professor)

Degree

  • Waseda university   Ph.D.

Professional Memberships

  •  
     
     

    エレクトロニクス実装学会

  •  
     
     

    Electochemical Society

  •  
     
     

    電気化学学会

  •  
     
     

    表面技術学会

 

Research Areas

  • Nano/micro-systems

Research Interests

  • ナノデバイス造形

Papers

  • Microstructure, morphology and magnetic property of (001)-textured MnAlGe Films on Si/SiO<inf>2</inf> substrate

    Rie Y. Umetsu, Satoshi Semboshi, Yoshifuru Mitsui, Hirokazu Katsui, Yoshito Nozaki, Isamu Yuitoo, Teruaki Takeuchi, Mikiko Saito, Hiroshi Kawarada

    Materials Transactions   62 ( 5 ) 680 - 687  2021

     View Summary

    Substrate heating effects on the microstructure and magnetic properties of MnAlGe films grown on Si/SiO2 substrate by sputtering system were investigated. The MnAlGe film fabricated by low-temperature substrate heating demonstrated amorphous phase and paramagnetic property. The film of c-axis orientation associated with the Cu2Sb-type structure was obtained by sputtering at a substrate heating temperature of 270°C and it exhibited perpendicular magnetic anisotropy. From the magnetization curves measured at room temperature, the uniaxial magnetic anisotropy energy, Ku, was evaluated to be in the order of 106 erg/cm3, which is consistent with the literature, although the heating processing and temperature are slightly different. Microstructural observation indicated that the c-axis oriented grains were isolated in the matrix of the amorphous phase. The film lost the c-axis orientation at elevated substrate heating temperature, resulting in loss of the anisotropic magnetic property.

    DOI

  • Metal Deposition using Solution on High-Density and Well-Aligned CNTs

    M. Saito, H. Kuwae, W. Norimatsu, M. Kusunoki, J. Mizuno, S. Koga, H. Nishikawa

    Proceesing-2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020 9229813    2020  [Refereed]

    Authorship:Lead author

  • Fabrication of Nanoporous Cu Sheet and Application to Bonding for High-Temperature Applications

    S. Koga, H. Nishikawa, H .Nishikawa, M. Saito, J. Mizuno

    J. ELECTRONIC MATERIALS   49  2020  [Refereed]

  • Low Temperature Flip Chip Bonding Using Squeegee-Embedded Au Nanoporous Bump Activated by VUV/O-3 Treatment

    W. Fu, T. Kaneda, A. Okada, K. Matsunaga, S. Shoji, H. Nishikawa, M. Saito, J. Mizuno

    J. ELECTRONIC MATERIALS   47 ( 10 ) 5952 - 5958  2020  [Refereed]

    DOI

  • Cuナノポーラスシートを用いた接合部の劣化挙動の解明

    古賀 俊一, 齋藤 美紀子, 水野 潤, 西川 宏

    第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集     73 - 76  2019.01  [Refereed]

  • 異種金属を用いたナノポーラス構造による界面形成現象の比較

    古賀 俊一, 齋藤 美紀子, 水野 潤, 西川 宏

    第28回マイクロエレクトロニクスシンポジウム論文集     273 - 276  2018.09

  • Control for Au-Ag Nanoporous Structure by Electrodeposition and Dealloying

    Mikiko Saito

    2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings    2018.09  [Refereed]

  • Fabrication of ZnO-Based Thermoelectric Micro-Devices by Electrodeposition

    Hinako Matsuo

    J. Electrochem. Soc.   165   D417 - D422  2018.04  [Refereed]

  • Effect of poly(N-vinyl-pyrrolidone) on electrochemical production of Cu nanoparticles

    Mikiko Saito, Tomohiro Ishii, Hidemichi Fujiwara, Takayuki Homma

    Journal of the Electrochemical Society   165 ( 2 ) E50 - E57  2018  [Refereed]

     View Summary

    Cu nanoparticles were synthesized via electrochemical deposition and the effect of the addition of poly(N-vinyl-pyrrolidone) (PVP) and pH on the properties of the nanoparticles was investigated. The Cu nanoparticles were prepared from an electrolyte containing copper acetate (pH 5.50) or copper sulfate (pH 4.14) by collecting the dispersed particles in the solution after electrochemical reduction. With the use of the acetate bath, formation of Cu2O at -0.2 and -1.5 V vs. Ag/AgCl was confirmed. On the other hand, Cu2O formation was not observed with the sulfate bath due to the lower pH, and the Cu nanoparticles could not be obtained at the potential of -1.5 V vs. Ag/AgCl. Surface enhanced Raman spectroscopy with plasmon sensors was used to investigate the transformations of PVP during electrolysis under the different conditions when Cu particles were and were not formed. For the dispersed nanoparticles in the electrolyte, it was observed that the C=O and C-N peaks of PVP also exhibited a red-shift. It was thus confirmed that PVP was coordinated to both the cathode electrode and dispersed nanoparticles in the electrolyte upon electrochemical reduction.

    DOI

  • Simultaneous Measurement of Kinetic Mechanical Properties and Chemical Structure:Tribological Analysis (2)

    Yanagisawa Masahiro, Saito Mikiko, Kunimoto Masahiro, Homma Takayuku

    Abstract of annual meeting of the Surface Science of Japan   37 ( 0 )  2017

    CiNii

  • Corporate-Feed Slotted Waveguide Array Antenna in the 350-GHz Band by Silicon Process

    Karim Tekkouk, Jiro Hirokawa, Kazuki Oogimoto, Tadao Nagatsuma, Hiroyuki Seto, Yoshiyuki Inoue, Mikiko Saito

    IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION   65 ( 1 ) 217 - 225  2017.01  [Refereed]

     View Summary

    A corporate-feed slotted waveguide array antenna with broadband characteristics in terms of gain and reflection in the 350-GHz band is proposed. To improve the etching accuracy of the thin laminated plates with the conventional diffusion bonding process, a new fabrication process has been developed, where the etching accuracy is lower than +/- 5 mu m. In this process, the laminated plates are made with silicon wafers and etched by deep reactive ion etcher process. These are gold plated then bonded with the diffusion bonding process. The estimated effective conductivity of the gold plated wafer is 1.6 x 10(7) S/m. The loss per unit length is 1.1 dB/cm. A 16x16 element array antenna has been designed and fabricated in the 350-GHz band with the proposed process. The broadband characteristic in terms of the antenna gain is demonstrated for the first time by measurement in this frequency band. The 3-dB down gain bandwidth is 50.8 GHz in simulation and is 44.6 GHz in measurement.

    DOI

  • Transmission-type plasmonic sensor for surface-enhanced Raman spectroscopy

    Masahiro Yanagisawa, Mikiko Saito, Masahiro Kunimoto, Takayuki Homma

    APPLIED PHYSICS EXPRESS   9 ( 12 )  2016.12  [Refereed]

     View Summary

    We present a novel optical device for the analysis of chemical surface properties utilizing surface-enhanced Raman scattering. The device, a transmission-type plasmonic sensor (TPS), offers the advantages of high sensitivity, nondestructive sample characterization, simple setup, and low-cost fabrication. The TPS is composed of Ag nanoparticles (NPs) deposited on a convex quartz glass substrate. The enhanced Raman spectrum is acquired by focusing a laser beam perpendicular to the sample surface through the substrate. The laser beam generates plasmon polarization in droplet-shaped Ag NPs at the sensor/sample interface. Our results indicate the potential of the device as a versatile surface-analytical tool. (C) 2016 The Japan Society of Applied Physics

    DOI

  • Transmission-type plasmonic sensor for surface-enhanced Raman spectroscopy

    Masahiro Yanagisawa, Mikiko Saito, Masahiro Kunimoto, Takayuki Homma

    APPLIED PHYSICS EXPRESS   9 ( 12 )  2016.12  [Refereed]

     View Summary

    We present a novel optical device for the analysis of chemical surface properties utilizing surface-enhanced Raman scattering. The device, a transmission-type plasmonic sensor (TPS), offers the advantages of high sensitivity, nondestructive sample characterization, simple setup, and low-cost fabrication. The TPS is composed of Ag nanoparticles (NPs) deposited on a convex quartz glass substrate. The enhanced Raman spectrum is acquired by focusing a laser beam perpendicular to the sample surface through the substrate. The laser beam generates plasmon polarization in droplet-shaped Ag NPs at the sensor/sample interface. Our results indicate the potential of the device as a versatile surface-analytical tool. (C) 2016 The Japan Society of Applied Physics

    DOI

  • Transmission-type plasmonic sensor for surface-enhanced Raman spectroscopy

    Yanagisawa Masahiro, Saito Mikiko, Kunimoto Masahiro, Homma Takayuki

    Appl. Phys. Express   9 ( 12 )  2016.11  [Refereed]

     View Summary

    We present a novel optical device for the analysis of chemical surface properties utilizing surface-enhanced Raman scattering. The device, a transmission-type plasmonic sensor (TPS), offers the advantages of high sensitivity, nondestructive sample characterization, simple setup, and low-cost fabrication. The TPS is composed of Ag nanoparticles (NPs) deposited on a convex quartz glass substrate. The enhanced Raman spectrum is acquired by focusing a laser beam perpendicular to the sample surface through the substrate. The laser beam generates plasmon polarization in droplet-shaped Ag NPs at the sensor/sample interface. Our results indicate the potential of the device as a versatile surface-analytical tool.

    CiNii

  • Study of Multilayer X-ray Absorbers to Improve Detection Efficiency of TES X-ray Microcalorimeter Arrays

    T. Hayashi, K. Nagayoshi, H. Muramatsu, N. Y. Yamasaki, K. Mitsuda, M. Saito, T. Homma, T. Hara, H. Noda

    JOURNAL OF LOW TEMPERATURE PHYSICS   184 ( 1-2 ) 257 - 262  2016.07  [Refereed]

     View Summary

    We report the fabrication and evaluation of the Cu/Bi bilayer absorber with electrodeposition. We designed the Cu/Bi absorber to satisfy the requirements for scanning transmission electron microscope (STEM). The residual resistivity ratios of films of Cu and Bi with electrodeposition was and , respectively; these values are sufficient for the requirements of STEM. We found that the Cu/Bi bilayer absorber TES microcalorimeter experienced a pulse-shape variation and we considered that these variations were caused by the quality of the contact surface between the absorber and TES. In addition, we examined the structure of the absorber using focus ion beam analysis and STEM. The results suggest that an oxidation between the Cu and seed layer, in which the layer is an electrode for electrodeposition, yielded variations. Moreover, thermal simulation suggests that the thermal conduction between the absorber and TES caused variations. The results of this study will improve the process of Bi electrodeposition.

    DOI

  • Effect of Isothermal Aging at 250 °C on Shear Strength of Joints Using Au Nanoporous Nonding for Die Attach

    Hiroshi Nishikawa, Kaori Matsunaga, Min-Su Kim, Mikiko Saito, Jun Mizuno

    Proc. of IMAPS International Conference and Exhibition on High Temperature Electronics (HiTEC2016)     143 - 147  2016.05

  • Cu/Cu Bonding Using a Au Nanoporous Sheet by Electrochemical Corrosion

    Kaori MATSUNAGA, Min-Su KIM, Hiroshi NISHIKAWA, Mikiko SAITO, Jun MIZUNO

    22nd Symposium on "Microjoining and Assembly Technology in Electronics"     89 - 92  2016.02  [Refereed]

  • Simultaneous measurement of kinetic mechanical properties and chemical structure: Tribology (1)

    Yanagisawa Masahiro, Saito Mikiko, Kunimoto Masahiro, Homma Takayuki

    Abstract of annual meeting of the Surface Science of Japan   36 ( 0 )  2016  [Refereed]

    CiNii

  • Corporate-Feed Slotted Wavguide Array Antenna at 350 GHz Band by Silicon Process

    Karim Tekkouk, Jiro Hirokawa, Kazuki Oogimoto, Tadao Nagatsuma, Hiroyuki Seto, Yoshiyuki Inoue, Mikiko Saito

    2016 IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM     1197 - 1198  2016  [Refereed]

     View Summary

    A corporate feed slotted waveguide array antenna with broadband characteristics in term of gain in the 350 GHz band is achieved by measurement for the first time. The etching accuracy for thin laminated plates of the diffusion bonding process with conventional chemical etching is limited to +/- 20 mu m. This limits the use of this process for antenna fabrication in the submillimeter wave band where the fabrication tolerances are very severe. To improve the etching accuracy of the thin laminated plates, a new fabrication process has been developed. Each silicon wafer is etched by DRIE (deep reactive ion etcher) and is plated by gold on the surface. This new fabrication process provides better fabrication tolerances about +/- 5 mu m using wafer bond aligner. The thin laminated wafers are then bonded with the diffusion bonding process under high temperature and high pressure. To validate the proposed antenna concepts, four antenna prototypes have been designed and fabricated in the 350 GHz band. The 3dB-down gain bandwidth is about 35GHz by this silicon process while it was about 15GHz by the conventional process using metal plates in measurement.

    DOI

  • Plate-Laminated Corporate-Feed Slotted Waveguide Array Antenna at 350-GHz Band by Silicon Process

    Karim Tekkouk, Jiro Hirokawa, Kazuki Oogimoto, Tadao Nagatsuma, Hiroyuki Seto, Yoshiyuki Inoue, Mikiko Saito

    2016 INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION (ISAP)     538 - 539  2016  [Refereed]

     View Summary

    A corporate feed slotted waveguide array antenna with broadband characteristics in term of gain in the 350 GHz band is achieved by measurement for the first time. The etching accuracy for thin laminated plates of the diffusion bonding process with conventional chemical etching is limited to +/- 20 mu m. This limits the use of this process for antenna fabrication in the submillimeter wave band where the fabrication tolerances are very severe. To improve the etching accuracy of the thin laminated plates, a new fabrication process has been developed. Each silicon wafer is etched by DRIE (deep reactive ion etcher) and is plated by gold on the surface. This new fabrication process provides better fabrication tolerances about +/- 5 mu m using wafer bond aligner. The thin laminated wafers are then bonded with the diffusion bonding process under high temperature and high pressure. To validate the proposed antenna concepts, an antenna prototype has been designed and fabricated in the 350 GHz band. The 3dB-down gain bandwidth is about 44.6 GHz by this silicon process while it was about 15GHz by the conventional process using metal plates in measurement.

  • Plate-Laminated Corporate-Feed Slotted Waveguide Array Antenna at 350-GHz Band by Silicon Process

    Karim Tekkouk, Jiro Hirokawa, Kazuki Oogimoto, Tadao Nagatsuma, Hiroyuki Seto, Yoshiyuki Inoue, Mikiko Saito

    2016 INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION (ISAP)     538 - 539  2016  [Refereed]

     View Summary

    A corporate feed slotted waveguide array antenna with broadband characteristics in term of gain in the 350 GHz band is achieved by measurement for the first time. The etching accuracy for thin laminated plates of the diffusion bonding process with conventional chemical etching is limited to +/- 20 mu m. This limits the use of this process for antenna fabrication in the submillimeter wave band where the fabrication tolerances are very severe. To improve the etching accuracy of the thin laminated plates, a new fabrication process has been developed. Each silicon wafer is etched by DRIE (deep reactive ion etcher) and is plated by gold on the surface. This new fabrication process provides better fabrication tolerances about +/- 5 mu m using wafer bond aligner. The thin laminated wafers are then bonded with the diffusion bonding process under high temperature and high pressure. To validate the proposed antenna concepts, an antenna prototype has been designed and fabricated in the 350 GHz band. The 3dB-down gain bandwidth is about 44.6 GHz by this silicon process while it was about 15GHz by the conventional process using metal plates in measurement.

  • High temperature reliability of joints using a Au nanoporous sheet

    Kaori MATSUNAGA, Min-Su KIM, Hiroshi NISHIKAWA, Mikiko SAITO, Jun MIZUNO

        147 - 150  2015.09

  • Improved Low Temperature Gold-Gold Bonding Using Nanoporous Powder Bump Using Vacuum Ultraviolet Irradiation Pre-treatment

    Tatsushi Kaneda, Jun Mizuno, Akiko Okada, Kaori Matsunaga, Shuichi Shoji, Mikiko Saito, Hiroshi Nishikawa

    Proc. of 2015 International Conference on Electronics Packaging and IMAPS ALL Asia Conference     473 - 477  2015.04

    DOI

  • ダイボンディング用のAuナノポーラスシートの作製

    松永 香織, Min-Su Kim, 西川 宏, 齋藤 美紀子, 水野 潤

    第21回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集     427 - 428  2015.02

  • Fabrication of Pi-structured Bi-Te thermoelectric micro-device by electrodeposition

    Kazuho Uda, Yuta Seki, Mikiko Saito, Yoshiaki Sonobe, Yu-Chin Hsieh, Hidefumi Takahashi, Ichiro Terasaki, Takayuki Homma

    ELECTROCHIMICA ACTA   153   515 - 522  2015.01  [Refereed]

     View Summary

    A Pi-structured Bi-Te micro-thermoelectric device with a large upper electrode, i.e., an umbrella-type device, was fabricated via electrodeposition, and the effect of the size of the electrode was evaluated. The Bi-Te thermoelectric materials were electrodeposited from HNO3-based aqueous electrolyte. The device consisted of eight arrays, each consisting of 110 thermoelectric units, each of which was electrodeposited onto the patterned substrate with an array of 50 x 50 mu m(2) holes that were 20 mu m deep. The deposition conditions for the n-type and p-type Bi-Te films were optimized to enable patterned electrodeposition of the materials to yield dense and uniform deposits. Accordingly, the materials were selectively deposited in a pattern to fabricate the thermoelectric micro-device. The resultant umbrella-type device, whose electrode is 1.65 times larger than smaller electrode, generated 4.57 times more power than the device with a smaller electrode. Therefore, we confirmed the improvement power by using an umbrella-type device. (C) 2014 Elsevier Ltd. All rights reserved.

    DOI

  • Trap-state passivation of titania nanotubes by electrochemical doping for enhanced photoelectrochemical performance

    Lok-kun Tsui, Mikiko Saito, Takayuki Homma, Giovanni Zangari

    JOURNAL OF MATERIALS CHEMISTRY A   3 ( 1 ) 360 - 367  2015  [Refereed]

     View Summary

    TiO2 nanotubes are widely investigated materials for photoelectrochemical water splitting, but the presence of trap states limits their performance by facilitating the recombination of electron/hole pairs. In this investigation we unequivocally demonstrate that the photocurrent improvement observed in TiO2 nanotubes after performing electrochemical doping with hydrogen or lithium ions is due to trap state passivation. Specifically, electrochemical impedance spectroscopy evidences that trap state defects disappear upon electrochemical doping, concurrent with an increase in the electron lifetime and faster photocurrent transients. This results in a two-fold enhancement in the photocurrent under simulated sunlight at 1.0 V vs. SCE. Li intercalation was confirmed and the structure as well as the composition of the modified nanotubes was elucidated by GDOES, XPS, and TEM.

    DOI

  • Effect of Au nanoporous structure on bonding strength

    Kaori Matsunaga, Min-Su Kim, Hiroshi Nishikawa, Mikiko Saito, Jun Mizuno

    2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC)   Article number 7111127   830 - 833  2015  [Refereed]

     View Summary

    Recently, several materials and joining processes have been proposed as alternatives to high-Pb-containing solders. There has been an increasing focus on developing solid-state bonding interconnection processes based on sintering, such as bonding techniques using Ag or Cu nanoparticles. However, sintered nanoparticle layers tend to have voids that result from solvent residue and dispersing agents. The voids in the sintered layer degrade the reliability of the joints. Therefore, we have proposed a solid-state bonding technique without solvents and flux using a nanoporous sheet. A nanoporous sheet can be made from binary alloy systems by dissolving the less noble component from the alloy selectively. A bonding technique using nanomaterials could reduce the bonding temperature because of the high reactive nanoporous surface. In this study, Au nanoporous sheets were fabricated by dealloying a Au-Ag alloy into an HNO3 solution, and the effects of the Au nanoporous structure on joint bonding strength were investigated. After dealloying, Au nanoporous sheets were set between bare Cu substrates. The samples were bonded at various process temperatures under a nitrogen atmosphere. As a result, the joint bonded at 300 degrees C, using the Au nanoporous sheet with a dealloying time of 1 h, showed a high shear strength of about 20 MPa. It was found that joining using Au nanoporous bonding was successfully achieved.

  • Fabrication of Plate-laminated Waveguide for 350GHz Band by Silicon Process

    Jiro Hirokawa, Satoshi Suetsugu, Yusuke Minamikata, Tadao Nagatsuma, Hiroyuki Seto, Yoshiyuki Inoue, Mikiko Saito

    2015 1st URSI Atlantic Radio Science Conference (URSI AT-RASC)    2015  [Refereed]

     View Summary

    © 2015 International Union of Radio Science (URSI).This paper presents the fabrication of plate-laminated waveguides and cavities for 350GHz band by silicon process where the tolerance is less than several μm. We measure the transmission loss of the waveguide and the Q factors of the cavities, and then estimate the equivalent conductivity. We will also fabricate the plate-laminated waveguide slot array antennas (Y.Miura, J.Hirokawa et al., IEEE Trans. Antennas Propagat., 59, 2011, pp.2844-2851) and show the measured results in the conference.

    DOI

  • Depth profiles of absorbed hydrogen in Ni-Nb-Zr amorphous alloy ribbons by Glow Discharge Optical Emission Spectroscopy

    R.Y. Umetsu, M. Saito, T. Sasaki, T. Sekiguchi, J. Mizuno, H. Kawarada

    Open Journal of Metal   4 ( 4 ) 112 - 119  2014.12  [Refereed]

    DOI

  • Planar-type micro-electromagnetic actuators using patterned thin film permanent magnets and mesh type coils

    Chao Zhi, Tadahiko Shinshi, Mikiko Saito, Kunio Kato

    SENSORS AND ACTUATORS A-PHYSICAL   220   365 - 372  2014.12  [Refereed]

     View Summary

    In this paper, we propose several types of planar micro-electromagnetic actuator that can be applied in micro-pumps and micro-valves. The various types each consist of a thin film permanent magnet (TFPM), a micro-coil and, in some cases, a ferromagnetic layer. The magnetic properties of a TFPM with a multilayered structure, comprising 300 nm thick NdFeB and 10 nm thick Ta layers deposited sequentially, are as high as bulk NdFeB magnets. Conventional micro-electromagnetic actuators consist of a bulk permanent magnet and a spiral micro-coil, whereas the actuators proposed in this paper consist of segmented patterns of TFPM, such as line/space and chessboard patterns, and mesh coils surrounding the segmented patterns. The TFPMs are segmented in order to reduce the demagnetization effect and to generate a large flux density. The proposed micro-coils possess a 2D structure and are easy to fabricate compared with spiral type micro-coils. The results of simulation show that the electromagnetic forces generated by actuators with segmented TFPMs are several times higher than one without segmentation. Furthermore, the actuation force performance is enhanced by covering the TFPM pattern with a ferromagnetic layer of Ni55Fe45 permalloy. The electromagnetic actuators are fabricated by a fully integrated MEMS process. The measured magnetic flux densities generated by the patterned TFPMs agree with the simulated results. The electromagnetic force between the patterned TFPM and the micro-coil is measured by an electronic force balance. Due to alignment errors between the micro-magnet and micro-coil, the experimentally measured forces are from 70% to 90% of the simulated ones. (C) 2014 Elsevier B.V. All rights reserved.

    DOI

  • Nano-porous Structure Control under Electrodeposition and Dealloying Conditions for Low-temperature Bonding

    Mikiko Saito, Kaori Matsunaga, Jun Mizuno, Hiroshi Nishikawa

    Proc. of 5th Electronics System-Integration Technology Conference     S8P4-1 - S8P4-4  2014.09

    DOI

  • Au ナノポーラス接合の接合材表面構造と接合強度の関係

    松永 香織, Min-Su Kim, 西川 宏, 齋藤 美紀子, 水野 潤

    MES 2014 エレクトロニクス実装学会 秋季大会 論文集     179 - 182  2014.09

  • Relationship between bonding conditions and strength for jonts using a Au nanoporous sheet

    Kaori Matsunaga, Min-Su Kim, Hiroshi Nishikawa, Mikiko Saito, Jun Mizuno

    Proceedings of 5th Electronics System-Integration Technology Conference     S95P5  2014.09

    DOI

  • Properties of Nanoporous Structures Obtained by Electrodeposition and Dealloying for Low-Temperature Bonding

    M. Saito

    5th Electronics System-Integration Technology Conference, ESTC 2014 Category numberCFP14TEM-ART     Article number 6962819  2014.09

  • B-1-52 Fabrication of Plate-laminated Waveguide Antennas for 350GHz band by Silicon Process

    Hirokawa J, Tomura T, Minamikata Y, Nagatsuma T, Seto H, Inoue Y, Kato K, Saito M

    Proceedings of the Society Conference of IEICE   2014 ( 1 )  2014.09  [Refereed]

    CiNii

  • Effect of Annealing on Magnetostrictive Properties of Fe-Co Alloy Thin Films

    Takashi Nakajima, Teruaki Takeuchi, Isamu Yuito, Kunio Kato, Mikiko Saito, Katsuhiro Abe, Toshio Sasaki, Tetsushi Sekiguchi, Shin-ichi Yamaura

    MATERIALS TRANSACTIONS   55 ( 3 ) 556 - 560  2014.03  [Refereed]

     View Summary

    The effect of the annealing temperature on the magnetostrictive properties of Fe-Co alloy thin films on quartz glass was systematically investigated. The saturation magnetostriction was 56 ppm for the Fe32Co68-sputtered thin film quenched from 673 K, and it increased to 159 ppm with increasing annealing temperature up to 1073K. The magnetostriction above 1093K significantly decreased with the emerging fcc phase in the Fe-Co alloy. SEM images showed that the crystal grains present in the fcc phase aggregated to form a discontinuous surface, which resulted in a decrease in the effective magnetostriction. Measurements of the magnetic properties by vibrating sample magnetometer and magnetic force microscopy revealed the enhancement of the magnetization at the crystal grain boundaries of Fe-Co alloy thin films with large magnetostriction. Thus, the heterogeneity of the magnetization can play a key role in inducing the large magnetostrictive effect.

    DOI

  • LOW-TEMPERATURE GOLD-GOLD BONDING USING SELECTIVE FORMATION OF NANOPOROUS POWDERS FOR BUMP INTERCONNECTS

    Hayata Mimatsu, Jun Mizuno, Takashi Kasahara, Mikiko Saito, Shuichi Shoji, Hiroshi Nishikawa

    2014 IEEE 27TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS)     1131 - 1134  2014  [Refereed]

     View Summary

    We proposed low-temperature Au-Au bump interconnects bonding using nanoporous Au-Ag powders as a connective adhesion. The nanoporous powders were formed by de-alloying Au-Ag alloy in HNO3 solution. To optimize the pore size, the influence of the annealing temperature on the porous structures was investigated. Selective transfer of the nanoporous powders on bumps was obtained by stamping process. Bonding strength of about 2.4 MPa was achieved at 150 degrees C by using nanoporous Au-Ag powders. Bonding interface was evaluated by scanning acoustic microscope and scanning electron microscopy. This result indicated that the nanoporous powder is a useful material for low-temperature Au-Au bonding.

  • Analyzing Hydrogen Charging pf Sputtered Ni-Nb-Zr Films Using Electrochemical Method

    M. Saito, R.Y. Umetsu, T. Sasaki, T. Sekiguch, J. Mizuno, H. Kawarada

    ovel Structural Metallic and Inorganic Materials (ISETS’13 and AMDI-4)     1229  2013.12

  • Depth Profile Analysis of Hydrogen in Ni-Nb-Zr Amorphous Ribbon by Glow Discharge Optical Emission Spectrometry

    R.Y. Umetsu, M. Saito, T. Sasaki, T. Sekiguch, J. Mizuno, H. Kawarada

    The International Symposium on Ecotopia Science 2013 and The 5th International Symposium on Advanced Materials Development and Integration of Novel Structural Metallic and Inorganic Materials (ISETS’13 and AMDI-4)     1235  2013.12

  • Nanoindentation analysis for mechanical properties of electroless NiP imprinting mold replicated from self-assembled-monolayer modified master mold

    Cheng Ping Lin, Mikiko Saito, Takayuki Homma

    Japanese Journal of Applied Physics   52 ( 11 )  2013.11  [Refereed]

     View Summary

    A NiP imprinting mold with patterns, whose size is from nanometer to submicrometer (170, 500, and 1000nm diameter), was fabricated by electroless deposition of NiP on a 3-aminopropyltriethoxysilane (APTES) modified master mold. The NiP deposit as a replicate mold was then detached from the master mold. The initial NiP deposition in patterns of the master mold was investigated
    moreover, nanoindentation was successfully performed on a single NiP pattern for investigating the hardness. The NiP had a similar grain size in different sizes of patterns of the master mold during the initial deposition, as well as the same hardness of the NiP patterns (approximately 12 GPa) was observed. These results indicated that the initial NiP deposition and hardness of NiP were not size dependent above 170 nm. The surface morphology of the NiP detached from the master mold and NiP pattern of different sizes were investigated as well. © 2013 The Japan Society of Applied Physics.

    DOI

  • Fabrication of electroless NiP nanoimprinting mold by replication of uv-treated and self-assembled-monolayer-modified cyclo-olefin polymer nanopatterns

    Cheng Ping Lin, Mikiko Saito, Takayuki Homma

    Electrochemistry   81 ( 9 ) 678 - 681  2013.09  [Refereed]

     View Summary

    An electroless NiP imprinting mold was fabricated through replication of a cyclo-olefin polymer (COP) master mold. The NiP was electrolessly deposited on a nanopatterned COP master mold, pretreated by ultraviolet (UV) irradiation prior to modification with 3-aminopropyltriethoxysilane (APTES). The NiP deposit as a "replicate" was then detached from the COP master mold. Additionally, by optimizing the UV irradiation period, APTES could be formed on the COP master mold for electroless deposition without disturbing the nanopattern geometry of the COP master mold. The water contact angle and surface morphology of the COP surface, and the adhesion strength between deposited NiP and the COP surface were investigated. © 2013 The Electrochemical Society of Japan, All rights reserved.

    DOI

  • Low-Temperature Au-Au Bonding Using Nanoporous Au-Ag Sheets

    Hayata Mimatsu, Jun Mizuno, Takashi Kasahara, Mikiko Saito, Hiroshi Nishikawa, Shuichi Shoji

    JAPANESE JOURNAL OF APPLIED PHYSICS   52 ( 5 )  2013.05  [Refereed]

     View Summary

    In this study, we proposed low-temperature Au-Au bonding using nanoporous Au-Ag sheets, fabricated by dealloying a Au-Ag sheet in HNO3 solution, as a joint layer. The influence of the annealing temperature on the pore structure and chemical properties of the sheets was investigated. The chemical composition of the sheet was analyzed by X-ray photoelectron spectroscopy (XPS). It was found that the strength of Au-Au bonding with the nanoporous sheet increased. A sheet treated with liquid N-2 was also tested; the strength of the Au-Au bond increased as a result of this low-temperature treatment. (c) 2013 The Japan Society of Applied Physics

    DOI

  • Transport properties of Ni-Nb-Zr glassy alloys and hydrogen absorbed alloys

    Rie Y. Umetsu, Hajime Yoshida, Mikio Fukuhara, Shin-ichi Yamaura, Toshio Sasaki, Tetsushi Sekiguchi, Mikiko Saito, Jun Mizuno, Hiroshi Kawarada

    Open Journal of Metal   3   37033 - 37033  2013  [Refereed]

  • Effect of hydrogen absorption on electrical transport properties for Ni36Nb24Zr40 amorphous alloy ribbons

    Rie Y. Umetsu, Hajime Yoshida, Mikio Fukuhara, Shin-Ichi Yamaura, Makoto Matsuura, Toshio Sasaki, Tetsushi Sekiguchi, Mikiko Saito, Jun Mizuno, Hiroshi Kawarada

    Materials Transactions   54 ( 8 ) 1339 - 1342  2013

     View Summary

    Electrical resistivity measurements in the temperature range from 6 to 300K were carried out in order to investigate the effects of the hydrogen absorption on the transport properties of Ni36Nb24Zr40 amorphous alloy ribbon. The electrical resistivity basically behaved negative temperature dependence in all prepared specimens of (Ni0.36Nb 0.24Zr0.40)100-xHx with 0 ≤ x &lt
    15. The absolute value of temperature coefficient of the resistivity, TCR, increased with increasing the amount of the absorbed hydrogen. In addition, it was also clear that the electrical resistivity gradually increased with the time just after electrochemically charging, and tended to saturate after about 800 ks at 300 K. The behavior of the gradual increase in the electrical resistivity with the time was explained by the model including two kinds of the relaxation times, being associated with the migration of the hydrogen from the sample surface. © 2013 The Japan Institute of Metals and Materials.

    DOI

  • Using Nano-Porous Au-Ag Sheets as a Joint Layer for Low-Temperature Au-Au Bonding

    Hayata Mimatsu, Jun Mizuno, Takashi Kasahara, Mikiko Saito, Hiroshi Nishikawa, Shuichi Shoji

    Proc. of IEEE CPMT Symposium Japan 2012 (ICSJ-2012)     277 - 280  2012.12

    DOI

  • Initial catalyzation analysis of electroless NiP nanoimprinting mold replicated from self-assembled monolayer modified nanopatterns

    Cheng Ping Lin, Mikiko Saito, Takayuki Homma

    ELECTROCHIMICA ACTA   82   75 - 81  2012.11  [Refereed]

     View Summary

    A nanoimprint lithography mold was fabricated through electroless deposition combined with self-assembled monolayer (SAM) modification. To copy nanopatterns as "replicates", NiP was electrolessly deposited on a nanopatterned master mold (made of SiO2/Si), whose surface was modified with 3-[2-(2-aminoethylamino)ethylamino]propyltrimethoxysilane (TAS). NiP deposits were then manually detached from the mold. SAM improves Pd catalyst coverage for electroless deposition, further improving the morphology of the electroless deposition of NiP on the nanopatterned master mold and controlling the adhesion strength between electroless deposited NiP and the nanopatterned master mold to a level appropriate for smooth detachment. The initial catalyzation process and mechanical properties (such as, the hardness and adhesion strength of the SiO2 substrate) of electroless deposited NiP were also systematically investigated. (c) 2012 Elsevier Ltd. All rights reserved.

    DOI

  • Measurement Technology for Hard Disk Interface : Application of Plasmonic Sensor-A Challenge to Sub-nanometer Scale-

    YANAGISAWA Masahiro, SAITO Mikiko, HOMMA Takayuki

    IEICE technical report. Magnetic recording   112 ( 294 ) 1 - 4  2012.11

     View Summary

    Chemical structure of ultra-thin lubricant film/DLC overcoat for 4Tbpsi and more was measured with plasmonic sensor and surface-enhanced Raman scattering spectroscopy. Depth profile of the chemical structure for the film system was also measured with a depth resolution of 0.1nm.

    CiNii

  • Measurement Technology for Hard Disk Interface:Application of Plasmonic Sensor : A Challenge to Sub-nanometer Scale

    YANAGISAWA Masahiro, SAITO Mikiko, HOMMA Takayuki

      112 ( 294 ) 1 - 4  2012.11

    CiNii

  • Laterally enhanced growth of electrodeposited Au to form ultrathin films on nonconductive surfaces

    Chiaki Kobayashi, Mikiko Saito, Takayuki Homma

    ELECTROCHIMICA ACTA   74   235 - 243  2012.07  [Refereed]

     View Summary

    We investigated the laterally enhanced growth of electrodeposited Au for fabricating nanogap electrodes. To enhance the lateral growth, we carried out electrodeposition over patterned electrodes onto a SiO2 surface modified with self-assembled monolayers (SAMs) or dendrimers with amine groups. The morphology and thickness of the Au films were controlled by adjusting deposition conditions such as duration, applied potential, and Au ion concentration in the bath. To investigate the mechanism of the laterally enhanced growth, the surface states of SAM- or dendrimer-modified SiO2 were analyzed by X-ray photoelectron spectroscopy (XPS). The XPS results indicate the existence of organic molecules and Au ions on the SiO2 surface, which suggests that laterally enhanced growth is induced by the Au ions coordinated on the amine groups of the organic molecules. To further analyze the mechanism of the laterally enhanced growth, we investigated the relationship between the morphology of the laterally enhanced growth of Au and the amount of Au ions on organic molecules. The laterally enhanced growth of Au is expected to be useful for fabricating thin film nanogap electrodes. (C) 2012 Elsevier Ltd. All rights reserved.

    DOI

  • S165011 Molecular structure analysis on magnetic disk surface with plasmonic sensor

    YANAGISAWA Masahiro, SAITO Mikiko, HOMMA Takayuki

    Mechanical Engineering Congress, Japan   2011   "S165011 - 1"-"S165011-5"  2011.09

     View Summary

    Ultra-thin DLC films and lubricant films are requested for high density magnetic recording. It was difficult for Raman spectroscopy to measure their molecular structures because of its low sensitivity. Newly-developed plasmonic sensor successfully acquired Raman spectrum of DLC films or lubricant/DLC interfaces with sub-nanometer thickness. Crystal structure of ultra-thin DLC films were slightly changed compared with that of thick films. Specifically, a graphite-like structure increases with decreasing thickness. It was found that organic and inorganic contaminations exist on a magnetic layer or a magnetic layer/DLC interface. According to the Raman spectrum analysis, a feature of adsorbed lubricant molecules of lubricant on the DLC film was confirmed.

    CiNii

  • Investigation on the Hardness and Morphology of Be-Cu for Probing Al Layers

    M. Saito, G. Kimoto, T. Homma

    NANOTECHNOLOGY (GENERAL) - 218TH ECS MEETING   33 ( 38 ) 65 - 72  2011  [Refereed]

     View Summary

    In this study, we evaluate the hardness and morphology of Al layers, which are constructed using Al / Si and alumina / Al / Si. The depth of the hollow in the Al sample, which has native oxide, was measured as 0.5 mu m using a Be-Cu probe under the applied force of 10 mN. The relationship between the applied force and the displacement can be explained by the Hertzian theory. In the case of alumina (20 nm, 50 nm) / Al / Si, the hollows were smaller than those predicted by the Hertzian theory. Cross-sectional observations revealed that the Al layer under alumina was deformed vertically and laterally. It was concluded that the breaking of alumina was induced by the deformation of Al.

    DOI

  • Effect of Tl-codeposition on Au Electrodeposition from Non-Cyanide Bath

    M. Saito, K. Inoue, K. Shiokawa, T. Homma

    FUNDAMENTALS OF ELECTROCHEMICAL GROWTH: FROM UPD TO MICROSTRUCTURES - SYMPOSIUM IN MEMORY OF PROF. EVGENI BUDEVSKI   25 ( 34 ) 87 - 96  2010  [Refereed]

     View Summary

    Effect of Tl on the electrodeposition behavior of Au was investigated by electrochemical analysis, total-reflection X-ray fluorescene analysis, XRD, glow discharge optical emission spectrometer (GD-OES) and hardness measurement. The deposition rate increased with an increase in the amount of Tl addition to the bath. Tl was co-deposited at the interface between the seed layer and the Au films, as well as in the films. In as-deposited condition, the Tl contained films exhibited higher hardness compared with the Tl-free films, while both of them showed almost the same hardness after annealing. It was suggested that the hardness is correlated with the crystal orientation of the grains.

    DOI

  • Al-Si合金膜のジンケ−ト処理プロセスに対する下地Si基板の影響

    齋藤美紀子

    表面技術   61   447 - 451  2010  [Refereed]

  • Simplified 20-μm pitch vertical interconnection process for 3D chip stacking

    Katsuyuki Sakuma, Noriyasu Nagai, Mikiko Saito, Jun Mizuno, Shuichi Shoji

    IEEJ Transactions on Electrical and Electronic Engineering   4   339 - 344  2009  [Refereed]

    DOI

  • Copper multilayer interconnection using ultravaiolet nanoimprint lithography with a double-deck mold and electroplating

    Noriyasu Nagai, Hiroshi Ono, Katsuyuki Sakuma, Mikiko Saito, Jun Mizuno, Shuichi Shoji

    Japanese Journal of Applied Physics   48   115001  2009  [Refereed]

    DOI

  • Preparation of electrodeposited Pt nano patterned electrode using UV-nano imprinting lithography

    M. Saito, J. Mizuno, H. Nishikubo, H. Fujiwara, T. Homma

    ECS Transactions   16 ( 25 ) 131 - 136  2009  [Refereed]

     View Summary

    We attempt to prepare the patterned electrode for the formation of nano particles using electrochemical deposition with the cathode whose surface has nano dot patterns. In particular, we applied electrodeposition of Pt and UV nano imprinting lithography (UV-NIL) to prepare the nano patterned electrode. In order to achieve higher activity, the deposition condition of Pt was optimized using additives such as polyethylene glycol (PEG). The surface activity of the Pt films was affected by molecular weight of PEG. It was revealed that the surface activity of the films deposited with the order of thousands of molecular weight of PEG indicated the highest effective current density among the examined films. The Pt films, which exhibited the highest current density, were adapted to fabricate nano-patterned electrode with 400 nm pith periodic structure using UV-NIL. ©The Electrochemical Society.

    DOI

  • Effect of Cu Seed Layers on the Properties of Electroplated Sn-Cu Films

    M. Saito, H. Sasaki, K. Katou, T. Toba, T. Homma

    JOURNAL OF THE ELECTROCHEMICAL SOCIETY   156 ( 5 ) E86 - E90  2009  [Refereed]

     View Summary

    Sn-Cu films were electroplated on Cu seed layers of various thicknesses. The velocity of the diffusion of Cu atoms from a seed layer into the electroplated Sn-Cu film was investigated, focusing on the effect of microstructural properties of the film. It was found that the diffusion velocity of Cu from a Cu seed layer into the electroplated Sn-Cu film increased with a decrease in the thickness of the Cu seed layer. Moreover, the film microstructure was influenced by the thickness of the Cu seed layer. When the crystalline quality of the Cu seed layer was inferior, a large lattice mismatch developed at the interface between the electroplated Sn-Cu film and the Cu seed layer. As a result of this lattice mismatch, many lattice defects and stress may exist at the interface between the electroplated Sn-Cu films and the Cu seed layers. Therefore, the lattice mismatch was considered to be related to the high-diffusion velocity of Cu from the Cu seed layer. Furthermore, the high-diffusion velocity of Cu was found to cause whisker formation. (C) 2009 The Electrochemical Society. [DOI: 10.1149/1.3090179] All rights reserved.

    DOI

  • Fabrication of multilayer interconnection using ultraviolet nanoimprint lithography

    Hiroshi Ono, Shuichi Shoji, Jun Mizuno, Mikiko Saito

    INSS 07: PROCEEDINGS OF THE FOURTH INTERNATIONAL CONFERENCE ON NETWORKED SENSING SYSTEMS     130 - +  2007  [Refereed]

     View Summary

    Advanced large scale integrated circuits (LSI) and smart sensor systems require nanoscale interconnection to transmit signals. In this work, an approach to realize multilayer interconnection based on ultraviolet nanoimprint lithography (UV-NIL) technology and copper electroplating is discussed. UV-NIL is a low-cost, mass-production technology. Nanoscale dot array patterns and line array patterns of nickel and copper were formed on a silicon substrate using UV-NIL in combination with electroplating. Imprinted 220 nm hole patterns and 150 nm line patterns were formed on photocurable resin with high dimensional accuracy. Using these resin patterns as a mask layer, 245 urn metal dot and 195 nm metal line array patterns were successfully fabricated by electroplating.

  • FABRICATION OF METALLIC NANOPATTERNS USING THE VACUUM TYPE UV-NIL EQUIPMENT

    MAKOTO FUKUHARA, MIKIKO SAITO, TAKAYUKI HOMMA, JUN MIZUNO, SHUICHI SHOJI, MAKOTO OHTAGUCHI, TAMANO HIRASAWA, GAKU SUZUKI, NORIHITO FUKUGAMI

    Asia-Pacific Conference of Transducers and Micro-Nano Technology   95-FT-A0144  2006.06

  • ELECTROCHEMICAL ANALYSIS OF ZINCATE TREATMENTS FOR Al AND Al ALLOY FILMS FOR UNDER BUMP METAL FORMATION

    Mikiko Saito

    Electrochim. Acta.   26   1017 - 1020  2005.11  [Refereed]

  • Fabrication of metallic nano patterns using a new photocurable resin durable for electrodeposition process

    Makoto Ohtaguchi, Tamano Hirasawa, Takeshi Osaki, Nobuji Sakai, Tomohiko Edura, Jun Mizuno, Mikiko Saito, Shuichi Shoji, Takayuki homma

    The 4th International Nanoimprint and Nanoprint Technology Conference 2005, Nara, Japan   20P-5-36   100 - 101  2005.10

  • 銀デンドライトにおける表面増強ラマン散乱

    柳沢雅広

    表面科学   Vol.26 ( No.9 ) 532 - 536  2005.09

  • Fabrication of Flat Micro-Gap Electrodes for Molecular Electronics

    TOMOHIKO EDURA, JUN MIZUNO, KEN TSUTSUI, MIKIKO SAITO, MASAHIDE TOKUDA, HARUMASA ONOZATO, TOSHIKO KOIZUMI, YASUO WADA, MASAMITSU HAEMORI, HIDEOMI KOINUMA

    Electrical Engineering in Japan   Vol.152 ( 2 ) 39 - 46  2005.07

    DOI

  • Preparation of nano-structured CoCu films by Electrodeposition

    M.Saito, H.Fujiwara, J.Mizuno, T.Homma

    Meeting Abstract MA2005-01,207th MEETING OF THE ELECTROCHEMICAL SOCIETY     1278  2005.05

  • Development of a Sub-micron Processing Method with Ion Implantation

    Seung Jun Yu, Keita Kawabe, Hideaki Ohkubo, Yoshimichi Ohki, Makoto Fujimaki, Makoto Fujimaki, Masaharu Hattori, Mikiko Saito, Yasuo Wada

    The transactions of the Institute of Electrical Engineers of Japan.A   125 ( 1 ) 69 - 70  2005  [Refereed]

     View Summary

    We have developed a precise sub-µm processing method by combining ion implantation and nano-plating. In order to show the applicability of this method, we have fabricated a mask for a Bragg grating, which has a striped gold structure with a height of 1.2 µm and a period of 1.59 µm on a 2-µm thick SiN membrane. We have also confirmed that the mask pattern can be transferred inside a silica glass by ion implantation. It is expected that this result can be utilized for the fabrication of optical communication devices. © 2005, The Institute of Electrical Engineers of Japan. All rights reserved.

    DOI

  • High efficiency electrochemical immuno sensors using 3D comb electrodes

    Nobuo Honda, Masashi Inaba, Takashi Katagiri, Shuichi Shoji, Hirotaka Sato, Takayuki Homma, Tetsuya Osaka, Mikiko Saito, Jun Mizuno, YasuoWada

    Biosensors and Bioelectronics   20 ( 11 ) 2306 - 2309  2005  [Refereed]  [International journal]

     View Summary

    To realize highly sensitive electrochemical immunoassays, a micro-fabricated three-dimensional (3D) electrode was fabricated and applied to enzyme immuno assay based on production of a redox species. The dimensions of the electrodes are 10 microm in width and 30 microm in height, with 20 microm spacing in between, and the 30 pairs of anode and cathode electrodes made up a single sensor. This structure lead to enhancement of the electrochemical reaction, nearly 100% of trap ratio of redox species. It can be applied to highly sensitive enzyme immuno sensing based on p-aminophenylphosphate (PAPP). Applicability of this technique to the immuno assay for one of the clinical diagnostic marker proteins (alpha-fetoprotein; AFP) from 6 to 500 ng/mL was demonstrated.

    DOI PubMed

  • Development of a Sub-micron Processing Method with Ion Implantation for the Fabrication of Optical Communication Devices

    Seungjun Yu, MakotoFujimaki, Keita Kawabe, Hideaki Ohkubo, Masaharu Hattori, Yoshimichi Ohki, Mikiko Saito, Yasuo Wada

    IEEJ Transactions on Fundamentals and Materials   Vol.125-A   69 - 71  2005.01  [Refereed]

  • 分子エレクトロニクス用マイクロギャップ平坦電極の作製

    江面知彦, 水野潤, 筒井謙, 齋藤美紀子, 徳田正秀, 小野里陽正, 小泉寿子, 和田恭雄

    電気学会論文誌C   124巻 ( 6 )  2004.06

    DOI

  • Miniaturized thin-film magnetic field probe with high spatial resolution for LSI chip measurement

    N Ando, N Masuda, N Tamaki, T Kuriyama, S Saito, K Kato, K Ohashi, M Saito, M Yamaguchi

    2004 INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SYMPOSIUM RECORD 1-3     357 - 362  2004  [Refereed]

     View Summary

    It is important to obtain the absolute value of current flowing through each power line on a chip of large-scale integrated (LSI) circuits by measurement because this current on an LSI chip is regarded as conductive noise. We have developed a thin-film magnetic field probe that has spatial resolution high enough to obtain the absolute value of high-frequency power current on an LSI chip. Spatial resolution was enhanced by miniaturizing the shielded loop coil, the detection part of the probe. The outer size of the new coil is 50 x 22 mum. In taking measurements with the new probe over a 60-mum-wide microstrip line used as a device under test (DUT), we obtained a 6-dB decrease point of 40 mum, which indicates the spatial resolution of the probe. This value is comparable to the typical width of power lines on an LSI chip, around 50 mum and is less than half that of our conventional probes, around 90 mum. In measurements with the new probe over an LSI chip, we obtained such a fine magnetic near-field distribution that the magnetic fields generated from the lines on the chip were separated. On-chip decoupling was also confirmed by using the new probe. The new probe enables direct verification of a circuit design for suppressing electromagnetic interference (EMI), while conventional coarse mapping of the magnetic near-field cannot be used to evaluate such conductive noise.

  • ナノレベルの平滑めっき膜の検討

    齋藤美紀子, 水野潤

    電気学会電子・情報・システム部門大会   GS1-2   680 - 682  2003.09

  • Influence of carbon inclusion on properties of electrodeposited CoNiFeMo thin films

    T Yokoshima, A Kawashima, T Nakanishi, T Osaka, M Saito, K Ohashi

    MAGNETIC MATERIALS, PROCESSES, AND DEVICES VII AND ELECTRODEPOSITION OF ALLOYS, PROCEEDINGS   2002 ( 27 ) 365 - 375  2003  [Refereed]

     View Summary

    An application of electrodeposited CoNiFeMoC soft magnetic thin films, which have high saturation magnetic flux density and high resistivity, to the magnetic recording head was investigated. Because the ductility of the CoNiFeMoC films was low, the head core using the CoNiFeMoC films was difficult to be prepared without being cracked. The ductility of CoNiFeMoC films was improved by the addition of saccharin in the bath which lowered carbon content of the films. By using such ductility-enhanced CoNiFeMoCS thin films, the structure of the magnetic recording head was successfully fabricated with no cracks.

  • Electrodeposition conditions of CoNiFe films, crystal structure, and evaluation of magnetic moments

    M Saito, K Ohashi

    MAGNETIC MATERIALS, PROCESSES, AND DEVICES VII AND ELECTRODEPOSITION OF ALLOYS, PROCEEDINGS   2002 ( 27 ) 241 - 253  2003  [Refereed]

     View Summary

    Cathodic polarization analyses was performed to investigate the shift of the fcc-bcc phase boundary and the change in the bee phase ratio in mixed phase for electroplated CoNiFe films. The electroplating conditions that reduced the ratio of the bee phase in the films were a larger over potential and a smaller cathodic current. The electro-deposition conditions that the fcc-bcc phase boundary shifted to the fcc-rich region were strongly related to an initial deposition rate of Fe atoms. This result is similar to that observed in rapidly quenched CoNiFe. In order to investigate the magnetic moments per atom, film density and Bs were evaluated. The magnetic moments per atom of Fe, Co and Ni were found to be nearly 3.0, 2.0 and 1.0 muB, respectively.

  • Evaluation of the Crystal Structure, Film Properties, and Bs of Electroplated CoNiFe Films”

    M. Saito

    J. Electrochemical Soc.   149   C642 - C647  2002.10  [Refereed]

  • The Effect of Preparation Conditions on Magnetic Properties of Electroplated high-Bs CoNiFe Films

    M. Saito

    J. Electrochemical Soc. Proc.   PV2000-29   185 - 196  2000.10  [Refereed]

  • Co-Ni-Fe write heads with a 10-mu m yoke length for high-speed recording

    Y Nonaka, H Honjo, T Toba, S Saito, T Ishi, M Saito, N Ishiwata, K Ohashi

    IEEE TRANSACTIONS ON MAGNETICS   36 ( 5 ) 2514 - 2516  2000.09  [Refereed]

     View Summary

    We have developed a Co-Ni-Fe write head with a short yoke length for high-speed recording. By reducing the yoke Length to 9.5 mum, the eddy currents induced in a yoke with a relatively low resistivity (0.2 mu Omegam) were reduced. The head of this short yoke had good write performance for a medium with a coercivity of 400 kA/m (5000 Oe) at frequencies up to 250 MHz (the overwrite less than -30 dB, and nonlinear transition shift less than 7%).

  • Purity of films and performance of recording heads

    K Ohashi, M Saito, H Honjo, T Toba, Y Nonaka, N Ishiwata

    ELECTROCHEMICAL TECHNOLOGY APPLICATIONS IN ELECTRONICS III   99 ( 34 ) 241 - 249  2000  [Refereed]

     View Summary

    The effect of impurities in CoNiFe films and the performance of CoNiFe pole heads were investigated. Electrodeposition of CoNiFe from a bath containing no sulfur-containing additives (SCAs) produced a pole material with excellent magnetic properties. CoNiFe pole heads generated a strong field of about 10 kOe in a recording medium. These heads did not experience large write instability because of the near-zero magnetostriction of the CoNiFe films. Besides producing good magnetic properties, removal of SCAs from the bath improved corrosion resistance. Moreover, annealing after deposition played an important role in controlling magnetic properties and corrosion resistance. Corrosion resistance was inferior if the film was deposited at a relatively low current density, even when a non-SCA bath was used. However, corrosion resistance of that film was improved by annealing. This improved corrosion resistance suggests that the imperfections associated with adsorption and evolution of hydrogen may play important roles in the corrosion mechanism.

  • Influence of crystalline structure and sulfur inclusion on corrosion properties of electrodeposited CoNiFe soft magnetic films

    T Osaka, M Takai, Y Sogawa, T Momma, K Ohashi, M Saito, K Yamada

    JOURNAL OF THE ELECTROCHEMICAL SOCIETY   146 ( 6 ) 2092 - 2096  1999.06  [Refereed]

     View Summary

    The corrosion resistance of soft magnetic films is an important property to be considered in the manufacture of magnetic devices. We investigated the corrosion behavior of the electrodeposited CoNiFe him with desired soft magnetic properties by varying the crystalline structure and the amount of included sulfur. The corrosion property in 2.5% NaCl solution depends largely on the sulfur content and also on the structure of the film. Although the CoNiFe film contains more than 13 atom % Fe, the film of face-centered to body-centered cubic mixed crystals exhibits a high anticorrosion property because of very small grain size with essentially no sulfur inclusion (&lt;0.1 atom %). (C) 1999 The Electrochemical Society. S0013-4651(98)07-027-X. All rights reserved.

  • Corrosion Properties for Electroplated CoNiFe Film with High Bs

    M.Saito

    J. Electrochemical Soc.   146   2845 - 2848  1999.04  [Refereed]

  • Effect of Operating Conditions on the Soft Magnetic Properties of Electrodeposited High-Bs CoNiFe Films

    Sogawa Y., Mizutani S., Momma T., Osaka T., Saito M., Ohashi K., Yamada K.

    Journal of the Magnetics Society of Japan   23 ( 4 ) 1405 - 1408  1999

     View Summary

    Electrodeposited CoNiFe soft magnetic films with high Bs were investigated for use as head core materials. It was found that a film consisting of an fcc phase structure with low Fe content has low magnetostriction of +2∼+6 × 10-6. When the film composition was fixed at Co62Ni12Fe26, the operating conditions for obtaining soft magnetic properties were optimized It was found that soft magnetic thin films composed of fine crystals 10-15 nm in diameter were obtained in conditions of low pH (< 3.0) and low current density (< 40 mAcm-2). In these operating conditions, a current efficiency of less than 80% with hydrogen evolution during the CoNiFe deposition was confirmed to be one of key factors for obtaining soft magnetic CoNiFe films with a suitably high Bs value. A typical Co62Ni12Fe26 film had the following properties. Bs=2.0 T, Hc=1.7 Oe, and λs=+4.9×10-6.

    DOI CiNii

  • New Soft Magnetic CoNiFe Plated Films with High Bs = 2.0-2.1 T

    Tetsuya Osaka, Madoka Takai, Katsuyoshi Hayashi, Yoshimichi Sogawa, Keishi Ohashi, Yoshihiko Yasue, Mikiko Saito, Kazuhiko Yamada

    IEEE Transactions on Magnetics   34 ( 4 ) 1432 - 1434  1998.07  [Refereed]

     View Summary

    A CoNiFe film with saturation magnetic flux density (Bs) greater than 2.0 tesla (T) has been prepared for the first time as a soft magnetic film; the coercivity (Hc) of the film is less than 160 A/m (2.0 Oe). This success was achieved by formulating a new plating bath and operating conditions to form fine grains. The film has a low Hc of less than 160 A/m, a low saturation magnetostriction (ls) of approximately 10-6, and a high Bs of 2.0-2.1 T. The present invention is expected to contribute to accelerating the development of not only the technology of high-density magnetic recording but also the field of magnetic materials in general.

    DOI

  • Newly developed inductive write head with electroplated CoNiFe film

    K Ohashi, Y Yasue, M Saito, K Yamada, T Osaka, M Takai, K Hayashi

    IEEE TRANSACTIONS ON MAGNETICS   34 ( 4 ) 1462 - 1464  1998.07  [Refereed]

     View Summary

    A newly developed CoNiFe film is investigated from the viewpoint of its application to MR write heads. Film composition is Co65Ni12Fe23, prepared by electroplating to obtain a b.c.c. plus f.c.c. mixed phase at that composition. Films with mixed phases improve soft magnetic properties (B-s is 2.0-2.1 T and the magnetostriction coefficient is +1.8x10(-6) to +7.4x10(-6)) and also show improved corrosion resistance. Performance of a head with a double layer structure of a 0.3 mu m CoNiFe film and a 4.1 mu m NiFe film is investigated, and a short throat height is found to give better overwrite performance.

  • Preparation for High Corrosion Resistance of High Bs CoNiFe Film with High Bs

    日本応用磁気学会学術講演会    1998.06

  • A soft magnetic CoNiFe film with high saturation magnetic flux density and low coercivity

    T Osaka, M Takai, K Hayashi, K Ohashi, M Saito, K Yamada

    NATURE   392 ( 6678 ) 796 - 798  1998.04  [Refereed]

     View Summary

    Magnetic materials are classed as 'soft' if they have a low coercivity (the critical field strength H-c required to flip the direction of magnetization). Soft magnetic materials are a central component of electromagnetic devices such as step motors, magnetic sensors, transformers and magnetic recording heads. Miniaturization of these devices requires materials that can develop higher saturation flux density, B-s, so that the necessary flux densities can be preserved on reducing device dimensions, while simultaneously achieving a low coercivity. Common high-B-s soft magnetic films currently in use are electroplated CoFe-based alloys(1-4), electroplated CoNiFe alloys(5-7), and sputtered Fe-based nanocrystalline(8-11) and FeN films(12-14). Sputtering is not suitable, however, for fabricating the thick films needed in some applications, for which electrochemical methods are preferred. Here we report the electrochemical preparation of a CoNiFe film with a very high value of B-s (2.0-2.1T) and a low coercivity. The favourable properties are achieved by avoiding the need for organic additives in the deposition process, which are typically used to reduce internal stresses. Our films also undergo very small magnetostriction, which is essential to ensure that they are not stressed when an external magnetic field is applied (or conversely, that external stresses do not disrupt the magnetic properties). Our material should find applications in miniaturization of electromechanical devices and in high-density magnetic data storage.

  • MRヘッドギャップ用アルミナ膜の検討

    M. Saito

    日本応用磁気学会学術講演会   22   257 - 260  1998  [Refereed]

  • Corrosion Evaluation of Exchange Biasing Films for MR-Heads

    M. Saito

    J. Electrochemical Soc. Proc.   PV95-11   361 - 369  1995.06  [Refereed]

  • 熱硬化フォトレジスト膜の電気、機械特性評価

    齋藤美紀子

    日本応用磁気学会誌   19   141 - 144  1995.01  [Refereed]

  • Electrodeposition of Gold Electrode on Silicon Wafers

    Mikiko Saito

    2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings    [Refereed]

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Misc

  • B-1-4 Moleular Vibrational Analysis for Magnetic Disk Lubircants with Molecular Orbital Calculation

    YANAGISAWA Masahiro, SAITO Mikiko, HOMMA Takayuki

    Conference on Information, Intelligence and Precision Equipment : IIP   2011   266 - 267  2011.03

     View Summary

    Raman spectroscopy is effective tool for determining molecular structures of lubricants as well as DLC crystal structures for hard disk media. However, the spectrum of lubricant is so complicated that it is difficult to assign the peaks. We calculated Raman spectra of the phosphazene-modified perfluoropolyether (A20H) by molecular orbital method. The calculation could assign the spectrum peaks. Every molecule vibration is visually shown so that Raman peaks are identified. We compared the calculated spectrum with the experimental spectrum. Calculated Raman spectrum shows good agreement with that of the experiment.

    CiNii

  • 磁気ディスク用潤滑剤のSERS解析

    柳沢雅広, 齋藤美紀子, 杉山敦, 本間敬之, 逢坂哲彌

    日本トライボロジー学会トライボロジー会議予稿集   2010-5  2010

    J-GLOBAL

  • プラズモンアンテナ型分子センサを用いた磁気ディスク用潤滑剤の解析

    柳沢雅広, 島本直伸, 会田敏之, 齋藤美紀子, 杉山敦, 吉野正洋, 逢坂哲彌

    日本トライボロジー学会トライボロジー会議予稿集   2009-5  2009

    J-GLOBAL

  • 人工ホットスポットを用いたSAM膜のラマン検出

    柳沢雅広, 島本直伸, 中西卓也, 齋藤美紀子, 逢坂哲彌, 上野太郎, 船津高志

    応用物理学関係連合講演会講演予稿集   55th ( 3 )  2008

    J-GLOBAL

  • 同心円プラズモンアンテナ型分子センサーの設計と表面増強ラマン散乱による分子の検出

    柳沢雅広, 中西卓也, 梶浦真由紀, 島本直伸, 齋藤美紀子, 会田敏之, 加藤邦男, 逢坂哲彌

    表面科学学術講演会講演要旨集   28th  2008

    J-GLOBAL

  • Development of high density recording heads with Co-Ni-Fe plated films

    Ishiwata N, Nonaka Y, Honjo H, Toba T, Saito S, Saito M, Ishi T, Ohashi K

    Proceedings of the IEICE General Conference   2001 ( 2 )  2001.03

    CiNii

  • Corrosion properties of electroplated CoBiFe films (vol 146, pg 1845, 1999)

    M Saito, K Yamada, K Ohashi, Y Yasue, Y Sogawa, T Osaka

    JOURNAL OF THE ELECTROCHEMICAL SOCIETY   147 ( 11 ) 4389 - 4389  2000.11

    Other  

  • Write heads with high B_s pole material : Co-Ni-Fe write heads with small core for high-speed recording

    ISHI T, NONAKA Y, HONJO H, TOBA T, SAITO S, SAITO M, SUZUKI F, ISHIWATA N, OHASHI K

    日本応用磁気学会学術講演概要集 = Digest of ... annual conference on magnetics in Japan   24   160a - 160b  2000.09

    CiNii

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Industrial Property Rights

  • ラマン分光測定装置及びラマン分光測定方法

    柳沢 雅広, 本間 敬之, 齋藤 美紀子

    Patent

  • 成膜基板、基板、およびそれらの製造方法

    本間 敬之, 齋藤 美紀子

    Patent

  • 光学デバイス及びその製造方法

    本間 敬之, 柳沢 雅広, 齋藤 美紀子

    Patent

  • 銅材の接合方法

    6347385

    水野 潤, 齋藤 美紀子

    Patent

  • 光学デバイスおよび分析装置

    本間 敬之, 柳沢 雅広, 齋藤 美紀子

    Patent

  • 光学デバイスおよび分析装置

    本間 敬之, 柳沢 雅広, 齋藤 美紀子

    Patent

  • めっき装置及びこれを用いたセンサ装置

    6226229

    本間 敬之, 柳沢 雅広, 齋藤 美紀子, 山本 智之

    Patent

  • インターポーザー基板の製造方法。

    6216522

    齋藤 美紀子

    Patent

  • 光学デバイスおよび分析装置

    6179905

    本間 敬之, 柳沢 雅広, 齋藤 美紀子

    Patent

  • 金属微粒子の製造方法、及び製造装置

    6004643

    本間 敬之, 齋藤 美紀子

    Patent

  • 金属微粒子の製造方法

    5566794

    本間 敬之, 齋藤 美紀子

    Patent

  • 金型製造装置

    本間 敬之, 齋藤 美紀子

    Patent

  • 金型製造方法およびその方法により形成された金型

    5665169

    本間 敬之, 齋藤 美紀子

    Patent

  • 電界効果型トランジスタおよび集積回路

    5648812

    川原田 洋, 水野 潤, 関口 哲志, 齋藤 美紀子

    Patent

  • 光学的センサー

    5083781

    中西 卓也, 逢坂 哲彌, 柳沢 雅広, 島本 直伸, 齋藤 美紀子

    Patent

  • 電極、金属微粒子の製造装置および金属微粒子の製造方法

    5064724

    齋藤 美紀子, 水野 潤, 本間 敬之

    Patent

  • めっき液、めっき膜およびその作製方法

    4712439

    齋藤 美紀子

    Patent

  • ナノ構造体の製造方法

    4762577

    本間 敬之, 齋藤 美紀子

    Patent

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Awards

  • (社)表面技術協会 平成18年度技術賞受賞

    2006.02  

Research Projects

  • Study on operand observation and analysis of buried interface on tribology

    Project Year :

    2018.04
    -
    2023.03
     

  • Low-temperature bonding using nanostructure on material surface

    Project Year :

    2019.04
    -
    2022.03
     

  • Study of plate-laminated diffusion-bonding waveguide-type highly functional planar antennas in milli-meter to terahertz bands

    Project Year :

    2017.04
    -
    2020.03
     

  • ナノポーラス構造を用いた焼結型高耐熱接合技術の深堀

    Project Year :

    2016.04
    -
    2019.03
     

  • Study on chemical structures at surface and interface of ultra-thin overcoat/lubricant films for magnetic disks with ultrahigh recording density

    Project Year :

    2014.04
    -
    2019.03
     

     View Summary

    We developed novel measurement technologies which analyze chemical structures of ultra-thin films and their interfaces with a resolution of 0.1nm using plasmonic sensor. Major application is magnetic disk with ultra-high density recording, particularly, for a heat assisted magnetic recording. The developed technology can analyze wear resisting, heat resisting, corrosion resisting properties of thin films as well, its application can extend over a lot of academic or industrial field, i.e. tribology, adhesion, corrosion, catalysis, automobile, plane, storage devices, semiconductor devices, batteries, biology, medical care, and so on

  • Electrochemical processing of initial nucleation control for large scale energy storage devices

    Project Year :

    2013.04
    -
    2016.03
     

     View Summary

    It is indispensable for the development of large scale advanced energy storage devices to control the surface nanostructures of the electrode during charging and discharging operations. In this work, analysis and modeling of the electrodeposition process were carried out from experimental and theoretical approaches to establish the precise methodology to analyze and control the process from single grain nucleation level. As for the electrode material for the large scale energy storage devices, potentiostatic electrodeposition of Zn electrode was conducted in aqueous alkaline solution, and the morphology evolution process, such as formation of mossy structures, is investigated in detail to elucidate its formation mechanism

  • Development of in-situ Electrochemical Imaging Plate for Interfacial Reaction and Its Application to Estimation of Residual Lifetime of Metallic Materials

    Project Year :

    2013.04
    -
    2016.03
     

     View Summary

    A 16x16ch Au multielectrode array with a diameter of 10 um and an inter-electrode distance of 100 um was fabricated. Electrochemical measurements using a made-to-order 64 ch multichannel potentiostat revealed that all microelectrodes operated as an individual microelectrode, although their properties varied widely. Polarization of 8x8ch microelectrodes in the array showed an interference of diffusion layer formed on the microelectrodes. The interference was also successfully simulated with a FEM numerical modeling of three-dimensional diffusion problem. The degree of interference during the dynamic polarization of the array could be normalized by the geometry of microelectrode diameter and inter-electrode distance

  • 3次元ナノポーラス構造を利用した低温焼結型微細接合技術の確立

    科学研究費助成事業(大阪大学)  科学研究費助成事業(基盤研究(B))

    Project Year :

    2013
    -
    2015
     

     View Summary

    本年度は「低温焼結型接合に適したナノポーラス材料の確立」を目指して、Au-Ag二元系合金から作製可能な安定性の高いAuナノポーラス構造に注目し、鋳造法及びめっき法を用いてAu-Ag二元系合金を作製し、Auナノポーラス構造の作製をおこなうとともに、Auナノポーラス構造を用いた接合を試みた。その結果、具体的には以下のような結果を研究の成果を得た。
    鋳造法を用いたAu-Ag二元系合金では、Au-50mass% Agを作製し、選択溶解によりAuナノポーラス構造の作製を試みた結果、溶解時間や溶液濃度、溶液温度を変えることでナノポーラス構造を変化せることが可能であることを明確にし、10nm以下のリガメントサイズを持つAuナノポーラス構造の作製に成功した。さらに作製したナノポーラス構造を用いて、Cu/CuやAuめっき/Auめっきの接合実験を実施し、接合強度を評価したところ、25 MPa以上のせん断強度を得ることが可能であることが明確になった。
    まためっき法を用い検討についても、Au-Ag合金膜を作製し、選択溶解から得られるAuナノポーラス構造の作製検討や粒子の形態制御の検討を進めた。特にチオ尿素を錯化剤として用いたAu-Agを含む溶液の最適電解析出条件の検討を進め、約20 nmの粒サイズのAuナノーポーラス構造の作製に成功した。また、選択溶解前に熱処理を行い、その後に選択溶解を行うことにより、さらに微細な5 nmのナノホールの形成を確認した。鋳造法及びめっき法、それぞれで得られた結果については、ESTC2014(5th Electronics System-Integration Technology Conference、2014.09.16)で発表予定である。
    平成26年度以降に計画している表面活性化を使った低温接合実験の前準備として、Auナノポーラスシート構造から粉末状構造を作り、Au-Au同士で200℃以下の低温焼結接合に成功した。今年度、購入した低温・ドライ還元装置を立ち上げて実験評価も順調に行っている。

  • Development of in-situ analysis method for solid-liquid interfaces with ultra-high resolution using plasmon antenna sensors

    Project Year :

    2011
    -
    2013
     

     View Summary

    A molecular analysis system at liquid/solid interface utilizing Surface-enhanced Raman Scattering (SERS) was developed using two kinds of plasmonic sensors, a concentric-circled groove type and transparent substrate with nano-particles made of Au, Ag, and Cu. For application examples, adsorption behavior of hydrazine and hypophosphate as a reducing agent at the Cu/liquid interface in the atomistic level. The decomposition reaction with an electric field for Janus Green B (JGB) as a deposition inhibitor was observed at Au/liquid interface. Molecular structure of lubricant molecules on a Diamond-Like Carbon (DLC) film for hard disk media was successfully measured in the depth resolution of 0.1 nm.

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Presentations

  • Metal Deposition using Solution on High-Density and Well-Aligned CNTs

    M. Saito, H. Kuwae, W. Norimatsu, M. Kusunoki, J. Mizuno, S. Koga, H. Nishikawa

    2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020 

    Presentation date: 2020.09

  • Investigation of preparation for Mn-Bi using electrodeposition

    M. Saito, R. Y. Umetsu

    iLIM-4 

    Presentation date: 2019.10

  • An Investigation of the Corrosion Behavior of Dealloyed Au-Ag Electrodeposited Films

    M. Saito, J. Mizuno, H. Nishikawa

    Presentation date: 2019.10

  • Fabrication and characterization of nanoporous copper through chemical dealloying of cold rolled Mn 70 Cu 30 alloy

    Byungho Park, Mikiko Saito, Jun Mizuno, Hiroshi Nishikawa

    iLIM-4 

    Presentation date: 2019.10

  • Solid-state bonding using Cu nanoporous sheet for high-temperature applications

    S. Koga, M. Saito, J. Mizuno, H. Nishikawa

    iLIM-3 

    Presentation date: 2018.09

  • Evaluation of Dealloying Property for Electrodeposited Au-Ag film

    M. Saito, J. Mizuno, S. Koga, H. Nishikawa

    The 3rd International Symposium on Creation of Life Innovation Materials for Interdisciplinary and International Researcher Development 

    Presentation date: 2018.09

  • Investigation of Preparation for Mn-Bi using Electrodeposition and Their Properties

    M. Saito, R. Y. Umetsu

    The 3rd International Symposium on Creation of Life Innovation Materials for Interdisciplinary and International Researcher Development 

    Presentation date: 2018.09

  • Control for Au-Ag Nanoporous Structure by Electrodeposition and Dealloying

    Mikiko Saito, Jun Mizuno, Shunichi Koga, Hiroshi Nishikawa

    7th Electronics System-Integration Conference 

    Presentation date: 2018.09

  • Electrodeposition of Gold Electrode on Silicon Wafers for Submillimeter-wave Devices

    Mikiko Saito, Hiroyuki SETO, Yoshiyuki INOUE, Jiro HIROKAWA

    7th Electronics System-Integration Conference 

    Presentation date: 2018.09

  • Effect of Supporting Electrolyte on Electrochemical Production of Cu Nanoparticles

    Mikiko Saito, Tomohiro Ishii, Hidemichi Fujiwara, Takayuki Homma

    22nd Topical Meeting of the International Society of Electrochemistry 

    Presentation date: 2018.04

  • Effect of Cu Addition and Annealing on Electrodeposited Bi-Te Films for Micro Thermoelectric Devices

    M. Sugie, D. Furuyama, M. Saito, Y. Sonobe, H. Takahashi, I. Terasaki, T. Homma

    232nd Meeting of the Electrochemical Soc. 

    Presentation date: 2017.10

  • Nanoporous Electrode Formed by Electrodeposition and Dealloying on Aligned CNT Films

    Mikiko Saito, Jun Mizuno, Hiroshi Nishikawa, Michiko Kusunoki

    iLIM-2 

    Presentation date: 2017.09

  • Investigation of Preparation for Mn-Bi using Electrodeposition and Their Magnetic Properties

    Mikiko Saito, R. Y. Umetsu

    iLIM-2 

    Presentation date: 2017.09

  • 電析と選択溶解を用いたAu-Agナノポーラス構造制御

    齋藤美紀子, 古賀俊一, 水野 潤, 西川 宏

    2017年電気化学秋季大会 

    Presentation date: 2017.09

  • 酢酸浴によるZnOの電析条件の検討と熱電変換素子への応用

    吉徳光一朗, 松尾日向子, 斎藤美紀子, 本間敬之

    表面技術協会第136回講演大会 

    Presentation date: 2017.09

  • Formation of Nanoporous Electrode on Aligned CNT Films using Dealloying

    Mikiko Saito, Jun Mizuno, Michiko Kusunoki, Hiroshi Nishikawa

    230th Meeting of the Electrochemical Soc., PRiME2016 

    Presentation date: 2016.10

  • 金属ナノ粒子の電解生成反応過程および添加剤PVPの挙動の検討

    齋藤美紀子, 石井智紘, 藤原英道, 本間敬之

    表面技術協会第116回講演大会 

    Presentation date: 2016.03

  • Preparation of Transparent Plasmon Sensors by the Sol-Gel Process and Electrodeposition

    M. Saito, M. Mita, M. Yanagisawa, T. Homma

    228th Meeting of the Electrochemical Soc. 

    Presentation date: 2015.10

  • ゾルゲル法と電気化学析出法による透過型プラズモンセンサの作製

    齋藤美紀子, 三田正弘, 柳沢雅広, 本間敬之

    表面技術協会第131回講演大会 

    Presentation date: 2015.03

  • Nano-porous Structure Control under Electrodeposition and Dealloying Conditions

    M. Saito, K. Matsunaga, J. Mizuno, H. Nishikawa

    The 5th International Symposium on Advanced Materials Development and Integration of Novel Structured Metallic and Inorganic Materials 

    Presentation date: 2014.11

  • Electrodeposition on High-density and Well-aligned Carbon Nanotubes Formed by Surface Decomposition of SiC

    M. Saito, M. Kusunoki, T. Homma, H. Kawarada

    The 5th International Symposium on Advanced Materials Development and Integration of Novel Structered Metallic and Inorganic Materialsl 

    Presentation date: 2014.11

  • Relationship between bonding conditions and shear strength on joints using Au nanoporous sheet

    K. Matsunaga, Min-Su Kim, H. Nishikawa, M. Saito, J. Mizuno

    5th Electronics System-Integration Technology Conference 

    Presentation date: 2014.09

  • Nanoporous Structure Control by Electrodeposition and Dealloying Conditions and Evaluation of Bond Strength

    Mikiko Saito, Kaori Matsunaga, Jun Mizuno, Hiroshi Nishikawa

    7th Electronics System-Integration Conference 

    Presentation date: 2014.09

  • Effect of Organic Additives on Electrochemical Reduction Assessment using SERS Analysis

    M. Saito, T. Ishii, H. Fujiwara, M. Yanagisawa, T. Homma

    224th Meeting of the Electrochemical Soc. 

    Presentation date: 2013.10

  • 高アスペクト比ビアにおけるCuめっきの初期成長に関する微量Sn添加の影響評価

    赤澤 美雪, 藤本 興治, 倉持 悟, 鈴木 浩助, 齋藤 美紀子

    第 27回エレクトロニクス実装学会 

    Presentation date: 2013.03

  • p 型Bi-Te 系薄膜の電析および熱電変換素子の作製

    宇田和布, 関佑太, 齋藤美紀子, 園部義明, 謝育秦, 高橋英史, 寺崎一郎, 本間敬之

    2013年応用物理学会春季講演会 

    Presentation date: 2013.03

  • めっきプロセスにおけるナノレベルの膜構造精密制御

    本間敬之, 齋藤美紀子

    Mate2013 

    Presentation date: 2013.01

  • 電解還元による金属ナノ粒子の合成

    石井智紘, 齋藤美紀子, 藤原英道, 本間敬之

    表面技術協会第126回講演大会 

    Presentation date: 2012.09

  • 金属電解還元金属ナノ粒子合成における有機添加剤の挙動解析

    齋藤美紀子, 石井智紘, 藤原英道, 本間敬之

    表面技術協会第126回講演大会 

    Presentation date: 2012.09

  • 金属ナノ粒子電解生成における微細構造制御

    齋藤美紀子, 石井智紘, 藤原英道, 本間敬之

    2012年電気化学会第79回大会 

    Presentation date: 2012

  • Effect of the Properties of Electroplated Sn-Cu Films on the Formation of Sn whiskers

    M. Saito, T. Homma

    he 3rd International Symposium on Advanced Materials Development and Integration of Novel Structural Metallic and Inorganic Materials 

    Presentation date: 2012

  • Wetting Behavior of Water and Oil for Plated Films with Fine Structure

    M. Saito, T. Homma

    The 3rd International Symposium on Advanced Materials Development and Integration of Novel Structural Metallic and Inorganic Materials 

    Presentation date: 2012

  • 表面構造及び添加剤によるめっき膜濡れ性制御

    齋藤美紀子, 山田英佐夫, 加藤邦男, 山下武夫, 竹内輝明, 本間敬之

    表面技術協会第124回講演大会 

    Presentation date: 2011.09

  • Investigation on the Hardness and Morphology of Be-Cu for Probing Al Layers

    M. Saito, G. Kimoto, T. Homma

    218th Meeting of the Electrochemical Soc. 

    Presentation date: 2010.10

  • 電解法による金属ナノ粒子の作製と形態および構造解析

    齋藤美紀子, 石井智紘, 西久保英郎, 藤原英道, 本間敬之

    2010年電気化学秋季大会 

    Presentation date: 2010

  • ナノインプリント法を用いたプラズモンアンテナ型分子センサの作製

    齋藤美紀子, 竹内輝明, 柳沢雅広, 伊藤亮冶, 高須良三, 片岡祐治, 本間 敬之

    表面技術協会第122回講演大会 

    Presentation date: 2010

  • Preparation of Metal Nano-particles using Electrochemical Deposition

    M. Saito, J. Mizuno, T. Homma

    Presentation date: 2010

  • Effect of Tl-codeposition on Au Electrodeposition from Non-Cyanide Bath

    M. Saito, K. Inoue, K. Shiokawa, T. Homma

    216th Meeting of the Electrochemical Soc. 

    Presentation date: 2009.10

  • Electrochemical Synthesis of Metal Nano Particles Using Electrodeposited Pt Electrode with Nano Patterned Surface

    H. Nishikubo, H. Fujiwara, M. Saito, J. Mizuno, T. Homma

    214th Meeting of the Electrochemical Soc. 

    Presentation date: 2008.10

  • Preparation of Electroplated Pt Nano Patterend Electrode using Nano Imprinting Lithography

    M. Saito, J. Mizuno, H. Nishikubo, H. Fujiwara, T. Homma

    Presentation date: 2008.10

  • めっきPtナノ電極による金属ナノ粒子の生成

    西久保英郎, 藤原英道, 齋藤美紀子, 水野潤, 本間敬之

    表面技術協会第117回講演大会 

    Presentation date: 2008.03

  • UV-ナノインプリント(UV-NIL)を用いためっきPtナノ電極の形成

    齋藤美紀子, 水野潤, 西久保英郎, 藤原英道, 本間敬之

    表面技術協会第117回講演大会 

    Presentation date: 2008.03

  • Al合金膜のジンケ−ト処理プロセスにおける表面電位と膜成長との関係

    齋藤美紀子, 前川武之, 本間敬之

    第114回表面技術講演大会 

    Presentation date: 2006.10

  • Al合金膜のジンケート処理プロセスにおける表面電位と膜成長との関係

    齋藤美紀子, 前川武之, 本間敬之

    表面技術協会第114回講演大会 

    Presentation date: 2006.10

  • Effect of Seed layers on the Internal Stress of Electroplated Sn-Cu Films

    H. Sasaki, K. Katou, T. Toba, M. Saito, Y. Wada, T. Homma

    209th Meeting of the Electrochemical Soc. 

    Presentation date: 2006.05

  • SnCu合金めっき膜における膜内部応力と結晶構造

    佐々木弘幸, 加藤邦男, 齋藤美紀子, 和田恭雄, 本間敬之

    第112回表面技術講演大会 

    Presentation date: 2005.10

  • Study of Internal Stress and Crystal size of Electroplated Sn-Cu alloy Films

    H. Sasaki, K. Katou, M. Saito, Y. Wada, T. Homma

    207th Meeting of the Electrochemical Soc. 

    Presentation date: 2005.05

  • Preparation of Nano-structured CoCu Films by Electrodeposition

    M. Saito, H. Fujiwara, J. Mizuno, T. Homma

    207th Meeting of the Electrochemical Soc. 

    Presentation date: 2005.05

  • ナノレベルのめっき法を用いた磁気ヘッドの作製

    齋藤美紀子

    Nano Fandries Group Workshop 2005 

    Presentation date: 2005

  • Fabrication of SERS-Active Substrate Using Electrodeposited Silver Thin Film with Nanoscale Dendrites

    Mikiko Saito, Masahiro Yanagisawa, Masahide Tokuda, Yasuo Wada, Takayuki Homma

    206th Meeting of the Electrochemical Soc. 

    Presentation date: 2004.10

  • 電気銅めっき膜の内部応力に及ぼすめっき条件の影響

    第110回表面技術講演大会 

    Presentation date: 2004.09

  • STUDY ON NANO-SIZE ELECTROPLATED Au FILM FOR SINGLE MOLECULE ELECTRONICS

    Mikiko Saito, Toshiko Koizumi, Ken Tsutsui, Jun Mizuno, Tomohiko EHarumasa Onozato, Yasuo Wada, Takayuki Homma, Masamitsu Haemori

    205th Meeting of the Electrochemical Soc. 

    Presentation date: 2004.05

  • Study on Nano-size Electroplated Au Film for Single Molecule Electronics

    M. Saito, T. Koizumi, K. Tsutsui, J. Mizuno, T. Edura, M. Tokuda, H. Onozato, Y. Wada, T. Homma, M. Haemori, H. Koinuma

    205th Meeting of the Electrochemical Soc. 

    Presentation date: 2004

  • Electrochemical Analysis of Zincate Treatments for Al and Al Alloy Films for Under Bump Metal Formation

    M. Saito, T. Maegawa, T. Homma

    5th International Symposium on Electrochemical Micro and Nanosystem Technologies 

    Presentation date: 2004

  • ナノレベルの平滑めっき膜の検討

    齋藤美紀子, 南風盛将光, 小泉寿子, 筒井謙, 水野潤, 江面知彦, 徳田正秀, 小野里陽正, 鯉沼秀臣, 和田恭雄

    電気学会、平成15年電子情報システム部門大会 

    Presentation date: 2003

  • Electrodeposition Conditions of CoNiFe Films Crystal Structure and Evaluation of Magnetic Moments

    M. Saito, K. Ohashi

    202th Meeting of the Electrochemical Soc. 

    Presentation date: 2002.10

  • 高磁気モーメント電析CoNiFe

    表面技術協会、表面物性研究会 

    Presentation date: 2001.10

  • CoNiFeめっき膜の高飽和磁化の要因検討

    表面技術協会第103回講演大会 

    Presentation date: 2001.03

  • The Effect of Preparation Conditions on Magnetic Properties of Electroplated high-Bs CoNiFe Films

    M. Saito, N. Ishiwata, K. Ohashi

    198th Meeting of the Electrochemical Soc. 

    Presentation date: 2000.10

  • 層間絶縁用熱硬化フォトレジスト膜のリーク電流評価

    応用物理学会学術講演会 

    Presentation date: 1998.06

  • Preparation for High Corrosion Resistance of High Bs CoNiFe Film with High Bs

    齋藤 美紀子

    第22回日本応用磁気学会学術講演会 

    Presentation date: 1998

  • MRヘッドギャップ用アルミナ膜の検討

    齋藤 美紀子

    日本応用磁気学会学術講演会 

    Presentation date: 1997

  • Corrosion Evaluation of Exchange Biasing Films for MR-Heads”, 187th Meeting of the Electrochemical Soc.

    M. Saito, K. Yamada, K. Matsumura

    187th Meeting of the Electrochemical Soc. 

    Presentation date: 1995

  • Ni被覆ガラススタンパを用いた2P成形基板の諸特性

    Presentation date: 1992.03

  • 2P/エポキシ基板を型とするゾルゲル転写プロセス

    応用物理学会学術講演会 

    Presentation date: 1990.03

  • FPD駆動用64回路高耐圧NMOSIC

    齋藤 美紀子, 若海弘夫, 相沢 孝, 佐久間 啓

    昭和60年度電子通信学会半導体・材料部門全国大会 

    Presentation date: 1985.11

  • ジンケート処理におけるZn置換析出状態に対するAl合金膜とSi基板の接触電位差の影響

    齋藤美紀子, 前川武之, 本間敬之

    表面技術協会第116回講演大会 

  • ナノスケール電極による短チャンネル有機トランジスタの検討

    高橋宏昌, 江面知彦, 筒井 謙, 齋藤美紀子, 水野 潤, 徳田正秀, 小野里陽正, 南風盛将光, 鯉沼秀臣, 和田恭雄, 長妻一之, 加藤邦男, 小泉寿子

    第65回応用物理学会 

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